The XC3S400AN-FGG400AGQ is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for cost-sensitive applications. This automotive-grade FPGA combines advanced programmable logic with integrated flash memory, making it an ideal choice for automotive, industrial, and consumer electronics applications.
Product Specifications
Core Features of XC3S400AN-FGG400AGQ
Logic Capacity:
- 400,000 system gates
- 8,064 logic cells
- 504 CLB slices
- 56 dedicated multipliers (18×18)
Memory Architecture:
- 360 Kbits of block RAM
- Integrated 4 Mbit Platform Flash for configuration storage
- Distributed RAM capability
I/O Configuration:
- 264 user I/O pins
- FGG400 Fine-pitch Ball Grid Array package
- Multiple I/O standards support including LVDS, SSTL, and HSTL
- Differential signaling capabilities
Performance Specifications:
- Operating frequency up to 320 MHz
- Low power consumption with multiple power management modes
- Automotive temperature range: -40ยฐC to +125ยฐC
- Supply voltage: 1.2V core, 2.5V/3.3V I/O
Package Details:
- 400-pin Fine-pitch Ball Grid Array (FGG400)
- 17mm x 17mm package size
- Lead-free and RoHS compliant
- Automotive qualification (AEC-Q100)
Pricing Information
The XC3S400AN-FGG400AGQ pricing varies based on quantity and distribution channel. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Educational and development pricing may also be available through selected partners.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications for XC3S400AN-FGG400AGQ
- User Guide: Spartan-3AN FPGA Family Complete User Guide
- Package Information: FGG400 package pinout and mechanical drawings
- Application Notes: Design implementation guidelines and best practices
Design Resources
- Development Tools: Compatible with Xilinx ISE Design Suite and Vivado
- Reference Designs: Example implementations and starter projects
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- Configuration Files: Bitstream generation and programming guidelines
Multimedia Resources
- Product overview videos and webinars
- Technical presentation slides
- Interactive package viewer
- 3D mechanical models for PCB design
Related Resources
Development Boards
- Spartan-3AN Starter Kit featuring XC3S400AN-FGG400AGQ
- Evaluation boards for rapid prototyping
- Third-party development platforms
Compatible Products
- XC3S200AN-FGG400AGQ: Lower-density option in same package
- XC3S700AN-FGG400AGQ: Higher-density alternative
- Configuration PROMs and flash memory devices
- Power management ICs optimized for Spartan-3AN
Software Tools
- Xilinx ISE WebPACK: Free development environment
- ChipScope Pro: Integrated logic analyzer
- EDK (Embedded Development Kit): For embedded processor designs
- Third-party synthesis and simulation tools
Technical Support
- Xilinx online support forums and knowledge base
- Application engineering support
- Training courses and certification programs
- Community-driven resources and design examples
Environmental & Export Classifications
Environmental Compliance
The XC3S400AN-FGG400AGQ meets stringent environmental and safety standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- Green Product: Meets Xilinx environmental sustainability criteria
Automotive Qualifications
- AEC-Q100 Grade 2: Qualified for automotive applications
- Temperature Range: -40ยฐC to +125ยฐC ambient operating temperature
- Reliability Testing: HTOL, TC, HTS, and other automotive stress tests
- Quality Management: ISO/TS 16949 certified manufacturing
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- CCATS: Available upon request for export licensing
- Country of Origin: Manufactured in approved facilities
Packaging and Shipping
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 2 (>2000V HBM, >200V MM)
- Packaging Options: Tape and reel for automated assembly
- Lead Time: Standard 8-12 weeks, expedited options available
The XC3S400AN-FGG400AGQ represents an excellent balance of performance, integration, and cost-effectiveness for demanding applications requiring automotive-grade reliability and advanced FPGA capabilities.
