The XC2S150-5FGG256C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-IIE family, designed to deliver exceptional performance for demanding digital applications. This versatile programmable logic device combines high gate density with cost-effective implementation, making it ideal for telecommunications, industrial automation, and embedded system designs.
Product Specifications
The XC2S150-5FGG256C features robust technical specifications that make it suitable for complex digital designs:
Core Architecture:
- Logic cells: 1,728 configurable logic blocks
- System gates: 150,000 equivalent gates
- Distributed RAM: 28 Kbits
- Block RAM: 76 Kbits total capacity
- Input/Output pins: 173 user I/O pins
Performance Characteristics:
- Speed grade: -5 (high-performance variant)
- Maximum frequency: Up to 200 MHz
- Propagation delay: 4.2ns typical
- Power consumption: Optimized for low-power applications
Package Details:
- Package type: Fine-pitch Ball Grid Array (FBGA)
- Pin count: 256 pins
- Package size: 17mm x 17mm
- Lead-free RoHS compliant construction
Memory Configuration:
- Embedded memory blocks: 4 dedicated RAM blocks
- Memory configuration flexibility: Single-port or dual-port operation
- On-chip memory: 104 Kbits total embedded memory
Pricing Information
The XC2S150-5FGG256C is competitively priced for volume applications. Pricing varies based on order quantity and current market conditions. For the most current pricing information and volume discounts on the XC2S150-5FGG256C, please contact authorized Xilinx distributors or sales representatives. Educational and development discounts may be available for qualifying institutions and projects.
Documentation & Media Resources
Comprehensive technical documentation supports the XC2S150-5FGG256C implementation:
Technical Documentation:
- Complete datasheet with electrical specifications
- Spartan-IIE family user guide and reference manual
- Package thermal characteristics and mechanical drawings
- Pin-out diagrams and ball assignment documentation
Development Resources:
- ISE Design Suite compatibility information
- Constraint files and design examples
- Application notes for common implementation scenarios
- Timing analysis guidelines and optimization techniques
Support Materials:
- Evaluation board schematics and layouts
- PCB design guidelines for the 256-pin FBGA package
- Soldering and assembly recommendations
- Thermal management application notes
Related Resources & Compatible Products
The XC2S150-5FGG256C integrates seamlessly with various development tools and complementary components:
Development Platforms:
- Spartan-IIE evaluation boards and starter kits
- Compatible with Xilinx ISE development environment
- Third-party development board support
- Programming cable and JTAG interface compatibility
Complementary Devices:
- Other Spartan-IIE family members for scalable designs
- Configuration memory devices (Platform Flash)
- Clock management and distribution components
- Interface and connectivity solutions
Software Tools:
- ISE WebPACK (free development software)
- ModelSim simulation environment support
- Synthesis tool compatibility (XST, Synplify)
- Place and route optimization tools
Environmental & Export Classifications
The XC2S150-5FGG256C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant lead-free construction
- Operating temperature range: 0ยฐC to +85ยฐC commercial grade
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 85% non-condensing
- ESD protection: Human Body Model Class 2
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- JEDEC standard compliance for reliability testing
- Automotive grade versions available (contact for specifications)
- Extended temperature variants for industrial applications
Export Classifications:
- ECCN (Export Control Classification Number): EAR99
- No export license required for most destinations
- Standard commercial export classification
- Compliance with international trade regulations
Packaging & Handling:
- Moisture sensitivity level: MSL-3
- Anti-static packaging for component protection
- Tape and reel packaging available for automated assembly
- Dry pack shipping for moisture-sensitive handling
The XC2S150-5FGG256C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs requiring substantial logic resources and flexible I/O capabilities. Its proven Spartan-IIE architecture and comprehensive development ecosystem make it an ideal choice for both prototype development and volume production applications.
