Product Specifications
Core Architecture
The XC5VLX30-1FFGV676C features a sophisticated architecture built on Xilinx’s proven Virtex-5 platform. This FPGA incorporates 30,720 logic cells with advanced 6-input lookup tables (LUTs) that provide superior logic density and performance compared to traditional 4-input LUT architectures.
Logic Resources
- Logic Cells: 30,720 configurable logic blocks
- CLB Slices: 4,800 slices for maximum design flexibility
- Distributed RAM: 240 Kb of distributed memory
- Block RAM: 1,152 Kb of dedicated block memory organized in 36Kb blocks
- DSP48E Slices: 32 dedicated digital signal processing blocks
Memory and Processing
The XC5VLX30-1FFGV676C integrates substantial memory resources including both distributed and block RAM configurations. The 32 DSP48E slices enable efficient implementation of complex mathematical operations, making this FPGA ideal for signal processing applications requiring high-speed multiplication, accumulation, and filtering operations.
Package and I/O Configuration
- Package Type: FFGV676 – Fine-pitch Ball Grid Array
- Pin Count: 676 pins for comprehensive connectivity
- User I/O Pins: 400 user-configurable I/O pins
- Speed Grade: -1 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC
Performance Characteristics
- Maximum Operating Frequency: Up to 550 MHz for internal logic
- Power Consumption: Optimized for low-power operation with advanced power management
- Configuration Time: Fast configuration through multiple interfaces
- Voltage Requirements: Multiple voltage domains (1.0V core, 2.5V/3.3V I/O)
Price Information
The XC5VLX30-1FFGV676C pricing varies based on quantity, distribution channel, and current market conditions. For the most competitive pricing on the XC5VLX30-1FFGV676C, we recommend contacting authorized Xilinx distributors or electronic component suppliers. Volume discounts are typically available for quantities exceeding 100 units.
Pricing Considerations:
- Single unit pricing ranges from $200-400 depending on supplier
- Volume pricing available for orders of 25+ units
- Long-term availability contracts offered for production quantities
- Educational discounts may apply for academic institutions
Contact our sales team for current XC5VLX30-1FFGV676C pricing and availability information tailored to your specific requirements.
Documents & Media
Technical Documentation
Comprehensive documentation is available for the XC5VLX30-1FFGV676C to support design and implementation:
Datasheets and Specifications:
- Virtex-5 LX Data Sheet (DS202) – Complete electrical and timing specifications
- XC5VLX30-1FFGV676C Product Brief – Key features and applications overview
- Package and Pinout Information – Detailed pin assignments and mechanical drawings
Design Resources:
- Virtex-5 FPGA User Guide – Comprehensive architecture and design guidance
- Configuration User Guide – Programming and configuration procedures
- Power Estimation and Management Guide – Power analysis and optimization techniques
Development Tools:
- Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- IP Core libraries and reference designs
Application Notes
- High-Speed Design Techniques for Virtex-5 FPGAs
- Power Management Best Practices
- Signal Integrity Guidelines for FFGV676 Package
- Thermal Management Recommendations
Related Resources
Development Boards and Kits
Several development platforms support the XC5VLX30-1FFGV676C for prototyping and evaluation:
- ML505 Evaluation Platform – Comprehensive development board featuring the XC5VLX30-1FFGV676C
- Custom carrier boards available from third-party vendors
- Educational development kits for academic applications
Software Tools
- Xilinx Vivado Design Suite – Latest design software with full XC5VLX30-1FFGV676C support
- ISE Design Suite – Legacy tool support for existing designs
- IP Catalog – Extensive library of pre-verified IP cores
- ChipScope Pro – Integrated logic analyzer for debugging
Technical Support
- Xilinx Forums community support
- Application engineering consultation
- Training courses and webinars
- Design review services
Compatible Components
- Memory interfaces (DDR, DDR2, QDR)
- High-speed transceivers and connectors
- Clock generation and distribution circuits
- Power management solutions
Environmental & Export Classifications
Environmental Compliance
The XC5VLX30-1FFGV676C meets stringent environmental standards and regulations:
RoHS Compliance: Fully compliant with RoHS 2011/65/EU directive, lead-free manufacturing process ensures environmental responsibility without compromising performance or reliability.
REACH Regulation: Compliant with European REACH regulation (EC 1907/2006) for chemical safety and environmental protection.
Halogen-Free: Manufactured using halogen-free materials and processes, supporting green design initiatives and environmental sustainability.
Operating Environment
- Commercial Temperature Range: 0ยฐC to +85ยฐC ambient temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 85% relative humidity, non-condensing
- Altitude: Operational up to 3,000 meters above sea level
Export Control Classifications
ECCN (Export Control Classification Number): The XC5VLX30-1FFGV676C is classified under ECCN 3A001.a.7 according to U.S. Export Administration Regulations (EAR).
Export Considerations:
- Subject to U.S. export control regulations
- May require export license for certain destinations
- End-use and end-user restrictions may apply
- Consult with export compliance specialists for international shipments
Quality and Reliability
- Quality Standards: Manufactured to ISO 9001:2015 quality management standards
- Reliability Testing: Extensive qualification testing including temperature cycling, thermal shock, and humidity testing
- MTBF Rating: Mean Time Between Failures exceeding 1,000,000 hours under normal operating conditions
The XC5VLX30-1FFGV676C represents a proven solution for applications requiring high-performance FPGA capability with comprehensive environmental compliance and export classification documentation. This combination of technical excellence and regulatory adherence makes it suitable for global deployment in commercial, industrial, and aerospace applications.
