Product Specifications
The XC5VLX30-2FFG676C offers impressive technical capabilities designed for professional-grade applications:
Core Architecture:
- Logic Cells: 30,720 cells providing extensive design flexibility
- Configurable Logic Blocks (CLBs): 4,800 CLBs for complex logic implementation
- Block RAM: 1.3 Mb total block RAM capacity for data storage and buffering
- DSP48E Slices: 32 dedicated DSP slices optimizing mathematical operations
Memory and Processing:
- Distributed RAM: 192 Kb for high-speed local storage
- Maximum User I/O: 480 pins supporting diverse interface requirements
- Speed Grade: -2 performance grade ensuring reliable high-frequency operation
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Package Details:
- Package Type: FFG676 (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins in compact form factor
- Dimensions: 27mm x 27mm footprint optimizing board space utilization
The XC5VLX30-2FFG676C integrates advanced clock management units, high-speed serial transceivers, and flexible I/O standards, enabling seamless integration with various system architectures and communication protocols.
Price
Pricing for the XC5VLX30-2FFG676C varies based on quantity, supplier, and current market conditions. The device typically falls within the mid-range FPGA pricing tier, reflecting its balanced combination of performance and cost-effectiveness. For accurate current pricing and volume discounts, contact authorized Xilinx distributors or visit official semiconductor marketplace platforms. Educational institutions and research organizations may qualify for special academic pricing programs.
Documents & Media
Technical Documentation:
- Product Data Sheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and design recommendations
- Package and Pinout Information: Complete pin assignments and mechanical drawings
- Migration Guide: Compatibility information for design transitions
- Errata Documentation: Known issues and recommended workarounds
Development Resources:
- Vivado Design Suite compatibility specifications
- Reference designs and application notes
- Constraint files and timing models
- Power estimation tools and calculators
Support Materials:
- Video tutorials covering implementation workflows
- Webinar recordings on optimization techniques
- Community forum discussions and solutions
- Training materials for Xilinx development tools
Related Resources
Development Tools:
- Xilinx Vivado Design Suite: Primary development environment supporting the XC5VLX30-2FFG676C
- ISE Design Suite: Legacy tool support for existing projects
- SDK (Software Development Kit): Embedded software development platform
- ChipScope Pro: Real-time debugging and analysis capabilities
Evaluation Platforms:
- Virtex-5 LX Evaluation Kit featuring the XC5VLX30-2FFG676C
- Development boards with integrated programming interfaces
- Prototyping platforms supporting rapid design iteration
- Reference design implementations demonstrating key features
Compatible Components:
- Power management solutions optimized for Virtex-5 FPGAs
- Clock generation and distribution circuits
- High-speed memory interfaces (DDR2/DDR3)
- Communication interface controllers
Alternative Devices:
- XC5VLX20T-2FFG323C: Lower logic density option
- XC5VLX50-2FFG676C: Higher capacity alternative
- XC5VLX85-2FFG676C: Maximum performance variant
Environmental & Export Classifications
Environmental Compliance: The XC5VLX30-2FFG676C meets stringent environmental standards ensuring responsible manufacturing and usage:
- RoHS Compliant: Lead-free construction meeting European environmental directives
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced through verified conflict-free supply chains
- Halogen-Free: Environmentally conscious packaging materials
Operating Specifications:
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC for long-term preservation
- Humidity Tolerance: Up to 85% relative humidity, non-condensing
- ESD Rating: Class 1A sensitivity level requiring proper handling procedures
Export Control Information:
- ECCN Classification: Export control classification number varies by destination
- Country of Origin: Manufacturing location details for import documentation
- Export License Requirements: Consult current regulations for specific applications
- End-Use Restrictions: Certain applications may require additional approvals
Quality Certifications:
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management compliance
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Industrial Standards: IPC-A-610 assembly and workmanship standards
The XC5VLX30-2FFG676C represents an excellent balance of performance, features, and cost-effectiveness for engineers developing sophisticated FPGA-based solutions. Its comprehensive feature set, robust environmental specifications, and extensive development ecosystem make it suitable for applications ranging from telecommunications infrastructure to advanced research platforms.
