The XCZU5EG-3FBVB900E is a high-performance System on Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family, designed to deliver exceptional processing capabilities for advanced embedded applications. This premium-grade device combines programmable logic with ARM-based processing systems to enable sophisticated system integration and flexibility.
Product Specifications
Core Architecture
- Device Family: AMD Zynq UltraScale+ MPSoC EG Series
- Processing System: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2
- Logic Cells: 256,200 Logic Cells
- Manufacturing Process: 20nm UltraScale Technology
- Operating Voltage: 0.85V
Speed and Temperature Specifications
- Speed Grade: -3 (Highest Performance Grade)
- Temperature Range: Extended (E) – Commercial Temperature Range
- Operating Frequencies: 500MHz, 600MHz, 1.2GHz
Package Details
- Package Type: 900-Pin FCBGA (Flip-Chip Ball Grid Array)
- Package Designation: FBVB900
- Ball Pitch: 0.8mm
- Package Size: 31x31mm
- Packaging: Tray
Key Features
- Programmable Logic: UltraScale+ FPGA architecture with 256K+ logic cells
- Processing Units: High-performance quad-core ARM Cortex-A53 application processors
- Real-time Processing: Dual ARM Cortex-R5 real-time processors
- Graphics Processing: ARM Mali-400 MP2 GPU for graphics acceleration
- Memory Support: DDR4/DDR3L memory controllers with ECC support
- Connectivity: Multiple high-speed I/O interfaces and transceivers
- Security Features: Built-in encryption and authentication capabilities
Price Information
The XCZU5EG-3FBVB900E pricing varies based on quantity, distributor, and market conditions. Contact authorized distributors for current pricing and availability. The device is available through major electronic component distributors including:
- Authorized AMD/Xilinx distributors
- Electronic component suppliers worldwide
- FPGA specialty distributors
Price Factors:
- Quantity breaks available for volume purchases
- Regional pricing variations
- Market demand fluctuations
- Lead time considerations
Documents & Media
Technical Documentation
- Product Datasheet: XCZU5EG Family PDF Datasheet (Data Sheets, Jul 13, 2020)
- Package Information: Zynq UltraScale+ Package Device Pinout Files (TXT and CSV formats)
- Reference Manual: Zynq UltraScale+ MPSoC Technical Reference Manual
- User Guides: Programming and configuration guides
- Application Notes: Design implementation examples and best practices
Development Tools
- Design Suite: Vivado Design Suite for synthesis and implementation
- Software Development: Xilinx SDK and PetaLinux tools
- Programming Tools: Vivado Lab Tools and JTAG programming utilities
- Evaluation Boards: Compatible development and evaluation platforms
Media Resources
- Product overview videos
- Technical webinars and training materials
- Design examples and reference designs
- Community forums and support resources
Related Resources
Development Ecosystem
- Software Tools: Vivado Design Suite, Vitis unified software platform
- Operating Systems: Linux, FreeRTOS, bare-metal applications support
- Development Boards: ZCU104, ZCU106, and custom evaluation platforms
- IP Cores: Extensive library of verified IP blocks and reference designs
Design Support
- Technical Support: FPGA technical engineer support for pinout information, replacement, datasheet access, programming tools, and starter kits
- Community Resources: AMD developer forums and user communities
- Training Materials: Online courses and certification programs
- Design Services: Professional design and consulting services
Compatible Products
- Memory solutions (DDR4/DDR3L modules)
- Power management ICs
- Clock generation and distribution devices
- Interface and connectivity solutions
- Development and debugging tools
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets Restriction of Hazardous Substances directive requirements
- REACH Compliant: Complies with European chemical safety regulations
- Halogen-Free: Environmentally friendly packaging materials
- MSL Rating: Moisture Sensitivity Level classification for handling and storage
Temperature Classifications
- Operating Temperature: Extended (E) temperature range: 0ยฐC to +85ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: Maximum operating junction temperature specified
Quality and Reliability
- Quality Standards: ISO 9001 certified manufacturing processes
- Reliability Testing: Extensive qualification and stress testing
- MTBF Data: Mean Time Between Failures specifications available
- Quality Grade: Commercial/Industrial grade component
Export Control Information
- ECCN Classification: Export Control Classification Number as per US regulations
- Country of Origin: Manufacturing location and origin marking
- Export Restrictions: Compliance with international trade regulations
- Documentation: Certificate of compliance and origin documentation
Packaging and Handling
- ESD Sensitivity: Electrostatic discharge handling precautions required
- Storage Conditions: Controlled humidity and temperature storage requirements
- Shelf Life: Component shelf life and storage guidelines
- Handling Instructions: Proper handling procedures to prevent damage
Note: The XCZU5EG-3FBVB900E represents the highest performance grade (-3) in the XCZU5EG family with extended temperature range (E) qualification, making it suitable for demanding applications requiring maximum processing performance and reliability. Specifications and availability subject to change; consult official AMD/Xilinx documentation for the most current information.
