The XCZU5EV-2FBVB900E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC EV family, designed for demanding applications requiring exceptional processing power and versatility. This advanced FPGA solution combines ARM processing cores with programmable logic to deliver multi-hundred gigabit-per-second system performance with intelligent processing capabilities.
Product Specifications
Core Architecture
The XCZU5EV-2FBVB900E features a sophisticated heterogeneous processing architecture that includes:
Processing System:
- Quad ARM Cortex-A53 MPCore with CoreSight debug and trace technology
- Dual ARM Cortex-R5 real-time processors with CoreSight
- ARM Mali-400 MP2 GPU for advanced graphics processing
- Operating frequencies: 533MHz, 600MHz, and 1.3GHz
Programmable Logic:
- 256K+ Logic Cells providing extensive FPGA capabilities
- 20nm FinFET process technology for optimal power efficiency
- UltraScale+ architecture enabling scalable system-level integration
Physical Specifications
- Package Type: 900-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 31mm x 31mm
- Pin Count: 900 pins
- Ball Pitch: 0.8mm for high-density integration
- Operating Temperature Range: 0ยฐC to 100ยฐC (TJ)
- Supply Voltage: 0.85V core voltage
Key Features
- Multi-hundred Gbps performance for high-throughput applications
- FinFET technology delivering highest performance and integration at 20nm
- Scalable architecture across process nodes and product families
- Advanced I/O capabilities with highest serial I/O bandwidth
- Video processing acceleration optimized for multimedia applications
- Real-time processing capabilities for time-critical applications
Pricing
The XCZU5EV-2FBVB900E is available through authorized distributors with competitive pricing based on quantity:
- Single Unit Pricing: Available upon request from authorized distributors
- Volume Pricing: Bulk discounts available for high-volume orders
- Distribution Partners: Available through DigiKey, Mouser, Avnet, and other authorized AMD distributors
- Lead Time: Standard lead times vary by distributor and quantity requirements
- Packaging: Available in standard tray packaging
For current pricing and availability, contact authorized AMD distributors or request quotes through official channels. Pricing fluctuates based on market conditions and volume requirements.
Documents & Media
Technical Documentation
- Official Datasheet: AMD Zynq UltraScale+ MPSoC Data Sheet (DS891)
- Product Brief: UltraScale+ MPSoC EV family overview
- Package Information: Pinout files available in TXT and CSV formats
- Application Notes: Implementation guides and best practices
- Reference Manuals: Comprehensive technical reference documentation
Development Resources
- Vivado Design Suite: Primary development environment for FPGA design
- Development Boards: Compatible with various evaluation and development platforms
- Software Tools: Comprehensive toolchain for embedded development
- Code Examples: Reference designs and sample implementations
- Technical Support: Access to AMD technical support resources
Multimedia Resources
- Product Images: High-resolution package and die photographs
- Block Diagrams: Detailed architectural illustrations
- Application Videos: Tutorial and demonstration content
- Webinars: Technical training and product overview sessions
Related Resources
Compatible Products
- XCZU5EG-2FBVB900E: Standard EG variant without video codec
- XCZU4EV-2FBVB900E: Lower-end EV family member
- XCZU7EV-2FBVB900E: Higher-performance EV family option
Development Ecosystem
- ZedBoard: Popular development platform for Zynq devices
- UltraZed: High-performance SOM solutions
- Evaluation Kits: Various starter kits and evaluation boards
- Third-party Modules: System-on-Module solutions from partners
Application Areas
- Automotive ADAS: Advanced driver assistance systems
- Multimedia Processing: Video encoding/decoding applications
- Industrial Automation: Machine vision and control systems
- Telecommunications: 5G infrastructure and wireless systems
- Aerospace & Defense: Radar and signal processing systems
- Data Centers: Acceleration and networking applications
Technical Support
- AMD Forums: Community-driven technical discussions
- Application Engineers: Direct technical support from AMD
- Training Resources: Comprehensive learning materials
- Documentation Portal: Centralized access to all technical documents
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union RoHS directive requirements
- REACH Compliant: Complies with EU chemical registration regulations
- Conflict Minerals: AMD maintains conflict-free mineral sourcing
- Environmental Standards: Manufactured following ISO 14001 guidelines
- Lifecycle Assessment: Environmental impact documentation available
Export Control Classifications
- ECCN: 5A002.A.4 (Export Control Classification Number)
- USHTS Code: 8542390001 (US Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (EU customs classification)
- Export Licensing: May require export licenses for certain destinations
- Country Restrictions: Subject to applicable export control regulations
Regulatory Information
- MSL Rating: MSL 4 – 72 hours (Moisture Sensitivity Level)
- Quality Standards: Manufactured to automotive and industrial quality standards
- Certifications: Various regional certifications available upon request
- Documentation: Environmental compliance certificates available
Important Export Considerations
Users must verify current export control regulations before international shipment. The XCZU5EV-2FBVB900E may require export licenses depending on the destination country and end-use application. Consult with trade compliance professionals and review current Bureau of Industry and Security (BIS) regulations before exporting.
The XCZU5EV-2FBVB900E represents AMD’s commitment to delivering cutting-edge programmable solutions that enable next-generation applications across multiple industries. With its powerful combination of ARM processing, FPGA flexibility, and advanced features, this device provides the foundation for innovative system designs requiring high performance and adaptability.
