Product Overview
The XCZU6CG-2FFVC900E is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This cutting-edge device combines dual-core ARM Cortex-A53 application processors with ARM Cortex-R5F real-time processors and programmable logic fabric, delivering exceptional processing power and flexibility for demanding embedded applications.
Key Applications:
- Industrial automation and motor control
- 5G wireless communications
- Automotive ADAS systems
- Video processing and graphics
- Internet of Things (IoT) solutions
Product Specifications
Core Processing System
- Application Processing Unit (APU): Dual-core ARM Cortex-A53 with CoreSight
- Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5F with CoreSight
- Architecture: 64-bit processor scalability
- Operating Speed: Up to 1.2GHz (APU), 500MHz (RPU)
FPGA Specifications
- Logic Cells: 469,446 logic cells
- Logic Units: 469,446 programmable logic units
- Technology Node: 16nm FinFET+ technology
- Speed Grade: -2 (industrial grade performance)
- Maximum Operating Frequency: 645MHz
Power and Electrical
- Core Voltage (VCCINT): 0.85V
- Low Power Options: Supports 0.72V operation for reduced power consumption
- Power Optimization: Enhanced power management features
Package and I/O
- Package Type: 900-pin FC-BGA (Flip Chip Ball Grid Array)
- Package Size: 31mm x 31mm
- I/O Count: 204 user I/O pins
- Operating Temperature Range: Extended temperature range (-40ยฐC to +100ยฐC)
- Temperature Grade: E (Extended commercial)
Memory and Connectivity
- GTH Transceivers: 24 high-speed serial transceivers
- Memory Interfaces: DDR4, DDR3L, LPDDR4 support
- Peripheral Interfaces: USB 3.0, PCIe, Ethernet, CAN, SPI, I2C, UART
Price Information
The XCZU6CG-2FFVC900E is available through authorized distributors with pricing typically ranging from $1,500 to $3,000 USD depending on quantity and supplier. Key pricing factors include:
Pricing Considerations:
- Volume Discounts: Significant price reductions available for bulk orders (1000+ units)
- Market Fluctuation: Semiconductor pricing subject to supply chain dynamics
- Distributor Variability: Prices may vary between authorized distributors
- Lead Times: Standard lead times range from 12-16 weeks for production quantities
Stock Availability:
- Limited quantities available from distributors
- Custom ordering recommended for production volumes
- Contact authorized distributors for current pricing and availability
Documents & Media
Official Documentation
- Product Data Sheet: XCZU6CG-2FFVC900E.pdf (Complete technical specifications)
- UltraScale Architecture Overview: DS891 Zynq UltraScale+ Overview
- Technical Reference Manual: UG1085 Zynq UltraScale+ Device TRM
- Packaging Guide: Package specifications and pinout information
Design Resources
- Vivado Design Suite: Complete development environment
- Vitis Unified Software Platform: Embedded development tools
- PetaLinux: Linux distribution for Zynq devices
- Reference Designs: Example implementations and tutorials
Application Notes
- Programming Guide: XAPP1319 Programming BBRAM and eFUSEs
- Security Features: XAPP1333 External Secure Storage Using PUF
- Power Management: White papers on power optimization
- Design Tutorials: UG1209 Embedded Design Tutorial
Development Tools
- Board Support Packages (BSP): Ready-to-use software packages
- Evaluation Boards: ZCU102, ZCU104, ZCU106 development platforms
- IP Library: Extensive collection of verified IP cores
- Debug Tools: Hardware debugging and trace capabilities
Related Resources
Compatible Development Boards
- ZCU102 Evaluation Kit: Full-featured development platform
- ZCU104 Evaluation Kit: Cost-optimized development solution
- ZCU106 Evaluation Kit: High-performance evaluation platform
- Custom Carrier Boards: Third-party development solutions
Software Ecosystem
- Xilinx Runtime (XRT): Accelerated computing runtime
- OpenCL Support: Parallel computing framework
- Machine Learning: Vitis AI for ML acceleration
- Real-Time OS: FreeRTOS and Linux support
Design Services
- Premier Partner Program: Certified design service providers
- Training Resources: Online and instructor-led courses
- Technical Support: Comprehensive customer support
- Community Forums: Developer community and knowledge base
Alternative Products
- XCZU6CG-1FFVC900E: Speed grade -1 variant
- XCZU6EG Series: Enhanced GPU-enabled versions
- XCZU5CG Series: Lower-cost alternatives
- XCZU7CG Series: Higher-performance options
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: YES – Lead-free and environmentally friendly
- REACH Compliant: Meets EU chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals regulations
- Environmental Standards: Meets international environmental standards
Export Control Classifications
- ECCN (Export Control Classification Number): 5A002.A.4
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Trade Classification): 8542399000
- Country of Origin: Various (consult specific product markings)
Quality and Reliability
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Grade: Extended temperature and reliability testing
- Quality Standards: ISO 9001 certified manufacturing
- Reliability Testing: Comprehensive stress testing and qualification
Packaging and Handling
- ESD Protection: Anti-static packaging and handling procedures
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- Storage Requirements: Controlled temperature and humidity
- Shelf Life: Standard semiconductor storage guidelines
Regulatory Approvals
- CE Marking: European Conformity marking
- FCC Compliance: US Federal Communications Commission
- IC Compliance: Innovation, Science and Economic Development Canada
- International Standards: IEC, JEDEC, and other global standards
Note: Specifications and availability subject to change. Contact authorized distributors for the most current information and pricing. The XCZU6CG-2FFVC900E represents the latest in AMD Xilinx’s advanced MPSoC technology, providing developers with unprecedented flexibility and performance for next-generation embedded applications.
