Product Specification
The XCZU6EG-2FFVC900E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) manufactured by AMD (formerly Xilinx). This EG-series device combines powerful processing capabilities with programmable logic in a single, versatile package. Built on advanced 16nm technology, it delivers exceptional performance per watt, making it ideal for demanding applications requiring heterogeneous processing.
Key Features:
- Processing System:
- Quad ARMยฎ Cortexยฎ-A53 MPCoreโข with CoreSightโข (up to 1.3GHz)
- Dual ARMยฎ Cortexยฎ-R5 with CoreSightโข (up to 600MHz)
- ARM Maliโข-400 MP2 Graphics Processing Unit
- 256KB RAM
- Programmable Logic:
- 469K+ Logic Cells
- Built on 16nm FinFET process technology
- Enhanced DSP slices
- Block RAM and UltraRAM for high-density memory
- Connectivity:
- CANbus, EBI/EMI, Ethernet
- IยฒC, MMC/SD/SDIO, SPI
- UART/USART, USB OTG
- Package Specifications:
- 900-FCBGA (31ร31) package
- Extended Temperature Range (E): 0ยฐC to 100ยฐC (TJ)
- Speed Grade: -2 (higher performance)
- Operating Voltage: 0.85V
The XCZU6EG-2FFVC900E offers superior system-level integration, combining real-time control with engines for graphics, video, waveform, and packet processing. This makes it an excellent choice for applications in 5G wireless infrastructure, industrial automation, automotive systems, aerospace and defense, and data center acceleration.
Price
The XCZU6EG-2FFVC900E pricing is market-dependent and can fluctuate based on global supply and demand. Pricing information is monitored in real-time by various distributors, allowing customers to track historical price trends for informed purchasing decisions. For current pricing, it’s recommended to request a direct quote from authorized distributors such as Arrow, Avnet, or directly from AMD.
Bulk pricing discounts are often available for volume purchases. The device represents a value-optimized solution when considering its extensive processing capabilities and programmable logic resources compared to alternative discrete component implementations.
Documents & Media
The XCZU6EG-2FFVC900E is supported by comprehensive documentation from AMD:
- Datasheets:
- DS891: Zynq UltraScale+ MPSoC Overview
- DS925: Zynq UltraScale+ MPSoC DC and AC Switching Characteristics
- Product Tables and Selection Guide
- User Guides:
- UG1209: Zynq UltraScale+ MPSoC Embedded Design Tutorial
- UG1085: Zynq UltraScale+ MPSoC Software Developer Guide
- UG1137: Zynq UltraScale+ MPSoC Register Reference
- Technical Reference:
- Package Device Pinout Files (ASCII format in TXT and CSV)
- Zynq UltraScale+ MPSoC Base TRD User Guide (UG1221)
- Development Tools:
- Vivado Design Suite for hardware design
- Vitis Unified Software Platform for embedded development
- PetaLinux tools for Linux development
All documentation is available through the AMD Technical Information Portal and various online resources including the AMD/Xilinx Wiki.
Related Resources
Development Boards & Starter Kits
While the XCZU6EG-2FFVC900E is a component, it’s often used with development platforms such as:
- ZCU102 Evaluation Board
- Various third-party development boards (ZedBoard, Basys 3, TinyFPGA BX, etc.)
Software & Tools
- Xilinx Vivado Design Suite: Comprehensive environment for FPGA and SoC development
- Vitis Unified Software Platform: For embedded software development
- PetaLinux: For Linux-based development
Technical Support
Technical support for the XCZU6EG-2FFVC900E includes:
- AMD/Xilinx Community Forums for questions and solutions
- Extensive online documentation and reference designs
- AMD/Xilinx official support channels
Environmental & Export Classifications
Environmental Specifications
- Temperature Range: Extended (E) temperature range: 0ยฐC to 100ยฐC (TJ)
- Compliance: RoHS compliant
- Package: 900-Pin FCBGA (Flip Chip Ball Grid Array), lead-free
Export Classifications
The XCZU6EG-2FFVC900E, like other Zynq UltraScale+ devices, is subject to export control regulations. The Export Control Classification Number (ECCN) categorizes this device under semiconductor technology. Customers should consult with AMD/Xilinx or authorized distributors regarding specific export requirements and restrictions that may apply when shipping internationally.
Always verify the most current export classification and regulatory requirements when planning international shipments or transfers of this technology.
The XCZU6EG-2FFVC900E represents AMD/Xilinx’s commitment to providing advanced, adaptable computing solutions that enable designers to create innovative applications across diverse industries. With its powerful combination of processing capabilities and programmable logic, this device offers exceptional flexibility and performance for the most demanding embedded applications.
