1. Product Specification
The XCZU6EG-3FFVC900E is a premium Zynq UltraScale+ MPSoC from Xilinx (now AMD) featuring advanced system-on-chip architecture designed for high-performance computing applications. This powerful device combines 469,446 logic cells built on 20nm technology with a robust processing system that includes a Quad-core ARM Cortex-A53 MPCore and Dual ARM Cortex-R5 with CoreSight technology.
Key Technical Specifications:
- 469,446 programmable logic cells
- 20nm manufacturing technology
- 900-Pin FCBGA package (31ร31)
- Speed Grade: -3 (highest performance variant)
- Operating voltage: 0.85V
- Temperature range: Extended (E)
- Quad-core ARM Cortex-A53 processor running up to 1.3GHz
- Dual ARM Cortex-R5 real-time processors
- High-density on-chip UltraRAM static memory
- Single-channel high-speed transceivers up to 32 Gbps
- Integrated connectivity: 100 GbE, PCIe Gen4, 150 Gbps Interlaken
- Enhanced encryption, security, and power management features
The XCZU6EG-3FFVC900E stands out with its “EG” device classification, indicating it contains enhanced graphics processing capabilities with an ARM Mali-400 MP2 GPU, making it ideal for applications requiring both high-performance computing and visualization capabilities.
2. Price
The XCZU6EG-3FFVC900E is a high-end FPGA component with pricing that varies based on quantity, availability, and market conditions. Prices typically range from $1,500 to $3,000 per unit for small quantities, with significant discounts available for volume purchases. For current pricing and availability, it’s recommended to request a quote directly from authorized Xilinx/AMD distributors such as FPGAkey, VEKEMO, or directly through AMD’s official channels.
Price fluctuations are common for these components due to supply chain dynamics and market demand. Several distributors offer real-time price monitoring services to help buyers track historical price trends and make informed purchasing decisions.
3. Documents & Media
Technical Documentation:
- Comprehensive datasheet (DS891) with full specifications
- Device pinout files in TXT and CSV formats (as described in UG1075)
- DC and AC electrical characteristics documentation
- Implementation guides and application notes
- Reference designs and example projects
Development Resources:
- Vivado Design Suite compatibility for programming and implementation
- Software development tools and libraries
- FPGA synthesis guidelines
- Technical support documentation
- Programming and debugging tutorials
All documentation can be accessed through AMD’s official documentation portal, with specific XCZU6EG-3FFVC900E resources available by searching with the exact part number through the download channels of authorized distributors.
4. Related Resources
Development Platforms:
- Compatible with various development boards and evaluation kits
- Options include ZedBoard, Basys 3, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, and Digilent Arty S7
- Custom development boards available from specialized manufacturers
Software & Tools:
- Vivado Design Suite for synthesis and implementation
- SDK for software development
- Vitis AI for artificial intelligence applications
- System Optimizer for power and performance optimization
Community Support:
- FPGA developer forums
- Technical support from AMD/Xilinx
- Online communities and knowledge bases
- Tutorial resources and educational materials
5. Environmental & Export Classifications
Environmental Specifications:
- Extended temperature range (E): 0ยฐC to 100ยฐC (TJ)
- RoHS compliant
- Lead-free package option available
- Energy-efficient design with advanced power management
Export Classifications:
- Subject to export control regulations
- ECCN (Export Control Classification Number) applicable
- May require export licenses for certain countries
- Commercial application classification
Packaging:
- Ships in tray packaging for protection during transport
- Moisture-sensitive device requiring proper handling
- Available in multiple temperature grades: Extended (E), Industrial (I), Automotive (Q), and Military (M)
The XCZU6EG-3FFVC900E represents the pinnacle of Xilinx’s (AMD’s) Zynq UltraScale+ MPSoC family, offering exceptional performance for applications requiring high-speed processing, complex programmable logic, and advanced graphics capabilities. With its robust feature set and extensive support ecosystem, this device is ideal for demanding applications in telecommunications, data centers, aerospace, defense, industrial automation, and other high-performance computing environments.
