Restore critical semiconductor devices with our specialized flip chip repair and direct die attachment services. Our advanced micro-rework capabilities address complex IC failures at the die level, extending component lifecycles and reducing replacement costs for high-value electronic assemblies.
Service Overview Our flip chip repair process involves precise removal, inspection, and reattachment of semiconductor dies using state-of-the-art equipment and proven methodologies. We handle both flip chip ball grid array (FCBGA) and direct chip attach (DCA) configurations across various package types and substrate materials.
Key Capabilities
- Die Removal & Inspection: Controlled heating and mechanical separation with minimal substrate damage
- Substrate Preparation: Thorough cleaning, pad restoration, and underfill removal
- Die Replacement: Precision placement with optical alignment systems ensuring accurate positioning
- Interconnect Formation: Solder bump reflow, wire bonding, or conductive adhesive application
- Underfill Application: Capillary flow underfill dispensing for mechanical reinforcement and thermal cycling protection
- Quality Verification: Electrical testing, X-ray inspection, and reliability assessment
Applications
- High-performance processors and graphics chips
- RF and microwave ICs
- Power management devices
- Memory modules and storage controllers
- Automotive and aerospace electronics
- Medical device semiconductors
Technical Specifications
- Die sizes from 1mmยฒ to 25mmยฒ
- Pitch capabilities down to 40 microns
- Temperature profiles optimized for various solder alloys
- Class 10,000 cleanroom environment
- IPC-A-610 and J-STD-001 compliant processes
Benefits
- Cost-effective alternative to complete board replacement
- Reduced lead times compared to new component procurement
- Maintains original OEM specifications and performance
- Environmentally responsible repair solution
- Comprehensive documentation and traceability
Ideal for manufacturers, repair facilities, and organizations managing critical electronic systems where component availability or cost makes replacement impractical.
