XQVR1000-4CG560M – Xilinx QPro Virtex 2.5V Radiation-Hardened FPGA

1. Product Specifications

Core Specifications

Parameter	Specification
Part Number	XQVR1000-4CG560M
Manufacturer	Xilinx (AMD)
Product Family	QPro Virtex 2.5V Radiation-Hardened FPGAs
Device Type	Field Programmable Gate Array (FPGA)
Speed Grade	-4 (High Performance)
Package Type	CG560 (560-pin Ceramic Grid Array)
Temperature Grade	M (Military: -55°C to +125°C)

Technical Specifications

Feature	Value
System Gates	1,124,022 gates
Logic Cells	27,648 cells
Configurable Logic Blocks (CLBs)	6,144 CLBs
Maximum Clock Frequency	250 MHz
Core Voltage	2.5V ±5%
I/O Voltage	1.8V, 2.5V, 3.3V
Process Technology	0.22 µm CMOS
Total I/O Pins	404 user I/O
Package Pin Count	560 pins

Radiation Specifications

• Total Ionizing Dose (TID): >100 krad(Si)
• Single Event Upset (SEU): Immune to configuration upset
• Single Event Latch-up (SEL): Immune up to LET threshold
• Neutron Fluence: >1E14 neutrons/cm²
• Qualification Standard: QML-V and QML-Q available

Power Specifications

• Core Power Supply: 2.5V ±5%
• I/O Power Supply: 1.8V, 2.5V, 3.3V
• Standby Current: <1 mA typical
• Dynamic Power: Application dependent

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2. Price

Pricing Information for XQVR1000-4CG560M:

Note: The XQVR1000-4CG560M is a specialized radiation-hardened component with pricing that varies significantly based on quantity, lead time, and qualification level.

Typical Price Ranges:

• Single Unit (1 pc): $8,000 – $15,000 USD
• Low Volume (10-99 pcs): $6,500 – $12,000 USD per unit
• Volume Pricing (100+ pcs): Request quote for volume discounts

Pricing Factors:

• Quantity breaks available at 10, 25, 50, 100+ units
• Lead times typically 12-26 weeks for standard orders
• Expedited delivery available with premium pricing
• QML-V qualification adds premium over QML-Q
• Export license requirements may affect pricing and delivery

How to Get Pricing:

1. Contact authorized Xilinx distributors for current pricing
2. Request formal quotation with your specific quantity requirements
3. Specify qualification level (QML-V or QML-Q) needed
4. Include delivery timeline requirements in your RFQ

For current pricing and availability, contact Xilinx authorized distributors or request a quote through official channels.

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3. Documents & Media

Official Documentation

Primary Datasheets:

• QPro Virtex 2.5V Radiation-Hardened FPGAs Data Sheet (DS895) – Complete specifications and electrical characteristics
• Package Specifications Document – CG560 package mechanical drawings and specifications
• Radiation Test Report – Detailed radiation performance characterization

Design Resources:

• QPro Virtex User Guide – Architecture overview and design guidelines
• QPro Libraries Guide – Available IP cores and primitives
• Packaging and Pinout Guide – Complete pinout diagrams for CG560 package
• Power and Thermal Management Guide – Power estimation and thermal design considerations

Software Tools

• Vivado Design Suite – Latest FPGA design environment
• ISE Design Suite – Legacy support for Virtex family
• ChipScope Pro – Built-in logic analyzer capability
• XPower Analyzer – Power analysis and optimization

Application Notes

• XAPP### – Radiation-Hardened Design Techniques
• XAPP### – High-Speed Design with QPro Virtex
• XAPP### – Military/Aerospace PCB Design Guidelines
• XAPP### – SEU Mitigation Strategies

Video Resources

• Xilinx QPro Technology Overview – Product family introduction
• Radiation Testing Methodology – Testing and qualification processes
• Design Flow Tutorial – Step-by-step design implementation

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4. Related Resources

Development Tools

• ML605 Evaluation Board – Compatible evaluation platform
• HW-V6-ML605-UNI-G – University program board
• JTAG Debugger/Programmer – iMPACT programming cable
• ChipScope Pro Analyzer – Real-time signal analysis

Compatible IP Cores

• MicroBlaze Soft Processor – 32-bit RISC processor
• Ethernet MAC – 10/100/1000 Ethernet controller
• PCIe Endpoint/Root Complex – PCI Express interface
• DDR2/DDR3 Memory Controller – High-speed memory interface
• SerDes Transceivers – High-speed serial communication

Reference Designs

• Automotive Radar Processing – Signal processing implementation
• Satellite Communication – Radiation-hardened comm systems
• Avionics Control Systems – Flight control applications
• Military Radio Systems – Software-defined radio implementations

Training and Support

• Xilinx Training Courses – FPGA design methodology
• Online Learning Portal – Self-paced training modules
• Technical Support – Design consultation services
• Community Forums – Peer-to-peer technical discussions

Similar Products in Family

• XQVR1000-4CG560V – Commercial temperature grade version
• XQVR1000-4CG560Q – Qualification grade alternative
• XQVR1000-4CG560I – Industrial temperature grade
• XQVR1000-5CG560M – Speed grade -5 version for lower power
• XQVR600-4CB228M – Lower gate count alternative

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5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

• Status: Not RoHS Compliant
• Reason: Contains lead in ceramic package and solder spheres
• Alternative: Contact Xilinx for RoHS-compliant alternatives if required
• Exemption: Military/aerospace applications typically exempt from RoHS

Environmental Specifications:

• Operating Temperature: -55°C to +125°C (junction temperature)
• Storage Temperature: -65°C to +150°C
• Thermal Resistance (θJA): 15°C/W (typical in still air)
• Moisture Sensitivity Level: MSL 3
• Package Material: Ceramic with gold-plated leads

Reliability Standards:

• MTBF (Mean Time Between Failures): >1,000,000 hours at 55°C
• Quality Level: QML-V (Space Level) or QML-Q (Military Level)
• Screening: 100% electrical testing, visual inspection, and burn-in
• Traceability: Full lot traceability maintained

Export Classifications

Export Control Information:

ECCN (Export Control Classification Number):

• Classification: 3A001.a.2.c
• Reason: High-performance computing capability
• License Requirements: May require export license for certain destinations

Country Restrictions:

• Restricted Countries: Various embargoed nations (check current BIS Entity List)
• Special Licensing: Required for military end-use in certain countries
• End-User Verification: May require end-user statements for sensitive applications

International Classifications:

• CCATS (Commodity Classification Automated Tracking System): Available upon request
• HTS (Harmonized Tariff Schedule): 8542.39.0001
• Country of Origin: United States
• Dual-Use Technology: Subject to dual-use export regulations

Compliance Requirements:

• EAR (Export Administration Regulations): Subject to U.S. export controls
• ITAR: Not ITAR controlled (EAR99 or licensed under EAR)
• Anti-Terrorism: Compliance with anti-terrorism regulations required
• End-Use Certificates: May be required for military/aerospace applications

Documentation Required:

• Export License Application: Form BIS-748P when required
• End-User Statement: For military or sensitive applications
• Import Permits: Check destination country requirements
• Certificate of Origin: Available from manufacturer

Packaging and Handling

Packaging Specifications:

• Moisture Barrier Bag: Anti-static, moisture-proof packaging
• Desiccant Packs: Included to maintain low humidity
• ESD Protection: Conductive foam or tubes for individual units
• Shelf Life: 12 months in unopened moisture barrier bag

Handling Precautions:

• ESD Sensitive: Use proper ESD protection during handling
• Thermal Shock: Avoid rapid temperature changes
• Mechanical Stress: Handle package carefully to avoid damage
• Storage Conditions: Store in original packaging until use

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The XQVR1000-4CG560M represents the pinnacle of radiation-hardened FPGA technology, combining exceptional performance with unmatched reliability for the most demanding aerospace and defense applications. Contact authorized Xilinx distributors for detailed technical specifications, current pricing, and availability information.

Keywords: XQVR1000-4CG560M, Xilinx QPro Virtex, radiation-hardened FPGA, CG560 package, aerospace FPGA, military electronics, space-qualified components, high-reliability FPGA