Product Specification
The XCZU7EV-L2FBVB900E is a high-performance Multiprocessor System-on-Chip (MPSoC) from the Xilinx Zynq UltraScale+ family, designed for demanding applications that require powerful processing capabilities and exceptional versatility. This cutting-edge device integrates sophisticated hardware with programmable logic for versatile system customization.
Key Features:
- Architecture: 20nm UltraScale+ technology with 504,000 logic cells
- Processing System:
- Quad-core ARM Cortex-A53 (64-bit) processor at 1.5GHz
- Dual-core ARM Cortex-R5 real-time processor
- High-performance video codec
- Package Type: 900-Pin FCBGA (Flip-Chip Ball Grid Array)
- Speed Grade: -2L (optimized for lower power consumption)
- Temperature Range: Extended (E) industrial temperature support
- Power Options: Can operate at dual VCCINT voltage levels (0.85V or 0.72V)
- Video Processing: Enhanced video codec capabilities ideal for video-intensive applications
- Memory: Integrated UltraRAM for high-density on-chip static memory
Applications:
- Multimedia systems and video processing
- Automotive ADAS (Advanced Driver Assistance Systems)
- Surveillance equipment
- Machine vision and deep learning applications
- Industrial automation
- 5G wireless communications
- Cloud computing and data centers
- Medical imaging and equipment
Price
The XCZU7EV-L2FBVB900E is a premium MPSoC solution with pricing that varies based on quantity, supplier terms, and market conditions. Current pricing:
- Single Unit: Contact authorized distributors for exact pricing
- Volume Pricing: Significant discounts available for bulk orders
- Estimated Price Range: $1,800 – $2,500 per unit (May 2025)
For the most accurate and up-to-date pricing information, we recommend contacting AMD/Xilinx authorized distributors or using electronic component procurement platforms such as Avnet, Newark, FPGAkey, or Mouser.
Documents & Media
Technical Documentation:
- Product Datasheet: Comprehensive DS891 Zynq UltraScale+ MPSoC Overview
- Technical Reference Manual: Detailed hardware specifications and interfaces
- Package Pinout Files: Available in TXT and CSV formats (as described in UG1075)
- Software Development Guide: Complete programming reference for embedded applications
- IP Core Documentation: Integration guides for AMD/Xilinx IP
Development Resources:
- Vivado Design Suite: Complete development environment for FPGA/SoC design
- Vitis Unified Software Platform: Application acceleration development environment
- PetaLinux Tools: Linux development toolkit for embedded applications
- Software Libraries: Pre-built software components for accelerated development
- Reference Designs: Application-specific templates and examples
Related Resources
Development Boards:
- Xilinx ZCU104 Evaluation Board
- Xilinx ZCU106 Evaluation Kit
- ALINX AXU5EVB-P Development Board
- Partner ecosystem development platforms
Support Resources:
- Xilinx/AMD Developer Forum
- Technical Support Portal
- Training Videos and Tutorials
- Online Documentation Library
- GitHub Repositories with Example Projects
Complementary Products:
- Compatible memory devices (DDR4)
- Power management solutions
- Thermal management components
- Interface adapters and expansion modules
- Xilinx IP cores and software libraries
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant
- REACH Compliant
- Lead-Free Manufacturing Process
- ISO 14001 Environmental Management Standard
Export Classifications:
- ECCN: 3A001.a.2.c (Export Control Classification Number)
- HTS Code: 8542.31.0000 (Harmonized Tariff Schedule)
- Country of Origin: Various manufacturing locations globally
Reliability Information:
- Extended Temperature Range: -40ยฐC to +100ยฐC
- Industrial Grade Qualification Testing
- Advanced Packaging Technology with Enhanced Thermal Performance
- Long-Term Support and Product Lifecycle Management
