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Top 18 Ceramic PCB Manufacturers in The World

Rayming is 18 years ceramic PCB Manufacturer, Pls Send PCB files to Sales@raypcb.com to get a quote Now !

We support 3 types of ceramic Substrates:

1. Alumina (ALN) PCB
2. Aluminum Nitride Base
3. Copper Clad

A ceramic printed circuit board (PCB) is a circuit board made with ceramic materials such as aluminum oxide or aluminum nitride instead of the conventional FR4 fiberglass material. Here are some key things to know about ceramic PCBs:

  • Ceramic PCBs provide higher heat resistance, better electrical insulation, and greater dimensional stability compared to standard FR4 PCBs. They can operate at higher temperatures.
  • Common ceramic materials used include alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), and low temperature co-fired ceramics (LTCC).
  • Ceramic PCBs are fabricated using processes like screen printing, lamination, laser drilling, and high temperature sintering to form the circuits.
  • They have excellent high frequency characteristics and low loss tangents, making them suitable for RF and microwave applications.
  • Ceramic PCBs can support higher voltage circuits and have very low thermal expansion.
  • Multilayer ceramic PCBs with buried vias or cavities can be fabricated for complex layouts.
  • Key applications include military and aerospace systems, automotive electronics, telecom infrastructure, medical devices etc. where reliability under extreme conditions is critical.
  • Leading ceramic PCB manufacturers provide fabrication, assembly and testing services to produce high quality ceramic boards.
Ceramic Substrate MaterialThermal Conductivity
Aluminum Nitride150 – 180 W/mK
Aluminum Oxide18-36 W/mK
Beryllium Oxide184-300 W/mK
Boron Nitride15 – 600 W/mK
Silicon Carbide70-210 W/mK

In summary, ceramic PCBs offer superior performance than standard PCBs for demanding applications requiring high temperature, frequency, voltage operation or miniaturization. Their unique properties make them ideal for mission-critical electronic systems.

Manufacturing process for ceramic printed circuit boards (PCBs):

  1. Material Preparation – The ceramic material, usually aluminum oxide or aluminum nitride powder, is mixed with binders and sintering aids. The resulting slurry is cast into sheets of “green tape.”
  2. Via Formation – Holes are punched in the green tape to form vias for component interconnections. The vias are then filled with a conductive paste.
  3. Conductive Layer Printing – A conductive paste containing silver, gold or copper is screen printed onto the green tape to form the circuit patterns.
  4. Lamination – Multiple layers of circuitized green tape are stacked up, along with non-circuitized dielectric layers, and laminated under pressure to form a multi-layer board.
  5. Bisque Firing – The laminated board is slowly heated to burn off binders and organic compounds within the ceramic and paste. This leaves only the ceramic and metal particles.
  6. Sintering – The bisque-fired board is sintered at high temperatures up to 1600°C to densify the ceramic structure and firmly bond the conductive layers.
  7. Machining – The fully sintered board is machined with laser/mechanical drilling for vias or cutouts. Finishing operations may also be performed.
  8. Metallization – Conductive paths on the fired ceramic board are electroplated or coated to lower resistivity.
  9. Testing – Electrical, thermal, mechanical and environmental testing is conducted to ensure board reliability.
  10. Assembly – Surface mount or leaded components are soldered onto the finished ceramic PCB. Additional testing follows assembly.

The entire process enables fabrication of complex, multi-layered ceramic circuit boards with high reliability and performance.

Alumina Ceramic Substrate

Aluminum Nitride Ceramic PCB

Aluminum Nitride Ceramic PCB

The alumina ceramic substrate has high mechanical strength, good insulation, and light resistance. It has been widely used in multilayer wiring ceramic substrates, electronic packaging, and high-density packaging substrates.

1. The Crystal Structure, Classification, and Performance of Alumina Ceramic Substrate

Alumina has many homogenous crystals, such as α-Al2o3, β-Al2o3, γ-Al2o3, etc. Among them, α-Al2o3 has higher stability. Its crystal structure is compact, physical and chemical properties are stable, and it has density and mechanical properties. The advantage of higher strength has more applications in the industry.

Alumina ceramics are classified by alumina purity. Alumina purity of “99% is called corundum porcelain, and alumina purity of 99%, 95%, and 90% is called 99 porcelain, 95 porcelain, and 90 porcelain, content” 85% of alumina ceramics are generally called high alumina ceramics. The bulk density of 99.5% alumina ceramics is 3.95g/cm3, the bending strength is 395MPa, the linear expansion coefficient is 8.1×10-6, the thermal conductivity is 32W/(m·K), and the insulation strength is 18KV/mm.

2. Manufacturing Process of Black Alumina Ceramic Substrate

Black alumina ceramic substrates are mostly used in semiconductor integrated circuits and electronic products. This is mainly due to the high photosensitivity of most electronic products. The packaging materials need to have strong light-shielding properties to ensure the clarity of the digital display. It is packaged with a black alumina ceramic substrate. With the continuous updating of modern electronic components, the demand for black alumina packaging substrates is also expanding. At present, research on the manufacturing process of black alumina ceramics is actively carried out at home and abroad.

Black alumina ceramic fiber board used in the electronic product packaging are based on the needs of their application fields. The selection of black coloring materials needs to combine the properties of ceramic raw materials. For example, it is necessary to consider that ceramic raw materials need to have better electrical insulation. Therefore, in addition to the ceramic substrate’s final coloration and mechanical strength, the black coloring material must also consider electrical insulation, heat insulation, and electronic properties. Other functions of packaging materials. In the ceramic coloring process, the low-temperature environment may affect the volatility of the coloring material and keep it warm for a certain period. During this process, the free coloring material may aggregate into spinel compounds, preventing the coloring material from continuing under high-temperature environments. Volatile to ensure the coloring effect.

3.The Process of Manufacturing Black Alumina Ceramic Substrate by Casting Method

The casting method refers to the manufacturing process of adding solvents, dispersants, binders, plasticizers, and other substances to the ceramic powder to make the slurry evenly distributed. Afterward, making the ceramic sheets of different specifications on the casting machine. It is called the scraper forming method. This process first appeared in the late 1940s and was used to produce ceramic chip capacitors. The advantages of this process are:

(1) The equipment is simple to operate, efficient in production, capable of continuous operation, and high in automation.

(2) The density of the embryo body and the elasticity of the diaphragm is greater.

(3) Mature technology.

(4) Controllable production specifications and a wide range.

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Top 18 Ceramic PCB Manufacturers in the world

Ceramic Package for UV LED

Ceramic printed circuit boards (PCB), also known as ceramic substrates, are made with ceramic materials such as aluminum oxide or aluminum nitride instead of the standard fiberglass material. Ceramic PCBs offer higher heat resistance, better electrical insulation, and greater dimensional stability compared to traditional PCBs. They are commonly used in high-frequency analog circuits and high-power applications such as automotive, aerospace, military and telecommunications.

Choosing the right ceramic PCB manufacturer is crucial to get high-quality and reliable circuit boards for your application. Here are the top 18 companies manufacturing ceramic PCBs globally:

1. RayMing PCB

Location: China

RayMing is number one in designing and manufacturing high-quality ceramic PCBs in China. With over 10 years of experience, they can produce ceramic boards with various dielectric constants and loss tangents to meet different circuit requirements.

Rayming provides ceramic substrates made of materials including aluminum oxide, aluminum nitride, berilium oxide and zirconia. They support dimensions up to 24 x 24 inches and layer counts from single-sided to 4 layers.

Their fabrication capabilities include precision drilling and routing, silver/gold plating, carbon ink screen printing and more. Engineering support is available for optimal ceramic PCB design.

RayMing facilities are ISO 9001 and IATF 16949 certified. Their clients are from various industries like aerospace, defense, telecom and medical.

For more details, visit: https://www.raypcb.com/ceramic-pcb/

2. TTM Technologies

Location: Global

TTM Technologies is one of the world’s largest PCB manufacturers with over 50 facilities across North America, Europe and Asia. Their ceramic substrates division produces high quality boards for RF/microwave and high-rel applications.

TTM utilizes cutting-edge technologies and processes to fabricate ceramic PCBs. They use materials such as aluminum oxide, aluminum nitride, glass ceramic and LTCC in their boards. Metalized vias, blind/buried vias and other HDI structured are supported.

Some of their special capabilities include embedded passives/actives, cavity circuits and coin circuits. Their offerings meet standards like IPC-6012 Class 3 and MIL-PRF-38534.

TTM serves various industries including aerospace, defense, telecom, industrial and medical. They are AS9100 and Nadcap certified.

For more details, visit here

3. KYOCERA

Location: Japan

Founded in 1959, Kyocera is a global manufacturer of ceramic components for the electronics industry. Their products include ceramic PCBs for high-frequency and high-power applications.

Kyocera’s ceramic substrates utilize proprietary formulations of glass ceramic and alumina. Advanced multilayer processes are used to produce boards with fine circuit patterns.

Features like plated through holes, blind/buried vias and embedded passives help meet increasing circuit density requirements. Metal base substrates are also available for high thermal management.

Kyocera’s ceramic PCB technologies support radar systems, satellite communication equipment, medical electronics and more. Their facilities are IATF 16949:2016 certified.

For more details, visit here

4. Maruwa Co., Ltd.

Location: Japan

Maruwa is a Japanese manufacturer of ceramic substrates for electronics. Their offerings include ceramic boards for automotive, telecom, industrial and scientific applications.

Materials used by Maruwa include alumina, aluminum nitride, silica glass, and glass ceramic (LTCC). Metalization options consist of tungsten, molybdenum, copper and more.

Special designs such as metal base substrate, multilayer ceramic capacitors, cavity/channel boards are manufactured. Flex-rigid substrates integrating ceramic and polymer materials are also produced.

Maruwa’s production facilities are ISO 9001 and 14001 certified. Their ceramic solutions meet industrial standards such as IATF 16949. Customers served include major Japanese electronics firms.

For more details, visit here

5. Mitsubishi Materials

Location: Japan

Mitsubishi Materials designs and manufactures ceramic printed circuit boards through its advanced materials division. The company has 60 years of experience working with ceramic substrates.

Their offerings include PCBs made of alumina, aluminum nitride, glass ceramic and other materials. Multilayer boards with buried vias, blind vias and plated heat sinks are fabricated.

Miniaturized ceramic packages and metal base boards for high heat dissipation are also manufactured. Flex-rigid substrates allow integration of ceramic and polymer materials.

Mitsubishi’s production process achieves fine line/space patterns along with excellent dimensional stability. Their products serve telecom infrastructure, automotive electronics, HEV/EV and railcar markets.

For more details, visit here

6. Noritake=Itron Corporation

Location: Japan

Noritake Itron develops and manufactures ceramic printed circuit boards, ceramic packages and other ceramic solutions. The company has 90+ years of experience with ceramics technologies.

Their PCB capabilities include alumina, glass ceramic and aluminum nitride substrates. Multilayer boards using LTCC technology are fabricated for high density packaging.

Special designs like metal base boards, soft-boards with polymer materials and ceramic heaters are produced. Technologies are available for chip bonding, laser marking, flip chip bonding and more.

Noritake caters to wireless communication, automotive, industrial equipment and home appliance markets. Their production facilities are ISO 9001 and 14001 certified.

For more details, visit here

7. International Syalons

Location: UK

International Syalons manufactures technical ceramics for industries like electronics, automotive, aerospace and healthcare. Their offerings include ceramic printed circuit boards made of aluminum nitride and alumina.

Ceramic PCB capabilities include precision machining, metallization using Mo-Mn, W or Cu, gold plating, silver plating, screen printing and laser drilling. The company supports prototyping in addition to volume production.

Syalons’ customers use their ceramic boards for applications such as radar systems, down-hole electronics, space systems and scientific research. Their quality system complies with ISO 9001 standards.

For more details, visit here

8. Remtec, Inc.

Location: USA

Remtec is an American company specializing in ceramic substrates and ceramic RF components. Their offerings for high frequency and high power applications include ceramic printed circuit boards.

Remtec produces single and multilayer ceramic boards made of materials like alumina, aluminum nitride and LTCC. Capabilities include precision machining, screen printing, conformal coating and high-voltage testing.

Their microwave components and ceramic PCBs serve aerospace, defense, telecom infrastructure, medical, oil/gas and other industries. Remtec’s facilities are ITAR registered and ISO 9001:2015 certified.

For more details, visit here

9. Micro Systems Engineering GmbH

Location: Germany

Micro Systems Engineering (MSE) located in Berlin, Germany specializes in manufacturing highly complex ceramic printed circuit boards.

They utilize a broad range of ceramic materials including aluminum oxide, aluminum nitride and glass ceramics (LTCC). Metallization options consist of tungsten, molybdenum, copper and more.

MSE supports PCB designs with multilayer, blind vias, buried vias, filled vias and other structures. They also fabricate ceramic-based thermal management solutions.

Their production process achieves precision PCB fabrication along with controlled material shrinkage. MSE serves clients in telecom, aerospace, automotive and industrial sectors.

For more details, visit here

10. Mini-Systems, Inc.

Location: USA

Mini-Systems is a manufacturer of thick film and thin film substrates for the microelectronics industry. They offer a range of ceramic PCBs based on materials like alumina and beryllium oxide.

Their capabilities include single and double-sided boards, multilayer circuits and metal core substrates. Conductor options include gold, platinum, silver, copper and more. Different substrate shapes, sizes and variations are supported.

Mini-Systems leverages precision machining and photolithography to deliver high-reliability ceramic boards. Applications include aerospace, defense, telecom infrastructure and medical electronics.

For more details, visit here

11. American Technical Ceramics

Location: USA

American Technical Ceramics (ATC) is a manufacturer of electronic components including ceramic substrates and ceramic PCBs. Their ceramic boards support applications in defense, aerospace, telecom, medical, oil/gas and automation.

ATC utilizes materials such as alumina, quartz, LTCC and porcelain for their ceramic solutions. Capabilities include screen printing, cavity circuits, press-fit transducers and hermetic sealing.

Special designs such as metal-core boards, thermal boards and boards with embedded components are manufactured. Flex-rigid PCBs allow integrating ceramic and laminate materials.

ATC’s production facilities have ISO 9001 and AS9100 certifications. Their ceramic substrates meet IPC and military standards.

For more details, visit here

12. CeramTec

Location: Germany

CeramTec is a German manufacturer of technical ceramics including ceramic circuit boards. With over 100 years of experience, they produce ceramic substrates for various high-end applications.

Materials used for their PCBs and SMT packages include aluminum oxide, aluminum nitride and PZT. Laser drilling, screen printing, surface finishing and high-temperature co-firing are utilized in their process.

multilayer boards with blind vias and buried vias are fabricated. Other offerings are DCB substrates, LTCC modules, thick-film circuits and SMD packages. Custom designs can be developed.

CeramTec serves markets such as industrial, defense, medical, energy, lighting, automotive and aviation. Their production network is certified for standards like ISO 9001.

For more details, visit here

13. Egide USA

Location: USA

Egide USA (previously Temex-Ceramics) provides complex ceramic solutions including hermetic packages, ceramic substrates and thermal management devices. Their ceramic PCB capabilities support advanced defense and aerospace systems.

Materials like aluminum oxide, aluminum nitride and beryllium oxide are used to manufacture the substrates. Technologies include screen printing, laser cutting/drilling, metalizing and high-precision machining.

Egide produces both conventionally laminated and high-density LTCC ceramic circuit boards. Flex-rigid PCBs combining ceramic and organic materials are also fabricated.

Their ceramic manufacturing facilities have ISO 9001 and AS9100 certification. Products meet standards such as MIL-PRF-38534 and MIL-I-46058.

For more details, visit here

14. OKI Systems Ltd.

Location: Israel

OKI Systems specializes in developing and manufacturing high-end customized ceramic PCBs and ceramic RF devices. Materials used include alumina, aluminum nitride and glass ceramic.

Their capabilities include single or multilayer boards, hybrid integrated modules, cavity and channel structures, plated through hole vias and more. R&D support is available in addition to mass production.

OKI Systems serves military and aerospace sectors where high-frequency, thermal management and miniaturization needs are critical. Companies served include IAI, Rafael, Aeronautics and more.

For more details, visit here

15. AdTech Ceramics

Location: USA

AdTech Ceramics provides custom ceramic solutions for defense, aerospace, semiconductor equipment, oil/gas and other industries. Their offerings include ceramic substrates for high-frequency applications.

Materials like alumina, aluminum nitride, zirconia and BeO are used to fabricate the ceramic PCBs. Capabilities include multilayer circuits, co-fired components, hermetic sealing and conformal coating.

AdTech’s production process achieves highly precise machined parts along with assembly and testing as required. The company is compliant with ITAR regulations and ISO 9001:2015 standards.

For more details, visit here

16. Vin array Technology Inc.

Location: China

Vin array is a Chinese ceramic substrate manufacturer with capabilities in R&D, fabrication and assembly of ceramic PCBs. Materials include alumina, ZrO2, LTCC.

They specialize in miniaturized multilayer ceramic boards for wireless communication modules. Air cavity PCBs, ceramic antennas and packaging are also fabricated.

Vin array’s production capabilities support fine line printing down to 100um line/space. Their ceramic solutions are used in smartphones, wireless modules, aerospace avionics and high-speed rail.

For more details, visit here

17. ChengDian Electronic Co. Ltd.

Location: China

ChengDian Electronic produces high-quality ceramic substrates for electronics using advanced fabrication technologies. Their ceramic PCB capabilities support RF modules and high-frequency applications.

The company utilizes low temperature co-fired ceramics (LTCC) to develop multilayer circuits with high component density. Materials used include glass ceramic, alumina and aluminum nitride.

ChengDian has in-house facilities for R&D, processing, testing and measurement of ceramic substrates. Products are compliant with RoHS, REACH and other environmental directives.

Key applications include communication equipment, car electronics, LED lighting and industrial controls. ChengDian has ISO 9001 quality certification.

For more details, visit here

18. Keko Equipment Co., Ltd.

Location: China

Keko Equipment located in Shenzhen, China manufactures ceramic PCBs, ceramic packages and other ceramic components. Materials supported include alumina, ZrO2, LTCC, PZT, and LZT.

They specialize in small size ceramic boards with high wiring density for RF modules. Air-cavity ceramic boards for antenna integration are also produced.

Keko’s fabrication process utilizes advanced printing, laminating and firing to produce precision multi-layer ceramic circuits. Custom designs can be developed based on specific requirements.

Their ceramic products serve markets such as telecom, automotive electronics, IoT devices and wearable electronics.

For more details, visit here

FAQs about Ceramic PCB Manufacturers

Here are some commonly asked questions regarding ceramic PCB manufacturers:

Q1. What are the key benefits of using ceramic PCBs?

Some benefits of ceramic printed circuit boards over standard FR4 boards include:

  • Excellent high temperature and thermal performance
  • Low thermal expansion coefficient
  • Higher strength and fracture toughness
  • Better electrical insulation properties
  • Superior high frequency characteristics
  • Can operate at higher voltages
  • Long-term reliability in harsh environments

Q2. What types of ceramics are used to manufacture PCB substrates?

Some commonly used ceramics for PCB substrates are:

  • Aluminum oxide (Al2O3)
  • Aluminum nitride (AlN)
  • Beryllium oxide (BeO)
  • Silica glass
  • Glass ceramic / LTCC

Alumina and aluminum nitride are most popular for high thermal performance. LTCC allows multilayer circuits with high density.

Q3. What are some key applications of ceramic PCBs?

Some major applications of ceramic printed circuit boards include:

  • Aerospace and defense systems
  • Automotive electronics
  • Telecommunication infrastructure
  • Industrial equipment
  • Medical electronics
  • Oil and gas drilling

Ceramic PCBs are used where high-temperature, high-frequency, or other demanding performance is required.

Q4. What types of ceramic packages are manufactured by PCB companies?

Some ceramic packages manufactured by PCB producers include:

  • Ceramic DIP (Dual Inline Package)
  • Ceramic QFP (Quad Flat Package)
  • Ceramic SMT packages
  • Ceramic BGA packages
  • Chip carriers
  • SMD capacitors/resistors
  • Hermetic sealing packages

These protect electronic components and ensure reliable performance.

Q5. What standards are followed during ceramic PCB manufacturing?

Some key standards maintained by ceramic PCB manufacturers are:

  • ISO 9001 – Quality management system
  • IPC 6012 Class 3 – Rigid printed board qualification standard
  • IATF 16949 – Automotive quality management
  • AS9100 – Aerospace industry standard
  • MIL-PRF-38534 – Military printed circuit board spec
  • IPC J-STD-004 – Soldering assembly standard

Compliance to these standards ensures delivery of high-quality and reliable ceramic circuit boards.

 

 

 

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