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Telecom hybrid material PCB

Telecom hybrid material PCB

Telecom hybrid material PCB

Telecom hybrid material PCB Manufacturing

Layer count：4

Board thickness：1.6mm

Dimension：118*57.5mm

Raw material：PTFE+FR4

Copper thickness on the board surface：56um

Copper thickness in the hole barrel：25um

Min.line width/space：0.20mm Minimum hole diameter：0.25mm

Surface finishing：immersion gold≥1u"

Application：Communication[/get_pro1]

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