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Rogers RO4534 PCB

The Rogers ro 4534 are performance/cost materials manufactured and engineered to meet the demands and needs of the antenna markets. This laminate extends the abilities and capabilities of the RO 4000 into the antenna applications.

This glass-reinforced, ceramic-filled material offers low loss performance, controlled dielectric constant, and great passive intermodulation response, which is necessary for applications working for mobile infrastructure microstrip antennas.

The rogers ro4534 laminates are very compatible with lead free high-temperature solder processing and conventional FR4. These laminates don’t need any special treatment required on PTFE-based traditional laminates. This product is a cheap option to antenna technologies that are more conventional, thereby giving the designers the opportunity to maximize the performance and price of their antennas. Moreover, these materials come halogen-free, helping them meet the very strict “green” standards.

More Information about the Rogers RO 4534

The ro 4534 dielectric materials’ resin systems were designed to offer the needed properties for an optimal antenna performance. The CTEs – Coefficient of Thermal Expansion in both directions X and Y share similarities to that of copper. This great match in CTE helps in reducing stresses in the antenna of the printed circuit board (PCB).

The temperature of the typical glass transition of roger ro4534 materials surpasses 280 degrees centigrade, which leads to a low CTE on the z-axis and well-plated via hole reliability. Combining these properties with a dimensional stability value below 0.05% ensures that the ro 4534 laminates are great for PCB antenna applications. These materials also offer increased thermal conductivity, which ensures antenna designs that have increased power handling capability.

Asides from these great thermo-mechanical properties, the ro4534 laminates have electrical properties that designers of antennas need. The dielectric constant of these laminates ranges from 3.3 to 3.5. Measured at 2.5 GHz, it also has a loss tangent of 0.0020 – 0.0037. With these values, antenna designers will be able to realize great gain values coupled with reducing signal loss. These materials come with low PIM performance. Using two swept tones of 43 dBm at 1900 MHz, they have better values than -155 dBC.

Exposing these materials for long hours in any oxidative environment will alter the dielectric properties of the materials. At higher temperatures, the change rate increases, and it greatly depends on the design of the circuit. Although the high frequency materials of Rogers have been used in many applications and oxidation reports which led to performance issues are very rare. Roger has advised that all customers evaluate the design and material combination properly, to help in determining fitness for use over the end product’s entire life.

Features of the ro4534

  • Loss range: 0.0020 to 0.0037
  • Dk range: 3.3 to 3.5
  • Thermoset resin system
  • Great dimensional stability
  • High thermal conductivity
  • Mechanical properties are uniform
  • Low PIM response

Applications

  • WiMAX antenna networks
  • Cellular infrastructure base station antennas

Properties of Rogers RO4534

Rogers RO4534 pcb

The properties of the rogers ro4534 are:

Coefficient of Thermal Expansion

This is also represented as CTE. This helps in measuring the rate at which the ro4534 expansion occurs whenever it is heated up. It is expressed in ppm (parts per million), and measured in PPM/oC. Once there is a risen in the material’s temperature which is higher than the Tg, then the CTE will also increase. The ro4534 has a high coefficient of thermal expansion.

Thermal Conductivity

Thermal conductivity can be represented as k. This property reveals the ability of the material to conduct heat. Whenever this value is low, the there is a low heat transfer, and when it is high, then there is a high heat transfer. The unit of measurement of this property is Watts/meter Kelvin.

Glass Transition Temperature

This property can be represented as Tg. This is the temperature where the substrate changes into a soft state from its initial rigid and glassy state. Measurement is usually done in degrees Celsius.

Decomposition Temperature

This temperature is one at which the material will decompose chemically. Its unit of measurement is degrees Celsius.

Dissipation factor (Df) or Loss Tangent

This is the tan of the phase angle. This is between the resistive and the reactive currents of the dielectric. A rise in dielectric loss happens whenever there is an increase in the dissipation factor.  A low dissipation factor provides fast substrates, while large ones deliver slow substrates.

What to do when Choosing the Rogers 4534

You should consider some things when choosing the rogers ro4534:

Check that the Coefficient of Thermal Expansion matches: The coefficient of thermal expansion has proved to be very significant when handling substrates. Difference in the rates of the coefficient of thermal expansion reveals that during the fabrication process, expansion will take place at different rates.

Materials Chosen Should Have Similar Dielectric Constant: Ensure you go for substrates having dielectric constants that are identical.

Choose Flat and Tight Substrate Weaves: Achieving this ensures you have high-frequency and high-speed usages. This feature also ensures the dielectric constant is distributed evenly.

Choose Materials with Low Moisture Absorption: Moisture absorption deals with the resistance of the PCB material when inserted into water. The weight of the PCB will increase as you get the material absorbed in water.

Don’t Make Use of FR-4 for Applications That Require High Frequency: Avoid this at all cost, because they usually have a high dielectric loss. Asides from this, the Dk is usually sharp anytime it is compared to the frequency response curve.

Benefits of Choosing RO4534

  • Suitable for different applications
  • Higher yield on panels with larger sizes
  • Improved power handling
  • Robust handling
  • Long life when used with thin materials

Conclusion

This glass-reinforced, ceramic-filled material offers low loss performance, controlled dielectric constant, and great passive intermodulation response. These laminates are very compatible with lead free high-temperature solder processing and conventional FR4. These laminates don’t need any special treatment required on PTFE-based traditional laminates. This product is a cheap option to antenna technologies that are more conventional, thereby giving the designers the opportunity to maximize the performance and price of their antennas.