The material you choose is very important when manufacturing printed circuit boards. Most engineers prefer boards with high heat resistance, low coefficient of thermal expansion, and high glass transition temperature. This is because the end results have proved to be great.
Also, one of these materials is the Panasonic HIPER V R-1755V. As expected, Panasonic is well-known for its professionalism when it comes to manufacturing PCB materials. We know you are curious what this material offers already. Also, we will help you understand everything you should know about Panasonic HIPER V R-1755V. However, before that let us know what the material is. Stay with us as we help you learn.
What is the Panasonic HIPER VR-1755V Material?
The Panasonic HIPER V R-1755V material is known as the high reliability glass epoxy multi-layer material. This material is known for its low coefficient of thermal expansion and high glass transition temperature.
Also, the main highlights of its properties include a glass transition temperature of 173 degrees Celsius, a dielectric constant of 4.4, a dissipation factor of 0.016, and lastly a delamination time of 20 minutes with copper. Due to its great properties, this material is useful in measuring instruments, ICT infrastructure equipment, etc.
Furthermore, the laminate of the Hiper V material is the R-1755V, while the prepreg is R-1650V. Please continue reading as we focus on the properties of this material.
What are the Properties of the Panasonic HIPER V R-1755V Material?
When we talk about the properties of this material, we are referring to what makes this material what they are and what makes them unique and different from other materials. We will be categorizing the properties of this material into three. These include its thermal, mechanical, and electrical properties.
Thermal Properties
Glass transition temperature (Tg)
Making use of the DSC test method, the Panasonic HIPER V R-1755V material has a glass transition value of 173 degrees Celsius. Furthermore, for the DMA and TMA test methods, the Panasonic HIPER V R-1755V material has a value of 190 and 165 respectively.
Also, at this temperature, glass transition occurs. This is usually lower when you compare it to the melting temperature of the material’s crystalline state. In addition, at this specific temperature, the Panasonic HIPER V R-1755V material changes to a brittle and hard state from its ductile state.
Coefficient of Thermal Expansion
At the Z-axis, the Panasonic HIPER V R-1755V material has a Coefficient of thermal expansion (CTE) value of 44 ppm/℃ at α1. While at α2, its CTE value is 255 ppm/℃. Also, for the X axis, they have a CTE value at α1 to be 11 – 13 ppm/℃, while for the Y-axis, this material has a value at α1 to be 13 -15 ppm/℃.
What this property indicates is the extent at which the Panasonic HIPER V R-1755V material can expand anytime it is heated.
Thermal decomposition
Using the TGA test method, the Panasonic HIPER V R-1755V material has a thermal decomposition value of 350 degrees Celsius. Also, this thermal decomposition value signifies the temperature at which the Panasonic HIPER V R-1755V material decomposes chemically.
Delamination Time (T288)
The Panasonic HIPER V R-1755V material has a delamination time that is greater than 120 minutes without copper. With copper, this material has a delamination time of 20 minutes.
Delamination time tells the time needed for a PCB’s base material to delaminate anytime when subjected to a 288 degrees Celsius temperature using TMA (Thermomechanical analyzer). Also, delamination refers to separating each of the layers.
Electrical Properties
The electrical properties of the Panasonic HIPER V R-1755V material include dielectric constant, dissipation factor, surface resistivity, and volume resistivity.
Dielectric Constant (Dk)
The Panasonic HIPER V R-1755V material has a dielectric constant of 4.70 at 1MHz, while at 1GHz, it has a value of 4.44. Dielectric constant refers to the quantity that measures a material’s ability to store some electrical energy in a given electric field
Dissipation Factor (Df)
This material has a dissipation factor of 0.013 at 1MHz, while at 1GHz, its value is 0.016. This value indicates the material’s inefficiency to act like an insulator. Furthermore, this material has a low dissipation factor; therefore, it is very efficient as an insulating material.
Surface Resistivity
The Panasonic HIPER V R-1755V material has a surface resistivity value of 1 x 108 MΩ. This property measures the insulation or electrical resistance of a printed circuit board material’s surface. It refers to the resistance of the material to any leakage current.
Volume Resistivity
The Panasonic HIPER V R-1755V has a volume resistivity 1 x 109 MΩ. This property helps in the measurement of this material’s electrical resistance or insulation. This material has a high volume resistivity. This means that less movement of electric charge will happen in the circuit.
Physical Properties
Peel strength
The peel strength of the Panasonic HIPER V R-1755V material is 1.5 kN/m. Generally, this value helps in measuring the material’s bond strength, most likely an adhesive. Also, it refers to the bonding ability of the copper and dielectric layers in printed circuit boards.
Water Absorption
For water absorption, the Panasonic HIPER V R-1755V has a value of 0.12%. This has a low water absorption rate. This means that the material has what it takes to remain strong, and prevent water absorption.
Flammability
For flammability, the Panasonic HIPER V R-1755V is rated 94V-0. This rating ensures that there is fire protection and electrical safety of the electronic components. 94V-0 means that the material has the ability to tolerate some exposure to flame without any ignition.
Conclusion
By now, you have a good understanding of what the Panasonic HIPER V R-1755V material is all about. To summarize, we will say that it is a high reliability glass epoxy multi-layer material. This material is known for its low coefficient of thermal expansion and high glass transition temperature. It is useful in measuring instruments, ICT infrastructure, equipment, and more. If you need more explanation in any of these areas, please let us know. We are always here for you.
