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What are the Main Features and Properties of the doosan DS-7402LC PCB Material?

PCB materials form an integral part of different applications and are useful in different areas. This is why they are very important today, especially in the field of engineering. One important thing to note is to choose a pcb material with high reliability and suitability to your engineering needs.  It also needs to have the right features and properties that work with your project. We have a good suggestion for you and this one is from Doosan Electronic.

In this article, we will be discussing the Doosan DS-7402LC PCB Material. It has high reliability due to its low dielectric constant, low dissipation factor, high glass transition temperature and low coefficient of thermal expansion. To understand better, we will be talking more about the main features, properties, and applications of the Doosan DS-7402LC. Please read on as we explain further.

What is the DS-7402LC PCB Material?

Just like other PCB materials, the Doosan DS-7402LC PCB Material comes with its own unique features. The Doosan DS-7402LC PCB Material is well-known for its low dielectric constant, low dissipation factor, high glass transition temperature and low coefficient of thermal expansion.

It has other great properties, which include flexural strength, Peel strength Storage modulus, and Young’s modulus. All these great features make it very useful as a material for printed circuit boards of different applications. Furthermore, this PCB material is useful in SLP for Smartphones, EFSSD and Interposer.

With all these, we can say that the Doosan DS-7402LC PCB Material has excellent reliability. Please let’s go further in this article, as we elaborate on the main features of this material.

What are the Main Features of the Doosan DS-7402LC PCB Material?

The main features of the Doosan DS-7402LC PCB Material include the following:

Low coefficient of thermal expansion

One great feature of the Doosan DS-7402LC PCB Material is its low coefficient of thermal expansion. This property (CTE) indicates the manner at which a material will expand for every 1 degree centigrade increase in temperature. This means that the material’s shape will not be significantly affected during any change in temperature.

 High Temperature for glass transition

For those new to this, temperature for glass transition or glass transition temperature is the temperature whereby a specific material like the Doosan DS-7402LC PCB Material transforms from a one that is ductile to something brittle and hard.

For the Doosan DS-7402LC PCB Material, we can see that it has a high Tg. This once again proves that this material has high reliability.

Low dielectric constant

A material’s dielectric constant is very necessary for impedance considerations and signal integrity. These factors are very important and critical for high electrical performance.

The Doosan DS-7402LC PCB Material has a low dielectric constant, which makes it very useful for high power and frequency applications. This helps in reducing any loss of electric power.

Low Dissipation factor

Dissipation factor helps in measuring the insulating material’s inefficiency. This property also reveals how much or how effective a material will be in different environments and applications. This also indicates a material’s inefficiency to act like an insulating material or hold energy. The Doosan DS-7402LC PCB Material has a low dissipation factor. This means that its insulator system is more efficient.

Please read on as we talk about the properties of this material.

What are the Properties of the Doosan DS-7402LC PCB Material?

The properties of the Doosan DS-7402LC are categorized into three. These include thermal properties, mechanical properties, and electrical properties. Let’s quickly consider them.

Thermal Properties

The Doosan DS-7402LC has a glass transition temperature (DMA) of 175 degrees Celsius and a decomposition temperature of 380 degrees Celsius. Furthermore, its T-288 value is greater than 15 minutes.

At the X.Y axis, it has a coefficient of thermal expansion (CTE) of 11/10 ppm/℃. Also, at the Z axis, the CTE is 19/150 ppm/℃. In addition, it has a thermal conductivity of 0.65 W/m·k. In addition, the maximum operating temperature is 130 degrees Celsius, while the Z expansion is 1.5%.

Mechanical Properties

The following are the mechanical properties of the Doosan DS-7402LC PCB Material. The Doosan DS-7402LC has a Young’s modulus value of 33 GPa, while its Flexural strength is 33 Mpa. Furthermore, its storage modulus is 32 GPa and lastly, it has a peel strength of 1.05 kgf/cm.

Electrical Properties

The electrical properties of the Doosan DS-7402LC PCB Material include the following. It has a dielectric constant of 4.0 at 1GHz. Also, at 1GHz, it has a Df value of 0.011. Both values (dielectric constant and dissipation value) are low, which makes them suitable and reliable in different applications.

Other Properties

Other physical properties of the Doosan DS-7402LC PCB Material aside from the ones mentioned above. These include the water absorption and flammability. This PCB material has a flammability rating of V-0. This means that burning has to stop in 10 seconds.

Also, its water absorption is at 0.1%. Water absorption is the quantity of water that the material absorbs.

Applications of the Doosan DS-7402LC PCB Material

The Doosan DS-7402LC PCB material is useful in these applications.

Interposer

An interposer is described as an interface routing present between one connection or socket to another. This helps in spreading the connection onto a wider pitch. It also helps in rerouting a connection to different connections.

SLP for Smartphones

The Doosan DS-7402LC PCB material is very useful in SLP for Smartphones to connect between motherboards and components like fingerprint modules, display modules, etc.

EFSSD

The Doosan DS-7402LC is also useful in solid state device for server

Conclusion

We hope we have been able to explain what the Doosan DS-7402LC PCB material is all about. Its general features, properties, and applications. One significant thing you must remember is that this PCB material has high reliability due to its low dielectric constant, low dissipation factor, high glass transition temperature and low coefficient of thermal expansion. It is also very useful in different applications. If you have any more questions, please feel free to contact us here.