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Arlon 47N PCB Material – The Best Solution for Bonding Multilayer Epoxy Rigid-flex

PCB manufacturers are familiar with a lot of materials. For a PCB to function well, several materials are used. However, some materials are specifically designed to meet some certain demands. Arlon 47N isn’t just a regular PCB material. This material is specially designed for heat sink bonding applications. Therefore, we will look further into this material and what it offers.

What is Arlon 47N PCB Material?

Arlon 47N PCB material is a low-flow epoxy prepreg designed for fixing heat sinks to multilayer boards. Also, this material is ideal for bonding multilayer epoxy. It features a minimal lamination temperature that shields components mounted on circuit boards. Arlon 47N is an improved epoxy low flow prepreg system with excellent properties.

This material features discrete fiberglass styles and flow ranges for enhanced process flexibility. Arlon 47N features excellent mechanical, thermal, and electrical properties. All of these properties meet the PCB industry standards. In addition, Arlon 47N PCB material is a cost effective option for high volume commercial applications.

Properties of Arlon 47N PCB Material

Low glass transition temperature

The glass transition temperature of Arlon 47N is 135 degrees Celsius at TMA and DSC. This is a very low Tg value. This means that this material can’t function well in a high thermal environment. Arlon 47N can transform from a solid state to a rubber-like state when it is at 135 degrees Celsius.

High decomposition temperature

The decomposition temperature of this material is 305 degrees Celsius. This means that this material won’t decompose easily. Also, it can only decompose chemically when it is at 305 degrees Celsius. However, the decomposition temperature at 5% weight loss is 315 degrees Celsius.

Very low dissipation factor

The dissipation factor of Arlon 47N PCB material is very low. Also, it features a dissipation factor of 0.02 at 1MHz. Therefore, this material can hardly absorb or discharge heat when exposed to varying temperatures. Also, it is a good insulator system.


The coefficient of thermal expansion is 16 ppmo/C at both X and Y axis. However, the Z-axis CTE is 85 ppmo/C. Therefore, this material can withstand varying degrees of temperature without expanding easily.

High peel strength

Arlon 47N PCB material features very high peel strength. The peel strength is 9.0 (1.6) Ib/in (N/mm) at increased temperatures and after thermal stress. Also, this value is the same after process solutions. This property helps 47N offer great bonding to multilayer boards.

Great surface resistivity

The surface resistivity of Arlon 47N is 8.8 x 106 at C96/35/90. Also, surface resistivity of this material is 1.5 x 106 at E24/125.

Low water absorption

The water absorption rate of 47N is 0.1%. Therefore, this material is ideal for use in PCBs used in humid environments.

Processing Conditions of Arlon 47N

Use the standard practices in the industry to process inner layers. The inner layers should be baked for 60 minutes between 107 degrees Celsius and 121 degrees Celsius. Also, this vacuum desiccates the prepreg system for about 12 hours before lamination.

Below are the lamination and drilling processes:

  • Pre-vacuum within 30-45 minutes
  • Regulate the rise of heat to about 12oF per minute.
  • The cure temperature of the product should be 171 degrees Celsius.
  • Cure time at temperature should be 1 hour.
  • Use alkaline permanganate to desmear. Also, you can use plasma desmear. Plasma is ideal for achieving positive etchback.
  • Arlon 47N PCB material is compatible with conventional plating processes
  • You can make use of standard profiling parameters. However, we don’t recommend chip breaker style routers.
  • Also, you should bake for 1 to 2 hours at 121 degrees Celsius before HASL or solder reflow.

Impacts of Low Glass Transition Temperature on Arlon 47N

The low glass transition temperature (Tg) is an important property in PCB materials. This property measures the temperature at which Arlon 47N transforms to a rubber-like state. Also, this value determines the mechanical stability of this material.

Arlon 47N offers a low Tg value. Therefore, this material offers a smaller expansion than materials with high Tg values. The operating temperature of Arlon 47N must not exceed 135 degrees Celsius. Arlon 47N will maintain its solid structure if it isn’t exposed to temperatures beyond its limit. Also, the glass transition temperature of Arlon 47N is low. However, a material with high Tg value is ideal for PCBs subjected to hot environments. Therefore, Arlon 47N can only function well below 135 degrees Celsius.

Advantages of Arlon 47N

There are several benefits offered by Arlon 47N. This material offers exceptional benefits. Therefore, these benefits include:

Industry approval

Arlon 47N meets the requirements and specifications of most industry standards. Also, the electrical and mechanical properties meet the specifications of IPC-4101/21. In addition, Arlon 47N complies with RoHS/ WEEE standards. Therefore, this PCB material is ideal for PCB fabrication.

Great bond strength

Arlon 47N has improved bond strength to copper. Therefore, it provides great performance in heat sink bonding. Also, the cure temperature of this material is as low as 150 degrees Celsius.

Optimal process flexibility

This material features great process flexibility. This is because of its discrete fiberglass styles and flow ranges. Also, the reduced lamination temperature shields components installed on the PCB.

Cost effective

Arlon 47N is a cost-effective option for PCB fabrication. Therefore, it is suitable for high volume commercial applications.

Great performance

Arlon 47N PCB material offers properties that contribute to its great performance.

Lead-free process compatibility

Arlon 47N has no lead components. In addition, it is compatible with lead-free processing. Therefore, it is an ideal polyimide prepreg system for circuit boards.

Typical Applications of Arlon 47N PCB Material

Arlon 47N PCB material is primarily designed for bonding multilayer epoxy. This material is useful in:

  • Bonding multilayer epoxy rigid-flex
  • Dielectric insulators
  • Attaching heat sinks to polyimide multilayer boards.


Arlon 47N is a PCB material with exceptional properties. Also, this material was specially formulated to bond multilayer epoxy rigid-flex. In this article, we have discussed the impact of this material on PCB fabrication.