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What You Need to Know About Xilinx XCZU9EG-2FFVB1156I SoC FPGA

Xilinx XCZU9EG-2FFVB1156I doubles as a System on a Chip (SoC) and a Field Programmable Gate Array (FPGA).

It is one of the SoCs categorized under the Zynq UltraScale + MPSoC series by Xilinx. In this article, you will learn about some of the things you needed to know about this Integrated Circuit (IC).

Powered by Powerful Processors

In line with latest trends in FPGA development, the Xilinx XCZU9EG-2FFVB1156I is powered by some of the best processors.

These processors are sourced from ARM, one of the leading brands in the market. As per the information in the datasheet, Xilinx XCZU9EG-2FFVB1156I is powered by three (3) core processors.

Here are some of the processors and what they have to offer:

1. ARM Mali-400 MP2

ARM Mali-400 MP2 is one of the processors used in Xilinx XCZU9EG-2FFVB1156I’s design. According to NotebookCheck.com, the processor is an OpenGL ES 2.0-capable GPU used for System on a Chip (SoC) manufactured by ARM.

The ARM Mali-400 MP2 is the GPU’s version of two cores and a vertex processor.

One of the attributes is cost-saving, being that the manufacturer designed it to reduce both the bandwidth and power consumption of devices.

2. ARM Cortex R5

The ARM Cortex R5 is another core processor used in Xilinx XCZU9EG-2FFVB1156I. It helps on enabling the implementation and integration of the Xilinx XCZU9EG-2FFVB1156I SoC into both safety-critical and embedded real-time applications.

3. ARM Cortex A53

This is the third core processor found in Xilinx XCZU9EG-2FFVB1156I. Its primary function is to provide improved performance for a wide range of applications, such as aerospace, storage, mobile and automobile applications.

Technical Specifications of Xilinx XCZU9EG-2FFVB1156I

Now that you know some of the core processors, let us talk about the technical attributes. The table below shows some of the technical elements or components making up the Xilinx XCZU9EG-2FFVB1156I System on a Chip (SoC).

Technical AttributesDescription
Number of Logic Elements (LE)599,500
Number of Logic Array Blocks (LABs)34,260
Distributed RAM8.8 Mbit
Embedded Block RAM (EBR)32.1 Mbit
Operating Temperature (min-max)40-degree Celsius to 100-degree Celsius
Number of Cores7
Moisture Sensitivity Level (MSL)Yes, 4 (72 hours)
RAM Size256 kilobytes
Package/Case1156-BBGA, FCBGA
Number of Transceivers24
Number of I/O352
Clock Frequency (maximum)600 MHz, 667 MHz, and 1.5 GHz

Xilinx XCZU9EG-2FFVB1156I Buying Guide

Certain factors are worth considering before paying for a Field Programmable Gate Array (FPGA) or a System on a Chip (SoC).

In the case of Xilinx XCZU9EG-2FFVB1156I, here are some of the things we would like you to look out for.

1. Connectivity and Peripherals

One of the things you want to look for is both the connectivity and peripherals making up the IC. For example, the peripherals and connectivity help bolster the transmission of data and signals on the board.

Xilinx XCZU9EG-2FFVB1156I has several connectivity options, ranging from CANbus, USB OTG and Ethernet.

2. Buying Source

Where do you intend on buying the Xilinx XCZU9EG-2FFVB1156I SoC? The supplier should among many other things, have a Minimum Order Quantity (MOQ), competitive pricing and faster delivery timeframe.

Conclusion

To wrap it up, contact RayPCB to help configure the Xilinx XCZU9EG-2FFVB1156I SoC with all the additional components and specifications you want it to have.