1. Product Specifications
Core Architecture
| Specification | Value |
|---|---|
| Part Number | XA7A35T-2CSG325I |
| Manufacturer | AMD Xilinx |
| Product Family | Artix-7 FPGA |
| Logic Cells | 33,280 |
| CLB (Configurable Logic Blocks) | 5,200 |
| Speed Grade | -2 (628 MHz) |
| Process Technology | 28nm HPL HKMG |
Memory and Storage
| Feature | Specification |
|---|---|
| Block RAM | 1,800 Kbits (36Kb dual-port blocks) |
| Distributed RAM | 400 Kbits |
| Memory Interfaces | DDR3 up to 1,866 Mb/s |
| Built-in FIFO | Integrated for data buffering |
I/O and Connectivity
| Parameter | Value |
|---|---|
| User I/Os | 150 |
| Package Type | 325-pin CSBGA (Ball Grid Array) |
| Package Size | 15mm x 15mm |
| Pitch | 0.8mm |
| SelectIOโข Technology | High-performance with DDR3 support |
DSP and Processing
| Feature | Specification |
|---|---|
| DSP Slices | 90 |
| DSP Performance | 5.3 TMAC/s |
| 18×25 Multipliers | 90 |
| MMCM/PLL | 5 clock management tiles |
Power and Environmental
| Parameter | Value |
|---|---|
| Supply Voltage | 0.95V to 1.05V (VCCINT) |
| I/O Voltage | 1.2V, 1.5V, 1.8V, 2.5V, 3.3V |
| Operating Temperature | -40ยฐC to +100ยฐC |
| Power Consumption | 50% less than previous generation |
Advanced Features
- 6-input LUT (Lookup Table) technology configurable as distributed memory
- XADC (Xilinx Analog-to-Digital Converter) with dual 12-bit 1MSPS converters
- Built-in thermal and supply sensors for system monitoring
- 32 global clock networks with high fanout capability
- Advanced clock management with low jitter and high precision
2. Pricing Information
Current Market Pricing (XA7A35T-2CSG325I)
Volume Pricing Tiers:
- 1-125 units: $160.99 per unit
- 126-251 units: $149.33 per unit
- 252-503 units: $125.99 per unit
- 504-755 units: $114.33 per unit
- 756-1007 units: $103.59 per unit
- 1008+ units: $90.99 per unit
- 12,600+ units: $85.40 per unit
Pricing Notes:
- Prices are subject to market fluctuations
- Lead times may vary based on global demand
- Volume discounts available for large orders
- Contact authorized distributors for current pricing and availability
- Educational and research discounts may be available
Authorized Distributors:
- DigiKey Electronics
- Farnell/Element14
- Mouser Electronics
- FPGAkey
- Jotrin Electronics
- Ovaga Technologies
3. Documents & Media
Technical Documentation
Datasheets and Reference Manuals:
- XA7A35T-2CSG325I Product Datasheet (PDF)
- Artix-7 FPGA Family Overview (ds180)
- Artix-7 FPGA Data Sheet: DC and AC Switching Characteristics (ds181)
- Artix-7 FPGA Package and Pinout Specifications (ug475)
Design Guides and Application Notes:
- 7 Series FPGAs Configurable Logic Block User Guide (ug474)
- 7 Series FPGAs Memory Interface Solutions User Guide (ug586)
- 7 Series FPGAs DSP48E1 Slice User Guide (ug479)
- 7 Series FPGAs SelectIO Resources User Guide (ug471)
Software and Tools
Development Software:
- Vivado Design Suite – Primary development environment
- ISE Design Suite – Legacy support (deprecated)
- Vitis Unified Software Platform – For system-level design
IP Cores and Libraries:
- Xilinx IP Catalog – Pre-verified IP cores
- AXI Interface IP – Bus protocol implementations
- DSP IP Cores – Signal processing functions
- Memory Controller IP – DDR3/DDR4 interfaces
Evaluation Boards and Kits
Development Platforms:
- Arty A7-35T – Digilent development board
- Cmod A7-35T – Compact breadboard-compatible module
- Basys 3 – Educational development platform
4. Related Resources
Alternative Part Numbers
XA Series Variants:
- XA7A35T-1CSG325I – Speed grade -1 variant
- XA7A35T-3CSG325I – Speed grade -3 variant
- XA7A35T-2CSG324I – 324-pin package variant
XC Series Equivalents:
- XC7A35T-2CSG325I – Commercial temperature grade equivalent
- XC7A35T-2CSG325C – Commercial grade, cost-optimized version
Family Alternatives
Smaller Capacity Options:
- XA7A25T-2CSG325I – 25,000 logic cells
- XA7A15T-2CSG325I – 15,000 logic cells
Higher Capacity Options:
- XA7A50T-2CSG325I – 50,000 logic cells
- XA7A75T-2CSG325I – 75,000 logic cells
- XA7A100T-2CSG325I – 100,000 logic cells
Application Examples
Target Applications:
- Industrial Automation – Control systems and sensor interfaces
- Automotive Electronics – ADAS and infotainment systems
- Consumer Electronics – Audio/video processing
- Communications – Protocol processing and packet handling
- Medical Devices – Signal processing and data acquisition
- IoT Edge Computing – Intelligent sensor nodes
Technical Support Resources
Online Communities:
- AMD Xilinx Developer Forums – Community support
- Stack Overflow – Programming questions and solutions
- Reddit FPGA Community – Discussion and troubleshooting
Training and Education:
- AMD Xilinx Training Courses – Official certification programs
- University Program – Academic licensing and support
- Webinar Series – Regular technical presentations
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- Status: RoHS Compliant (Lead-free)
- Directive: 2011/65/EU compliant
- Material Composition: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) solder balls
- Halogen Status: Halogen-free available
REACH Compliance:
- Registration: REACH compliant per EC 1907/2006
- SVHC Status: No Substances of Very High Concern above threshold levels
- Material Declaration: Available upon request
Package and Materials
Package Information:
- Package Type: 325-pin CSBGA (Chip Scale Ball Grid Array)
- Body Material: BT (Bismaleimide Triazine) substrate
- Lead Frame: Copper alloy
- Die Attach: Silver-filled epoxy
- Mold Compound: Halogen-free epoxy molding compound
Recycling and Disposal:
- WEEE Directive Compliance: 2012/19/EU compliant
- Recycling Classification: Electronic waste category
- Disposal Guidelines: Follow local electronic waste regulations
Export Control and Regulations
US Export Control:
- ECCN (Export Control Classification Number): 3A001.a.7
- License Requirements: May require export license for certain destinations
- Dual-Use Technology: Subject to Export Administration Regulations (EAR)
International Compliance:
- Wassenaar Arrangement: Covered under dual-use technology controls
- Country Restrictions: Check current export regulations for destination country
- End-Use Restrictions: Military and aerospace applications may require additional licensing
Quality and Manufacturing Standards
Quality Certifications:
- ISO 9001:2015 – Quality Management System
- ISO 14001:2015 – Environmental Management System
- IATF 16949 – Automotive quality standard (where applicable)
- AS9100 – Aerospace quality standard (where applicable)
Manufacturing Standards:
- IPC Standards: Compliant with IPC-A-610 acceptance criteria
- JEDEC Standards: Meets JEDEC specifications for semiconductor devices
- MSL (Moisture Sensitivity Level): Level 3 per JEDEC J-STD-020
Conflict Minerals:
- Status: Conflict minerals compliant
- Tin, Tantalum, Tungsten, Gold: Sourced from certified smelters
- Dodd-Frank Act: Section 1502 compliant
Summary
The XA7A35T-2CSG325I represents an ideal balance of performance, power efficiency, and cost-effectiveness for mid-range FPGA applications. With its 33,280 logic cells, advanced DSP capabilities, and comprehensive I/O options, this device is perfectly suited for applications requiring real-time processing, connectivity, and low power consumption. The compact 325-pin CSBGA package and industrial temperature range make it suitable for space-constrained and harsh environment applications.
For technical support, current pricing, or custom engineering services, contact your local AMD Xilinx distributor or visit the official AMD Xilinx website for the latest documentation and design resources.
