Rogers RO3000 and RO3200 Series High Frequency Circuit Materials, developed by Rogers Corporation, are designed for high-frequency, high-speed digital applications. Fabrication guidelines for these materials emphasize careful handling to maintain dimensional stability and electrical performance. Key considerations include using sharp cutting tools, controlling drilling speeds and pressures, and implementing proper copper etching techniques. Temperature management during lamination and drilling is crucial to prevent material degradation. Plated through-hole processes require attention to chemistry and cycle times. These materials offer excellent electrical properties and are compatible with standard PCB fabrication processes when following recommended guidelines, ensuring optimal performance in demanding RF and microwave applications.