How to Read and Understand Xilinx Part Numbers and Abbreviations

Understanding Xilinx part numbers and abbreviations is crucial for engineers and procurement professionals working with FPGA and SoC devices. This comprehensive guide breaks down the naming conventions, explains various abbreviations, and helps you decode Xilinx product families and their specifications.

Basic Structure of Xilinx Part Numbers

General Format

The basic structure of a Xilinx part number follows this pattern:

Product Family Prefixes

Decoding Device Families

FPGA Families

Zynq SoC Families

Speed Grade Classifications

Speed Grade Indicators

Temperature Grades

Temperature Range Specifications

Package Types and Codes

Common Package Formats

Package Size Indicators

Device Grade Specifications

Quality and Reliability Grades

Common Abbreviations and Terms

Technical Abbreviations

Example Part Number Analysis

Sample Breakdown

For the part number: XC7VX485T-2FFG1761-1C

Advanced Features and Specifications

Memory Configurations

Frequently Asked Questions (FAQ)

Q1: How do I determine the performance capability of a Xilinx device from its part number?

A1: Look at the speed grade indicator in the part number (-1, -2, -3, etc.). Higher numbers indicate better performance. The presence of ‘L’ (like -1L) indicates lower power variants. Additionally, check the family designation (Virtex, Kintex, Artix) as different families target different performance levels.

Q2: What’s the difference between commercial (C) and industrial (I) temperature grades?

A2: Commercial grade (C) operates from 0°C to +85°C and is suitable for standard indoor applications. Industrial grade (I) operates from -40°C to +100°C and is designed for harsh environments. Industrial grade devices undergo additional testing and typically cost more than commercial grade.

Q3: How can I identify if a part is suitable for automotive applications?

A3: Look for the ‘XA’ prefix in the part number and the ‘A’ temperature grade indicator. These parts are specifically qualified for automotive use with an operating range of -40°C to +125°C and meet additional quality and reliability requirements.

Q4: What does the number in the package code represent?

A4: The number in the package code (e.g., FFG1761) represents the total number of pins or balls on the device. In this example, 1761 indicates a 1,761-ball grid array package. This number is crucial for PCB design and mechanical considerations.

Q5: How do I interpret the device size number in the part number?

A5: The device size number (e.g., 485 in VX485T) approximately represents the number of logic cells in thousands. For example, VX485T has approximately 485,000 logic cells. This number helps in determining the device’s capacity for your application.

Conclusion

Understanding Xilinx part numbers and abbreviations is essential for selecting the right device for your application. The structured naming convention provides crucial information about the device’s family, performance capabilities, package type, and environmental specifications. By breaking down each component of the part number, engineers can make informed decisions about which Xilinx device best meets their project requirements.

Remember that part numbers may vary slightly between different product generations, and Xilinx occasionally introduces new naming conventions with new product families. Always refer to the latest product documentation for the most current information about specific device specifications and features.