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Xilinx XC7A100T-2FGG676i Component

The Xilinx XC7A100T-2FGG676i device belongs to the Artix-7 family of FPGAs. The device is available in different speed grades such as -1LI, -2, -2L, -1, and -3. The highest speed grade is -3 with the best achievable performance. This device is operating predominantly at a voltage of 1.0V. Whereas, the -2L and -1LI grade devices are separated for achieving lower static power and can also be operated at low core voltages for the applications where low dynamic power is required when compared to the devices of -2 and -1 speed grades. The speed grade devices of -1LI are operating whenever the VCCINT is equivalent to 0.96 volts and the speed specifications must also be equivalent to that of -1 grade devices. The devices of -2L grade can operate at two different values of VCCINT i.e., 1.0V and 0.9V. These grade devices are separated for achieving low static power.

The specification of speed for -2L devices is equivalent to -2 grade devices whenever operated at VCCINT of 1.0 volts. The dynamic and static power of the -2L devices is reduced whenever operated at the VCCINT equal to 0.9V. Both AC and DC characteristics of the Xilinx XC7A100T-2FGG676i devices are specified in different ranges for their utilization on different scales such as commercial, military, expanded, and industrial temperature ranges. The expanded temperature range is denoted with -1Q and the military temperature range with -1M. It has to be noted that the range of junction temperature and supply voltages are a representation of the worst-case scenarios only.

Sequencing of Supply for Power ON/OFF

The power-ON sequence that is recommended for Xilinx XC7A100T-2FGG676i is initiating with the powering VCCINT, then VCCBRAM, followed by VCCAUX, and ending at VCCO for achieving the minimal possible drawl of current and ensuring all of the inputs/outputs to be in a three-stated Power-ON stage. While the power-OFF sequence recommended for the device is opposite to that of the power-ON sequence. If VCCBRAM and VCCINT are having the equivalent level of voltages that are recommended then both can have power from the same supply and their ramping is also possible simultaneously. If VCCO and VCCAUX are having the equivalent level of voltages that are recommended then both can have power from the same supply and their ramping is also possible simultaneously. For the voltages of VCCO at 3.3 volts in the input/output and reconfiguration banks, its voltage difference is among VCCAUX and VCCO should not be exceeding 2.625 volts for every of its powering ON and OFF cycles for maintaining levels of reliability of the device.

The sequence of power-ON that is recommended for Xilinx XC7A100T-2FGG676i for achieving minimal drawl of current for its transceivers is to be followed starting with VCCINT, then VMGTAVCC, followed by VMGTAVTT, VCCINT, and ending at VMGTAVTT. Here, both the VCCINT and VMGTAVCC could be ramped simultaneously. The power-OFF sequence that is recommended for the device is opposite to the power-ON sequence for achieving minimal drawl of current. Whenever the sequences that are recommended for the operation of the device are not followed, then the drawl of current from VMGTAVTT could become higher than required while powering-DOWN or powering-UP the device.

AC Switching Characteristics

The represented values for the AC characteristics of the Xilinx XC7A100T-2FGG676i device are grounded on the specification of the speed of its design suite outlined by the manufacturer. However, all of the switching characteristics are stated for each speed grade of the device and are also designated in the categories of preliminary, advanced, or production.

AC Switching Characteristics Testing

The parameters for internal timing are usually derived from the measurement of the test patterns on the internal side of the Xilinx XC7A100T-2FGG676i. Therefore, all of the AC switching characteristics have a representation of the worst-case scenario for its junction temperature and voltage conditions. The reported values of the analyzer for static timing can be used for precise, specific, and worst-case definite data for back-annotating the netlist of simulation. Otherwise, all of the values noticed are to be applied for the Artix-7 family of FPGAs.

Software Status and Production Silicon

In fewer instances, for a specific device, its speed grade is announced for production but its specifications of speed are announced only when its correct label is released such as preliminary, advanced, and production. Any of its classification inconsistencies are then troubleshot in upcoming releases of the device speed specifications.

IOB Pad Output/Input of Xilinx XC7A100T-2FGG676i

TIOPI is elaborated as the delay from the IOB pad along with the buffer input to that of the I-pin of the IOB pad. This delay is varying and depends on the capacity of the SELECTIO buffer input. The TIOOP of Xilinx XC7A100T-2FGG676i is elaborated as the delay from pin O to that of the IOB pad along with the buffer output for the IOB pad. This delay is also varying and is dependent on the capacity of the SELECTIO buffer output. TIOTP is elaborated as the delay of the T pin to that of the IOB pad at which the buffer output of the IOB pad at the time when the three-state is made disabled. This delay is varying depending on the SELECTIO capacity of the buffer output.

Output Delay Measurements

The delays at the output are measured along the minor traces at the output. Standardized termination is utilized for testing. The trace’s propagation delay is characterized independently and then subtracted from terminal measurement, and this calculation is not included in the generic testing of the device Xilinx XC7A100T-2FGG676i. Different parameters like VMEAS, RREF, VREF, and CREF are entirely described for testing the scenarios of input/output standards. The precise detection of the propagation delay through any application is acquired with help of IBIS simulation. First of all, the output driver is simulated using the generic testing set up through the utilization of different values. VMEAS value is recorded. The output driver is then simulated for the real trace of PCB and is then loaded through the utilization of the suitable IBIS model or any value of capacitance for representation of the load. VMEAS value is again recorded. The results are then compared and any decrease or increase in the values is yielding to the trace’s real propagation delay.