Xilinx XA6SLX16-2CSG225Q Introduction

Mounting Type:  Surface Mount

 

Logical Description: IC, Xilinx DS170 XA Spartan-6 Automotive FPGA Family

 

Physical Description: Ball Grid Array (BGA), 0.80 mm pitch, square; 225 pin, 13.00 mm L X 13.00 mm W X 1.40 mm H body

 

 

IC XA6SLX16-2CSG225Q

 

 

Product Attributes

 

Maximum Number of User I/Os : 160 Number of Registers: 18224
RAM Bits: 576Kbit Device Logic Cells: 14579
Process Technology: 45nm Number of Multipliers: 32 (18x18)
Programmability: Yes Program Memory Type: SRAM
Minimum Operating Temperature: -40°C Maximum Operating Temperature: 125°C
Dedicated DSP: 32 Speed Grade: 2
Device Number of DLLs/PLLs: 6 Total Number of Block RAM: 32
Basic Package Type: Ball Grid Array Package Family Name: BGA
Package Description: Chip Scale Ball Grid Array Lead Shape: Ball
Pin Count: 225 PCB: 225
Mount: Surface Mount MSL: 3
Maximum Reflow Temperature (°C): 260 Reflow Solder Time (Sec): 30
Number of Reflow Cycle: 3

 

For Use With

 

 

 

 

 

XA6SLX16-2CSG225Q

 

 

Same series including:

 

XA6SLX16-2CSG225Q
XA6SLX16-2CSG324I
XA6SLX16-2CSG324Q
XA6SLX16-2FTG256I
XA6SLX16-2FTG256Q
XA6SLX16-3CSG225I
XA6SLX16-3CSG225Q
XA6SLX16-3CSG324I
XA6SLX16-3CSG324Q
XA6SLX16-3FTG256I
XA6SLX16-3FTG256Q