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Xilinx XA6SLX16-2CSG225Q Datasheet and Introduction

Mounting Type:  Surface Mount

Logical Description: IC, Xilinx DS170 XA Spartan-6 Automotive FPGA Family

Physical Description: Ball Grid Array (BGA), 0.80 mm pitch, square; 225 pin, 13.00 mm L X 13.00 mm W X 1.40 mm H body

IC XA6SLX16-2CSG225Q

Product Attributes

Maximum Number of User I/Os : 160Number of Registers: 18224
RAM Bits: 576KbitDevice Logic Cells: 14579
Process Technology: 45nmNumber of Multipliers: 32 (18×18)
Programmability: YesProgram Memory Type: SRAM
Minimum Operating Temperature: -40°CMaximum Operating Temperature: 125°C
Dedicated DSP: 32Speed Grade: 2
Device Number of DLLs/PLLs: 6Total Number of Block RAM: 32
Basic Package Type: Ball Grid ArrayPackage Family Name: BGA
Package Description: Chip Scale Ball Grid ArrayLead Shape: Ball
Pin Count: 225PCB: 225
Mount: Surface MountMSL: 3
Maximum Reflow Temperature (°C): 260Reflow Solder Time (Sec): 30
Number of Reflow Cycle: 3

For Use With

XA6SLX16-2CSG225Q

Overview

The Xilinx XA Spartan-6 Automotive FPGA family delivers low-cost, reliability-optimized programmable logic for automotive applications. Within this family, the XA6SLX16-2CSG225Q provides a balance of logic density, features, and thermal performance.

In this article, we will take a look at the key capabilities and specifications of the XA6SLX16 from its datasheet and reference manual. We’ll examine its programmable logic, embedded blocks, I/O, package, reliability, and other details relevant to automotive usage.

XA6SLX16 FPGA Characteristics

The XA6SLX16 sits in the middle of the Spartan-6 XA family with these high-level characteristics:

Programmable Logic

  • 16,000 logic cells
  • 1008 Kb (504×2) block RAM
  • 12 DSP slices

I/O

  • 225 general purpose I/O pins
  • Support for common standards (LVDS, LVPECL, SSTL)

Clock Management

  • 7 clock management tiles with DCM and PLL
  • Sub-ns clock skew matching

Configuration

  • SPI and BPI flash loading
  • MultiBoot support for safe firmware updates

Packages

  • 225-pin BGA package
  • 15mm x 15mm, 0.8mm pitch
  • Supported temperature -40C to +125C

This provides a solid amount of logic, I/O, and routing in a relatively compact footprint.

FPGA Logic Cells

The core programmable logic inside the XA6SLX16 consists of 16,000 logic cells arranged in a matrix of CLBs (configurable logic blocks):

  • Each CLB contains 4 slices, each with 4 6-input LUTs and 8 flip-flops
  • 160 D-type flip-flops per CLB for register-heavy designs
  • Arithmetic carry chains for high performance math

In addition to basic logic, the FPGA contains dedicated routing for high-speed connections:

  • Direct connections between adjacent CLBs
  • Low-skew global clock networks
  • Fast carry chains for arithmetic
  • Low-latency bypass paths

These optimize performance for real-time automotive systems.

Block RAM

For data buffering and memory storage, the XA6SLX16 contains 1008 Kb of fast block RAM in 504 dual-port 18 Kb blocks.

Key capabilities:

  • True dual port for simultaneous access
  • Configurable as single 36 Kb RAM
  • Byte write enable for partial updates
  • Optional ECC for safety-critical data
  • 6500 memory access per second

The ample block RAM enables data processing without external memories.

DSP Slices

For digital signal processing, the FPGA includes 12 dedicated DSP slices. Each slice provides:

  • 25×18 bit signed multiply with 48-bit accumulate
  • Fast parallel multiply accumulation
  • Pipelining and shifting capabilities
  • Cascadable to 72-bits for high precision

DSP use cases include filters, FFTs, digital modulation, and more.

Clock Management

The XA6SLX16 contains 7 clock management tiles (CMTs), each including a mixed-mode clock manager (MMCM) and digital clock manager (DCM).

Key features:

  • Clock synthesis from 6-740 MHz
  • Zero delay buffers, low skew routing
  • Phase aligned clocking for high speed data
  • Input jitter filtering
  • Precision clock division and multiplication

This enables low noise system clocks derived from common automotive oscillator sources.

I/O Capabilities

With 225 I/O pins, the XA6SLX16 can interface to a wide range of automotive peripherals and signals.

I/O Support:

  • 1.2V to 3.3V signaling
  • LVDS, LVPECL, differential inputs
  • SSTL, HSTL, LVCMOS standards
  • SDR and DDR interfacing up to 800Mbps
  • High current drive up to 24mA
  • Slew rate and impedance control

Banks of I/O pins are grouped into power domains that can be shut off when unused. This allows optimizing I/O power consumption.

Configuration and Security

The XA Spartan-6 supports both SPI and parallel BPI flash for configuration:

  • MultiBoot enables safe dual-image firmware updates
  • AES-GCM 256-bit encryption secures bitstream
  • RSA authentication prevents tampering
  • Battery-backed RAM for key storage

Robust protections against tampering assist functional safety certifications.

Automotive Reliability

The XA family undergoes additional qualification for automotive environments:

  • AEC-Q100 Grade 2 qualified production flow
  • Full Xilinx standard qualification flow
  • Production monitory and change control
  • Zero defects and fit policy
  • Extended -40C to +125C temperature range
  • MTTF >100 years for safety-critical applications

This level of qualification provides confidence for deploying XA FPGAs in vehicle systems.

XA6SLX16 Packaging

The 225-pin 15mm x 15mm ball grid array package offers flexibility in PCB mounting:

FPGA Ball Map:

Relevant specifications:

  • 1mm ball pitch for routing access
  • Lead-free solder process
  • Corner chamfer indicates pin 1 location
  • Solid BGA balls for improved thermal conduction

The compact footprint fits space constrained PCBs while allowing sufficient routing escape. A thermal pad improves heat dissipation to the PCB.

Development Tools

Xilinx provides multiple options for developing with the XA6SLX16, including:

  • Xilinx ISE Design Suite for RTL synthesis and Place and Route
  • SDAccel development environment for OpenCL designs
  • SoftConsole integrated development environment (IDE)
  • Hardware debugging using ChipScope Pro and SignalTap analysis

These represent a mature, full-featured toolchain for developing and deploying XA6SLX16 designs.

Conclusion

With its automotive-grade qualification, security features, logic density, and blend of programmable logic and hardened blocks, the Xilinx XA6SLX16-2CSG225Q FPGA provides a compelling option for automotive applications like ADAS, infotainment, and digital instrument clusters. Engineers can take advantage of its optimized price/performance/power for embedded vision, sensor interfacing, and real-time control systems in next-generation vehicles.

Frequently Asked Questions

Q: What are the main advantages of the XA Spartan-6 family compared to a microcontroller?

A: FPGAs provide custom hardware parallelism, real-time responsiveness, and hardware-based reliability compared to sequential microcontroller execution.

Q: What is the difference between the XA Spartan-6 vs standard Spartan-6 FPGAs?

A: The XA family has additional automotive qualification, extended temperature range, multi-time programming fuse, AES encryption, and other features tailored for automotive.

Q: How is configuration firmware loaded onto the XA6SLX16 FPGA?

A: An external SPI or parallel flash is used to load the bitstream at power up. MultiBoot provides dual-image support.

Q: What is the typical static (leakage) power consumption of the XA6SLX16?

A: Depending on configuration, 20-100 mW is typical. Power gating domains and shutdown allow minimizing static power.

Q: What tools are available for developing with the XA6SLX16 FPGA?

A: Xilinx provides the ISE, Vivado, and SDAccel toolchains. SoftConsole is available as an IDE. Simulation, place and route, and debugging tools are included.

 

 

 

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