The Xilinx XC6SLX75T-3FGG484i is one of the best available devices delivering leading capabilities of system integration. The device is inexpensive and can be used for several applications. The device is consuming less power when compared to its previous competitor ICs. The densities are ranging from 3840 to 147,443 logic cells. This device is super fast and has wide-ranging connectivity. This device is grounded on lower power copper processing technology with 45nm delivering optimum balance among performance, costs, and power. This device has to offer a novel and efficient lookup table of six input dual registers and also offers a rich selection for built-in blocks on the system level. This is also comprising of 18Kb of blocked RAM along with 2nd generation DSP slices, controllers for memory, clock management blocks, high-speed receiver and transmitter blocks, advanced power modes. All of the mentioned features of this device are offering a lower-cost alternative for customized ASIC products with ease of use. This IC is offering a compatible solution for logic designs of higher volume, DSP design of consumer choice, and cheap embedded applications.
Configuration of Xilinx XC6SLX75T-3FGG484i
The device is capable of storing custom data of configuration in its internal latches of SRAM type. The configuration bits number is between 3MB to 33MB which is depending on the size of the device and implementation options of user design. However, the storage of configuration is volatile and is to be reloaded whenever the device is given power. The reloading of data is also possible at the time when pin PROGRAM_B is made low. Several methods can be used for loading data of configuration. The configurations of bit-serial can be in master serial mode in which Xilinx XC6SLX75T-3FGG484i is generating signals of configuration clock or can also be used in the mode of slave serial that generates a source of external data configurations in form of clock. The pins JTAG are utilizing protocols for boundary scanning to load data configuration in bit-serial mode.
ISE tool is utilized by Xilinx XC6SLX75T-3FGG484i to bitstream the information regarding configuration through bitgen. The process of configuration is typically executing sequence such that detection of power-up whenever PROGRAM_B is in low mode. Clearing the memory from the entire configuration data. The mode pins are sampled for determining the mode of configuration in either slave or master and parallel or serial. The tool is also loading data of configuration starting from the width of bus detecting pattern which is then followed through synchronization word checking the appropriate code of the device and is ending through cyclic redundancy check. Furthermore, this is starting sequence of user-defined events that release the internal reset of flipflops and waiting for the PLL or DCM to be locked after activation of output drivers and DONE pin is made high after the transition. There are two common techniques used for configuring Xilinx XC6SLX75T-3FGG484i i.e., master byte-wide peripheral interface and master serial peripheral interface.
Configurable Logic Blocks
Every of configurable logic block is consisting of two slices that are arranged adjacently in the form of vertical columns. Three different kinds of configurable logic blocs are available in Xilinx XC6SLX75T-3FGG484i architecture namely, SLICEX, SLICEL, and SLICEM. Every slice has 4 lookup tables and 8 flip-flops. These lookup tables are for general purpose sequential and combinational support.
Almost 50 percent of the slices of Xilinx XC6SLX75T-3FGG484i are SLICEX. These have a similar structure to SLICEL but these are having an arithmetic carry option and are considered as broad multiplexers.
Almost 25 percent of the slices of Xilinx XC6SLX75T-3FGG484i are SLICEL. These are having almost all the features that SLICEM has but are not having any shift or memory registers.
These are also 25 percent of the slices of Xilinx XC6SLX75T-3FGG484i. The 4 lookup tables of SLICEM could be configured in the form of 6 inputs and single output or in the form of lookup tables with 5 equal inputs having the same 5-bit addresses and two distinct outputs. These lookup tables may also be utilized in the form of 64-bit RAM in distributed form along 64 bits single or two 32-bit in each lookup table.
The outputs of the frequency synthesis CLKFX180 and CLKFX could be programmed for the generation of output frequency independent of the functionality of DCM. It implies that the frequency of DCM is multiplied by a digit M and simultaneously divided by digit D. Here, M is an integer ranging from 2 till 32 and D is an integer ranging from 1 till 32.
When CLK0 is in connection with CLKFB, entire outputs i.e., CLKFX180, CLKFX, CLKDV, CLK2X180, CLK2X, CLK270, CLK180, CLK90, and CLK0 could be shifted through a common number that may be defined as multiple of an integer having a fixed delay.
In Xilinx XC6SLX75T-3FGG484i every memory access either write or read is clock-controlled. All of the input writes and clock enables, addresses, and data are registered. The output data is latched and data is retained till the next operation. There is an optional pipeline register that is allowing higher rates for the clock at cost of additional cycle latency.
Memory Control Block
There is are dedicated memory control block in Xilinx XC6SLX75T-3FGG484i. Each of these blocks has a target for single-chip DRAM and supports the access rates of up to 800 megabits per second. This block has devoted routing for predefining the input/outputs. In case when the block is not in use then these input/outputs are accessible for general purpose input/outputs. The block is offering a profound multi-port arbitrated interface for inside logic. The commands and data could be pushed and pulled from the FIFO through traditional control signals. This is a multi-port controller able to be configured through different methods. There is an internal 32, 64, and 128-bit interface for data delivering a simple and outstanding interface for memory controller block. Furthermore, the memory control block can also be connected through 4, 8, or 16-bit DRAM externally. But, the memory controller block functionality is not supported by -3N speed grade applications.