The Xilinx XC6SLX25-3CSG324i is an IC readily available in different grades of speed. The highest possible speed is -3 and the highest performance too. The AC and DC parameters of the IC which is utilized for defense and automotive industries are equivalent to that of ICs used for commercial purposes. The characteristics of timing for the commercial ICs with the speed of -2 grade are equivalent to that of the ICs used for commercial purposes with the same grade. However, the speed grades of -3Q and -2Q are dedicatedly utilized for the applications where there are requirements of an expanded range of temperature Q.
The characteristics of timing are the same when speed is considered for both -3 and -2 grade ICs. The characteristics of both AC and DC are dedicated to the industrial, commercial, and expanded ranges of temperature. However, specified grades of speed and devices are expected to be readily available for the expanded or industrial ranges of temperature when it comes to the ICs of defense and automotive type. The reference to any of its device names is referring to the availability of all variations of its part number. But, the -3N grade of speed is designating all of the devices that are not supporting MCB functioning. The specifications of junction temperature and entire supply voltage is a representation of the worst possible case conditions and its parameters are encompassing the most typical and common designs for various applications.
Absolute Maximum Conditions
If stress is applied beyond the rated absolute maximum rating to the device may result in its permanent damage or burnout. The stress ratings are necessary for the device to be operational and it may not perform if such conditions are not fulfilled for its operation. Furthermore, if the device is exposed to the absolute maximum ratings too frequently may also result in any irreversible damage to the device. When the eFUSE of the device is programmed, it requires a current of up to 40mA and its VFS may be in the range of 3.45V to 0V. The overshoot duration of the input/output absolute maximum limit is in the percentage of the data for that period when 3.45V is applied. The maximum possible overshoot of voltage is 4.40V. The maximum bearable temperature for soldering purposes is Tsol for the device.
Recommended Operating Conditions
The entire range of voltages is relevant to the position of the ground or GND. To perform the device in its extended performance range while not utilizing the standard VCCINT range of voltages. But the VCCINT is not recommended to be utilized for designs that are not using MCB, LX4 devices, devices of CPG196 packages or TQG144, and -3N grade of speed. The maximum possible voltage droop VCCAUX is about 10 millivolts per milliseconds. In case when the configuration is underway, when VCCO_2 is about 1.8V then its VCCAUX must be around 2.5V. When the device of -1L is requiring VCCAUX to be 2.5V through the use of standard RSDS_33, RSDS_25, LVPECL_25, LVDS_25, PPDS_25, and BLVDS_25 input/output on its inputs then LVPECL_33 is not supposed to be implemented at -1L devices.
The configuration data is always retained by the device even in case if the VCCO is dropped to 0V and the device has the inclusion of VCCO for 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V respectively. The receiver and transmitter are required to have a common supply for VCCO when it comes to the PCI system. Xilinx PCI IP is not supported by the devices with -1L speed. 100mA must not be exceeded per bank for the device. Maintenance of VBATT is also necessitated for RAM backed by the battery when the VCCAUX is not being applied. When the VCCAUX is applied to the device then VBATT could be disconnected.
eFUSE Programming Conditions
The programming of eFUSE is only supported with the help of JTAG and such specifications are only applied while programming of the AES key of eFUSE. While programming the eFUSE, it must be guaranteed that VFS is lesser or equivalent to VCCAUX. While when the eFUSE is not programmed or is not in use, it is recommended that GND and VFS must be connected. But VFS must be in the range of 3.45V to 0V. There is a requirement of a resistor RFUSE for programming the AES key of eFUSE.
Recommended DC Characteristics
The measurement of the CIN is representing using a pad of die capacitance and not including package. The maximum possible value which is specified for the worst case is processed at 25 degrees Celsius. Referring to the RDT variation IBIS model and for values at VCCAUX of 2.5V, then IBIS values of RDT seem valid for all of the ranges of temperature. Whereas, there is no requirement of VCCO2 for retention of data. The minimum value of the VCCO2 for configuration and powering on reset is about 1.65V.
The specification of conventional values for the quiescent supply current of the device is done at nominal voltage and junction temperature of 25 degrees Celsius. The devices which are used for industrial and commercial grades are also having the same values. But, its higher values are lying at 100 degrees Celsius. Xilinx XC6SLX25-3CSG324i is recommending the analysis of static power consumption through the use of power estimator software. The nominal value of VCCINT is around 1.2V and is computed through the use of the XPE tool. The typical values are often used for devices that are blank and have no pull-up resistors in their active state, no output current loads, and all input/output pins are floating and in 3-state. In case if differential signaling is utilized then the values of quiescent current can be made more precise through the utilization of XPA software.
Ramp Time of Power Supply
The minimum requirement for VCCO2 for its reset on powering-on along reconfiguration is 1.65V. The device is requiring a specific amount of supply current while powering on to ensure the initialization of the device properly. The consumption of actual current is dependent on the rate of power on the ramp for its power supply. XPA or XPE tools are utilized for estimation of the drain currents for the power supplies.