PCB are used in electronic products, and the market trend of PCB is almost the vane of the electronics industry. With the development of high-end, miniaturized electronic products such as mobile phones, notebook computers and PDA, the demand for flexible PCB (FPC) is increasing, and PCB manufacturers are accelerating the development of thinner, lighter and denser FPC. Let’s introduce you to the types of FPC.
- single-layer FPC
The layer has a chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is a rolled copper foil. The insulating substrate may be polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride. Single-layer FPC can be divided into the following four subcategories:
- No cover layer single-sided connection
The circuit pattern is on the insulating substrate, and the circuit surface has no cover layer, and the interconnection is realized by soldering, welding or pressure welding, which is commonly used in early telephones.
- Cover layer single-sided connection
Compared with the previous class, it only has a layer of cover on the surface of the wire. The pad needs to be exposed when covering, and it can be easily covered in the end area. It is the most widely used and widely used one-sided flexible PCB, and is used in automobile instruments and electronic instruments.
- No cover layer double-sided connection
The land interface can be connected to the front and back of the wire, and a via hole is formed in the insulating substrate at the pad. The via hole can be punched, etched or otherwise mechanically prepared at a desired position of the insulating substrate to make.
- cover layer double-sided connection
In the different types of the former, the surface has a covering layer, and the covering layer has a though hole, which allows both sides to be terminated, and still maintains the covering layer, and is made of two layers of insulating material and a layer of metal conductor.
- double-sided FPC
The double-sided FPC has a conductive pattern formed by etching on both sides of the insulating base film, which increases the circuit density per unit area. The metallized holes connect the patterns on both sides of the insulating material to form a conductive path to meet the design and use functions of the flexibility. The cover film protects the single and double-sided circuit and indicates where the components are placed. Metallized holes and overlays are optional, as required, this type of FPC application is less
III. Multi-layer FPC
The multi-layer FPC laminates three or more layers of single-sided or double-sided flexible circuits together, and forms a metallized hole through a drill L and plated to form a conductive hole between the different layers. This eliminates the need for complex welding processes. Multilayer circuits have tremendous functional differences in terms of higher reliability, better thermal conductivity, and more convenient assembly performance.
This has the advantage that the substrate film is lightweight and has excellent electrical properties such as a low dielectric constant. A multilayer flexible PCB board made of polyimide film is about 1/3 lighter than a rigid epoxy glass multi-layer PCB board, but it loses the flexibility of its single-sided, double-sided flexible PCB , most of these products are not required for flexibility. Multi-layer FPC can be further divided into the following types:
- Flexible insulating substrate finished product
This type is manufactured on a flexible insulating substrate and the finished product is specified to be flexible. This construction typically bonds the two ends of a plurality of single-sided or double-sided microstrip flexible PCB together, but the central portions are bonded together to provide a high degree of flexibility. In order to have a high degree of flexibility, a thin, suitable coating, such as polyimide, may be used on the wire layer instead of a thicker laminate overlay.
- flex insulating substrate finished product
This type is manufactured on a flex insulating substrate, and the finished product is specified to be flexible. Such multilayer FPC are laminated to a multilayer board using a flex insulating material such as a polyimide film, which loses its inherent flexibility after lamination.