The tg260 printed circuit board represents a high TG board, an important classification attribute of the base material in modern circuit boards. Besides the TG value, other crucial attributes such as dimensional stability and dielectric constant also play a significant role. As a printed circuit board designer, it becomes essential to understand the layout and design procedures and comprehend these crucial factors when designing your PCB.
TG often implies the glass transition temperature, a crucial aspect of the board for performance and efficiency. TG acts as the standard parameter of temperature in printed circuit boards and gets measured in degrees Celsius. The glass transition temperature not only acts as the core value regarding a board material’s mechanical stability but one that guarantees its solidity.
So how can you define TG? It implies the temperature range that a polymer substrate gets to change or transition from a glassy and rigid material to an amorphous and soft state. It becomes essential to understand that the material forming the circuit board (normally an fr4) cannot burn but becomes unstructured when exposed to more than the designed for and expected temperature range.
A TG260 represents a typical high-Tg printed circuit board because of its tolerance to high-temperature ranges. It can tolerate up to a temperature value not exceeding 260 degrees Celsius without losing its board material structure integrity and functionality. However, it becomes equally essential to note that the optimum range for a tg260 falls above the temperature range of 170 degrees Celsius and 240 degrees Celsius. Ideally, the working temperature needs to fall shy of the tipping point by about 20 degrees Celsius.
You might wonder by this point why temperature proves a crucial aspect concerning the Tg of printed circuit boards. The temperature often plays a key role during the manufacture and seamless operations of a PCB. For instance, during the manufacturing process, the layers of copper often get incorporated through a temperature-enforced process inferred as lamination. Lamination becomes essential in ensuring the circuits get incorporated into the fr4 non-conductive substrate. Additionally, temperatures emitted from the circuit board during operations must fall within the recommended range to avoid any functionality issues within the PCB.
For an fr5 tg260 printed circuit board, the temperature emitted during the typical operation of the circuit and its surrounding areas has to fall between above 180 degrees Celcius to about 240 degrees Celcius. Otherwise, any temperature range that falls outside these parameters can compromise your PCB’s optimal functionality. Like operating temperatures, the tg260 PCB material needs to withstand the reflow oven process temperatures to ensure a study and a properly constituted printed circuit board that will operate seamlessly and at the optimum.
Specifications of a TG260 and Other High-TG PCBs
The Tg value often corresponds to the tipping temperature point upon which the printed circuit board material changes. For instance, when the operating temperature surpasses the Tg value, the printed circuit board material will change from the early sturdy and solid state to a liquid and amorphous state. Such a change will negatively impact the capability of the circuit board, thereby interfering with its performance.
Plenty of standard PCBs getting designed world-over to possess a Tg value that does not exceed 140 degrees Celsius and thus can withstand operating temperatures that slightly exceed 110 degrees Celsius. But as much as such printed circuit boards might possess the benefits that accrue from standardization, they prove inadequate for PCB products in extreme operating temperatures such as the ones witnessed in automotive industries. Such instances require printed circuit boards developed with an fr5 material instead of the fr4 material.
But what does an fr4 material means? It implies the grade designation material of the fiberglass strengthened with epoxy and one that proves flame-retardant. Printed circuit boards with an fr4 material possess greater strength but provide higher heat resistance than local or standard PCB material equivalents. The fr4 comes under three distinct classifications, with the distinction between classes arising from the copper layer traces of the corresponding PCB. It includes multi-layered, dual-layered, and single-layered printed circuit boards.
So do you want a tg260 printed circuit board and lack ideas on how to go about it? Here, the best and easy way of doing it. Contact us at RayMing PCB and Assembly Company through the stipulated channels on our website’s home page to have answers to all your inquiries, manufacturing, fabrication, and assembly needs.
Why RayMing PCB and Assembly?
At RayMing PCB and Assembly Company, you will not only get the tg260 printed circuit board but a range of high-temperature tolerant printed circuit board products besides the associated fr4 or higher quality material services. The company has the relevant equipment, experience spanning fifteen years, and the technical human resource to execute fabrication of PCBs with resistance to high temperatures for diverse industries like the high-temperature electronics and automotive industries.
Common Materials Instrumental in the Manufacture of a TG260 PCB
Printed circuit boards with a glass transitional temperature value of tg260 require specific materials during their manufacturing. It includes the following.
- In most cases, the tg260 printed circuit board will require the Rogers 4350 material type, unlike other high-Tg PCBs like tg175 and tg180 that can function with an fr4 S1141 and S1000-2M materials, respectively.
- The tg260 PCB material also requires a high td value, typically 390 degrees Celsius. The td value proves higher than other high-Tg value materials.
- The tg260 also needs a material component with a CTE-z value of 50 degrees Celsius, though it has no requirements when it comes to Td260 and Td288
The material aspects highlighted above often work in complementarity with the Tg value and also play a significant role in the performance of a printed circuit board. Because of this, we will detail a little about the dielectric constant value (Dt) and the coefficient of thermal expansion (CTE) value.
- Coefficient of thermal expansion (CTE)
- The value often plays a significant role in high-Tg printed circuit boards. It implies the expansion impact of the laminate when subjected to temperature changes on the printed circuit board’s operations. For instance, the expansion on the x-y plane can have drastic effects on any expansion-sensitive component placed and soldered on the board. A case in point includes a component such as the LGBA, which can destroy the PCB’s solder joints during rapid expansion. Such an expansion mismatch between the board and the LGBA results in micro-cracking after some cycles of thermal tests.
- Dielectric constant (DK). It comes as a crucial yet often overlooked aspect by most printed circuit designers. It measures the signal integrity in a printed circuit board as signal dispersion often happens in the PCB. Signal dispersion often leads to distorted digital signals in PCBs, primarily if the device switches at high speeds.
It, therefore, becomes essential for you as a printed circuit board designer to contemplate the trade-off between performance, costs, and other material properties (such as the soldermask, substrate, and the laminate) when opting for the tg260 printed circuit board.
Application of the TG260 and other High-Tg Printed Circuit Boards
It always becomes useful for you as the designer to determine the lasting operating temperature of the tg260 board when it comes to exposure to elevated thermal loads. Such a determination will inform your decision to stick by this PCB material or opt for another material type. A crucial aspect that can help you determine this involves the glass transition temperature values of the printed circuit board material.
The most typical application areas of the high-Tg PCBs, such as the tg260, include the following.
- Multilayer boards. Printed circuit boards with multiple layers often require an extensive reflow process that most PCB material Tg-value cannot support. For instance, the PCB will undergo multiple reflow oven processes to ensure a proper embedment of copper layers (traces), which can take its toll on fr4 materials lower than 170 degrees Celsius. Such high-temperature requirements during manufacturing will not only become compromising to the board’s structural integrity but also compromise its electric properties, such as damaging the copper traces or the through-holes.
- Industrial electronics. Most industrial electronics get exposed to higher temperatures during operations, and thus the PCB needs to withstand these temperatures. What better method to ensure this than through the high-Tg PCBs? For instance, electric transformers that, besides the high heat, have to carry high current loads.
- Automobile electronics. Most, if not all, automobiles emit high levels of heat. The printed circuit board in such machines has to operate within high temperatures and to necessitate this. It becomes essential to deploy high-Tg PCBs such as the tg260.
- Fineline trace structures. Such structures require a high-Tg material for its PCB to ensure that the high current and energy transmissions within the fine traces do not lead to a compromised system due to damage to the substrate.
- High-temperature electronics. High-Tg printed circuit boards become an essential part of electronics that emit high temperatures. An excellent example includes a home appliance electronic in the form of a fridge that emits plenty of heat.
The tg260 represents a high glass transition temperature PCB that proves ideal for high-power equipment and appliances at home and in the industries. You, therefore, have to understand everything about the high- tg260PCB material to help you design and have it manufactured by a reputable company like us. We will always ensure that you do not regret ever choosing us. So good luck!