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What is Taconic TSM-DS3b PCB

We are in an era where technology is taking over the world, from the education industry to hospitals and government. The application areas of tech grow each day with each advancement, making our life easier and less strenuous. However, these advances cannot happen without utilizing efficient equipment to work with. We are talking about PCBs, measuring equipment, processors, etc. This article will focus on the best printed circuits boards in the market, the TSM-DS3b PCBs. We shall answer questions such as “why is the Taconic TSM-DS3b PCB the best PCB in the market?” And what are the benefits of using this PCB? Hence to get the answer to this and more questions, stick around as we unravel the Taconic TSM-DS3b PCB mystery.

A Quick Overview of PCB

PCB is a coated sandwich structure of insulating and conductive layers. PCBs have 2 complementary functions:

  1. Affixing electronic components into specifically designated areas on the outside layer through soldering.
  2. Providing electrical connections between components’ terminals in a pretty controlled manner. Primarily known as PCB design, this connection should be reliable.

Taconic TSM-DS3b PCB

The Taconic TSM-DS3b PCB is a minimal loss core, thermally stable PCB. One can develop the Taconic TSM-DS3b PCB with the consistency and predictability of the most efficient epoxies reinforced with fiberglass.

Taconic TSM-DS3b PCBs are ceramic-filled and reinforced to ensure maximum efficiency.  As per fiberglass content, these PCBs have tiny amounts of it, totaling up to ~5%. With these low levels of fiberglass content, the Taconic TSM-DS3b becomes pretty competitive in the market. That is because they rival epoxies as per fabricating large complex multilayers.

Taconic TSM-DS3b PCBs are good for the high power (thermal conductivity of 0.6 W/M*K) applications. In this case, the dielectric material must efficiently conduct heat being produced away from the other heat-producing sources. To do so, it utilizes a design known as PWB.

Taconic TSM-DS3b PCB was also invented to have pretty low coefficients as per thermal expansion in demand for thermal cycling.

As per microwave application, low z, y, and x values ensure that the critical spacings are between traces located in couplers and filters and have minimal movement with the temperature. What’s more Taconic TSM-DS3b PCBs utilize pretty low levels of profile foil copper. Hence they have copper edges that are pretty smooth in between the coupled lines.

Suppose you are looking for incredibly low dielectric losses, you can easily get at epoxy fabrication temperatures of 4500F. Combining the Taconic TSM-DS3b with a fastrise prepreg could be your answer. The FastRise-Taconic TSM-DS3b collaboration is an industrial leading solution with regard to low dielectric losses.

FastRise Prepreg

We utilize Fastrise prepreg in conjunction with various coating cores. The collaboration has resulted to the development of boards that have multiple layers for the ATE/digital/RF markets. When utilized in a board design that is symmetrical, Prepreg results in pretty optimum mechanical and electrical performance. Due to the bonding agent thermoset properties, it is possible to achieve multiple cycles of bonding with minimal delamination worry. Such efficiency merged with the Taconic TSM-DS3b bring out PCBs that have optimum performance.

What are the Benefits of Applying the Taconic TSM-DS3b PCB?

Utilizing Taconic TSM-DS3b PCB come with the following benefits:

  1. The Taconic TSM-DS3b PCB has got the industry’s best DF. It has a DF of 0.0011 at 10GHz
  2. High thermal conduction
  3. Pretty low fiber content, as low as ~5%
  4. Dimensional stability which rivals epoxy
  5. Enables high layer large-format count PWBs
  6. Builds rather complex PWBs, which yields predictability and consistency
  7. Pretty stable temperatures DK negative thirty to positive 1200C
  8. Resistive foils compatibility

What are the Applications of a Taconic TSM-DS3b PCB?

  1. Couplers
  2. Radar manifolds
  3. Oil drilling
  4. Automotive/mmWave antenna
  5. Phased array antennas
  6. ATE Testing/Semiconductor

Taconic TSM-DS3b PCB General and Handling Information

Taconic TSM-DS3b PCB Storage Properties

To store Taconic TSM-DS3b PCBs correctly, you should:

  • Ensure you place them in a flat, clean, and dry area
  • Store them away from high levels of heat; storing them at room temperature is highly recommended.
  • Store them in between 2 stiffeners which prevents any unnecessary bending that might occur to the layers
  • Use a soft slip sheet to store cores which will prevent debris and dust from getting into the cores

When stored appropriately, Taconic TSM-DS3b PCB cores have a shelf life that’s indefinite.

FastRise Storage

For appropriate FastRise Storage, you should follow the following guidelines:

  1. Store the equipment in a dry and cool area
  2. Store it away from any direct sunlight
  3. Place the equipment in a low humidity area
  4. Store in an area that has minimal contamination properties

FastRise prepreg life shelf varies according to the following set conditions:

  1. Refrigeration – refrigeration temperature should be 400F or lower
  2. Room temperature – room temperature should be 230C or below plus a relative humidity of less than 50%

When you eject a FastRise prepreg from a refrigerator, let it accumulate heat till it hits room temperature while still in its sealed bag. In doing so, you reduce the possibility of moisture condensing on the FastRise prepreg. It also offers a consistent temperature as per the lamination process. When not being used, the bags should be sealed.

Shelf-life

When condition one above is observed, the FastRise prepreg has a 180 days shelf life after shipment.

When you observe condition two above, a 90 days shelf life applies for the FastRise after shipment.

Packages indicate the second condition by default, but the first condition has a longer shelf life.

Handling

Taconic TSM-DS3b overlay

Compared with other thermosetting resins, for example:

  • Epoxy
  • Cyanate ester
  • Polyimide
  • Polyphenylene oxide

 PTFE are pretty stable chemically and electrically. Some of the reasons that make PTFE superior is in terms of performance over temperature and frequency. Also makes pure resins relatively soft. Due to this reason, Taconic overlays are glass fabric reinforced. The substratum reinforcement via glass fabric increases the X and Y axis stability. It hence overtakes the stability of the non-enforced PTFE products. However, even with this reinforcement, you still have to take some handling and process precautions. They help prevent deformation and damaging of the overlay during fabrication.

No Mechanical Scrubbing

As with flexible surfactant or thin cores, mechanical scrubbing stretches and deforms the material. We use pinch rollers to hold the panels in place during scrubbing leave dents. The brush accouterments are pressed onto the overlay surface. Instead of mechanical scrubbing, we would highly suggest that you try utilizing chemical cleaning.

When you eliminate unnecessary handling and mechanical cleaning, dimensional accuracy ultimately increases.

Avoid Picking up Panels Horizontally via One Edge or End

When you let the equipment flop over then you may end up stretching the substratum and copper. Hence you should instead pick the panels via two edges parallel to each other. Preferably you should utilize the two edges closest to each other dimensionally.

Prevent the Deposit of Contaminants on the Copper or Gear

Utilizing slip sheets and protective gloves that are clean prevents staining and contamination. If you do not deposit fingerprints, grease, and oils, you will not have to strain trying to remove them.

Avoid Mechanically Abrading PTFE Surfaces after Etching.

When not disturbed, PTFE surfaces are pretty good for:

  • Solder mask adhesion
  • Bonding adhesion
  • Prepreg with no further preparation.

After copper removal, there are rough tooth structures left behind, which make the PTFE surface pretty wettable. In case the surface is disturbed. Then more surface preparation via sodium etching might improve adhesion and wettability of the surface.

Avoid Stacking Panels onto each other Directly

When you stack up the panels, then debris or particles on one panel might leave marks on the surface of an adjacent panel. Hence instead of stacking them up, you should instead rack them up vertically. If you are looking to stack the panels up, then use a slip sheet that is soft and clean in between the panels. Also, ensure that the stack is of minimal height.

FastRise

Prepreg is usually supplied in between 2 release sheets. FastRise surface part might be tacky. You will realize that it is mostly recommended to let the prepregs accumulate heat before you open the bag. But it might be beneficial to utilize the FastRise while still cool in some scenarios which ultimately reduces tackiness.

Never let condensation form on a prepreg.

Preparation of the Inner Layer

Acclimation

There are cases where the overlay could be exposed to extreme temperature when being shipped or stored. It is important to place it in an ambient environment for 8 to 24 hours before processing.

Scaling

After copper foil etching, all overlays experience movement. There are such factors like:

  • The thickness of the copper foil
  • Circuit design
  • Glass style
  • Overlay thickness

All affect the dimensional stability of a Taconic TSM-DS3b PCB.

Lamination

Thieving/flow patterns

Copper borders that are solid and bear interlocking flow patterns, for example:

  • Honeycombs
  • Offset diamonds, are ideal.

Other patterns inhibiting resin-like flow patterns are also pretty ideal.

Do not utilize interlocking flow patterns. Also avoid patterns that promote resin-like flow patterns.

Conformance material and padding

We recommend press padding. Utilization of conformance material, for example:

  • Taconic tacPad
  • Clutch overlays
  • PTFE skive films or others

All these help in terms of balancing pressure variations through induction from circuits.

Pressure

You achieve full pressure before FastRise reaches 1200C. The resin flow of fastRise is proportional to the overlay pressure. Using pressure, one can control flow whereby high flowing prepreg part numbers act as slow-flowing or no flowing part numbers. Using this characteristic, one can achieve additional flow.

Conclusion

Taconic TSM-DS3b PCBs are pretty efficient. They have functionalities that add up to make it the best PCB on the market in the 21st century. We hope that this article has helped solve any questions you might have regarding the Taconic TSM-DS3b PCB.