The Rogers ULTRALAM 2000 is specially designed for applications involving microstrip circuits and for high-reliability stripline. Glass fibers are usually oriented in the laminate’s X/Y plane. This orientation ensures maximum dimensional stability. It also helps in reducing etch shrinkage when registration of the circuit feature becomes critical.
The ULTRALAM 2000 material’s dielectric constant is controlled from the nominal to ±0.04. This is done within the 2.4 – 2.6 range. There is uniformity within each panel, as well as from one panel to the other. Also, the important frequency range is extended by the dissipation factor into the K-band that falls between 17 – 27 GHz.
The Rogers 2000 laminate can be machined, sheared, and cut into shape. Also, it offers great resistance to all reagents and solvents, either cold or hot, usually utilized in the plating and etching of printed circuits. Options for cladding include electrodeposited or rolled copper.
Properties of Rogers ULTRALAM 2000
The dielectric constant of the Rogers Ultralam 2000 falls between 2.4 and 2.6. It goes in the z direction and the condition is set at 23 degrees. This means that the ratio of the ability of this material to that of free space to carry AC (alternating current) is low.
The dissipation factor stands at 0.0022 in the z direction at 23 degrees centigrade. This factor throws more light on how the Rogers 2000 will perform when used in different environments and applications. It gives great insight into the behavior of a circuit material when there must be a reduction in signal distortion, when a loss is significant, and when there must be a preservation of signal integrity (SI).
The Rogers 2000 has the ability to resist insulation or electricity. It has a high volume resistivity of 2.0 x 107. This makes them preferable to those with low volume resistivity. With the high volume resistivity of the Rogers 2000, you can be sure that its material will not be affected by heat, cold, and moisture.
Moisture and temperature (either high or low) can affect surface resistivity. This is why the Rogers ULTRALAM 2000 stands out with a high surface resistivity of 4.1 x 107. This shows that it has a high resistance against insulation and electricity.
This refers to the voltage at which the material of the Rogers 2000 fails to prevent current flow under the application of electrical stress. The Rogers ULTRALAM 2000 has a dielectric breakdown of >50.
The Rogers ULTRALAM 2000 has an arc resistance of 185. This is the ability of this material to resist the effects of low current, high voltage, under some prescribed conditions, after it passes through the material’s surface. This resistance is seen as the total time needed to create a conductive path of the material in which the arc has carbonized.
Coefficient of Thermal Expansion
The expansion rate of Rogers 2000 falls between 15 and 200. It can be decreased or increased. This depends on the variation of the temperature on the substrate. There is an increase in this temperature when the substrate’s temperature rises above the temperature of the glass transition. There’s a difference in the coefficient of thermal expansion between the substrate and the copper layers.
The Rogers ULTRALAM 2000 has a flammability rating of UL 94-VO. This means that users of this product can be more confident and rest assured when buying it. For manufacturers of the Rogers 2000, this certification indicates that they have worked with the most appropriate safety measures, which makes them a step higher than other competitors. The UL 94 is an important factor indicating that PCB material specimens shouldn’t burn with combustion for over 10 seconds.
Copper Peel Strength
The Rogers 2000 has a great copper peel strength which ensures the bonding of dielectric materials and copper layers. The peel strength of the Rogers ULTRALAM 2000 can be tested by exposing the traces of copper with the thickness of an ounce to heat stress, chemicals, and high temperatures.
The Rogers ULTRALAM 2000 has a water absorption value of 0.03%. This means it has great tendencies to withstand water exposure. Water absorption of the Rogers 2000 will affect the electric and thermal properties of the dielectric.
Rogers 2000 has a great tendency to withstand breaking, even when physical strength is impacted upon it. The flexural strength of the Rogers 2000 is measured in two ways. The first method is to exert force at the board’s center, ensuring the ends are supported. The second way is to use Young’s modulus and tensile modulus.
Applications of the Rogers Ultralam 2000
- LAN Systems: The Rogers 2000 can be applied in local area network systems. This network for communication helps in linking computers within a few groups of buildings or just one building.
- Satellite TV Receivers
- Microwave Test Equipment
- Wireless Communications Systems Antennas
- Cellular Base Stations
- Satellite TV Receivers
- Automotive Electronics
- RF & Microwave Components
- Radar Systems
Benefits of Rogers ULTRALAM 2000
X/Y plane oriented glass fibers: This helps in improving dimensional stability. It also does well to reduce thermal expansion. This is great for applications with critical registration.
Steady electrical properties: This opposes the rate of occurrence of repeatable designs. This feature is great for broadband applications.
Great chemical resistance: It can endure chemical attacks for long periods. They have less chance of corrosion. This helps in reducing any damage to the material during assembly and fabrication processes.
Great mechanical properties: They exhibit great physical properties when forces are applied
Standard PTFE processing: With this feature, the fabrication process comes easy.
The Rogers 2000 are great for applications involving microstrip circuits and for high reliability stripline. They have excellent chemical resistance and great mechanical properties. They can also be applied in different areas like radar systems, LAN systems, and more. The laminate can be machined, sheared, and cut into shape, and it offers a great resistance to all reagents and solvents.