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XA6SLX75-3FGG484I: High-Performance Automotive-Grade FPGA for Industrial Applications

Original price was: $20.00.Current price is: $19.00.

Product Overview

The XA6SLX75-3FGG484I is a premium automotive-grade Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-6 LX family. This high-performance device delivers exceptional logic density, low power consumption, and industrial-grade reliability for demanding embedded system applications. Engineered specifically for automotive, aerospace, and industrial automation environments, the XA6SLX75-3FGG484I provides superior performance in harsh operating conditions.

1. Product Specifications

Core Technical Specifications

Logic and Memory Resources:

  • Logic Cells: 74,637 logic elements/cells
  • Logic Blocks (LABs): 5,831 configurable logic blocks
  • Block RAM: 387 kB (3,120,128 bits total)
  • DSP Slices: 132 x DSP48A1 slices for high-performance signal processing

I/O and Connectivity:

  • User I/O Pins: 280 user I/O pins
  • Total Package Pins: 484-pin Fine Ball Grid Array (FBGA)
  • I/O Standards Support: 40+ industry standards including LVDS, LVCMOS, PCI, and differential signaling
  • Maximum I/O Frequency: Up to 390 MHz

Power and Performance:

  • Process Technology: Advanced 45nm CMOS low-power process
  • Core Voltage (VCCINT): 1.14V to 1.26V (nominal 1.2V)
  • I/O Voltage (VCCO): 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
  • Speed Grade: -3 (highest performance grade)
  • Power Consumption: Optimized for low-power applications

Package Details:

  • Package Type: 484-ball Fine-pitch Ball Grid Array (FBGA)
  • Package Size: 23mm x 23mm
  • Ball Pitch: 0.8mm
  • Lead-Free: RoHS-compliant with Sn/Ag/Cu solder balls (FGG variant)

Operating Conditions:

  • Temperature Range: Industrial grade: -40°C to +100°C junction temperature
  • Automotive Grade: XA prefix indicates automotive-qualified components
  • Humidity: Non-condensing environments

2. Pricing Information

Current Market Pricing (2025)

Volume Pricing Structure:

  • 1-59 units: Contact for quote
  • 60-119 units: $152.63 per unit
  • 120-179 units: $150.65 per unit
  • 180-299 units: $148.72 per unit
  • 300-599 units: $146.84 per unit
  • 600-1,499 units: $143.21 per unit
  • 1,500-2,999 units: $139.76 per unit
  • 3,000+ units: $136.47 per unit

Pricing Notes:

  • Prices are in USD and subject to market fluctuations
  • Lead times typically range from 12-20 weeks for standard orders
  • Express delivery options available for urgent requirements
  • Custom packaging and testing services available upon request

Cost-Effective Alternatives:

  • XA6SLX75-2FGG484I: Speed grade -2 variant at $135.19 (1K pricing)
  • XA6SLX75-2FGG484Q: Military-grade variant at $150.79 (1K pricing)

3. Documents & Media

Official Documentation

Primary Datasheets:

  • DS162: Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
  • DS160: Spartan-6 FPGA Family Overview
  • UG385: Spartan-6 FPGA Configuration User Guide
  • UG381: Spartan-6 FPGA SelectIO Resources User Guide

Application Notes:

  • Power management guidelines for Spartan-6 devices
  • PCB design recommendations for FBGA packages
  • Thermal management best practices
  • Signal integrity considerations for high-speed designs

Design Tools and Software:

  • ISE Design Suite: Complete front-to-back FPGA design solution
  • Xilinx Power Estimator (XPE): Power consumption analysis tool
  • ChipScope Pro: Real-time debugging and analysis
  • MicroBlaze SDK: Soft processor development environment

Development Kits:

  • SP605 Evaluation Kit for rapid prototyping
  • Automotive-specific reference designs
  • Industrial automation example projects

4. Related Resources

Technical Support Resources

Design Support:

  • MicroBlaze Soft Processor: 32-bit RISC processor core
  • Memory Controllers: Integrated DDR/DDR2/DDR3 support
  • Clock Management: Advanced mixed-mode clock management blocks
  • DSP Capabilities: Second-generation DSP48A1 slices for signal processing

IP Core Library:

  • PCI Express compatible endpoint blocks
  • Ethernet MAC implementations
  • Communication protocol stacks
  • Video and image processing cores

Development Ecosystem:

  • Comprehensive reference designs
  • Third-party IP partner network
  • Professional design services available
  • Online community forums and support

Migration and Compatibility

Upgrade Path:

  • Compatible with newer Spartan-7 and Artix-7 families
  • Pin-compatible variants within Spartan-6 family
  • Software migration tools available

Legacy Support:

  • Extended lifecycle support until 2030
  • Continued availability of development tools
  • Long-term supply chain commitment

5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

  • RoHS Directive 2011/65/EU: Fully compliant
  • Lead-Free Packaging: FGG484 variant uses Sn/Ag/Cu solder balls
  • Restriction of Hazardous Substances: Meets all current requirements
  • WEEE Compliance: Supports electronic waste recycling initiatives

REACH Regulation:

  • Registration: Compliant with EU REACH regulation
  • Evaluation: No substances of very high concern (SVHC)
  • Authorization: Meets all current authorization requirements
  • Chemical Safety: Full material composition disclosure available

Automotive Standards

AEC-Q100 Qualification:

  • Grade 2: -40°C to +105°C ambient temperature range
  • Automotive Electronics Council: Stress test qualified
  • Supply Chain: Automotive-qualified manufacturing processes
  • Traceability: Full component genealogy tracking

ISO Standards:

  • ISO/TS 16949: Quality management systems compliance
  • ISO 26262: Functional safety for automotive applications (when applicable)
  • ISO 14001: Environmental management systems

Export Control Classifications

US Export Administration Regulations (EAR):

  • ECCN: 3A001.a.7 (if applicable)
  • Export Control: Subject to US export regulations
  • License Requirements: May require export license for certain destinations
  • End User Restrictions: Dual-use technology controls apply

International Trade Compliance:

  • Harmonized System (HS) Code: 8542.31.00
  • Country of Origin: Manufactured in authorized facilities
  • Trade Compliance: Meets all applicable international trade regulations
  • Customs Documentation: Complete export/import documentation available

Quality and Reliability Standards

Quality Certifications:

  • ISO 9001: Quality management systems
  • AS9100: Aerospace quality management (where applicable)
  • IATF 16949: Automotive quality management
  • IPC Standards: PCB assembly and soldering standards compliance

Reliability Testing:

  • Temperature Cycling: JESD22-A104 compliant
  • Humidity Testing: JESD22-A101 compliant
  • Mechanical Stress: JESD22-B111 compliant
  • ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM) tested

Note: The XA6SLX75-3FGG484I represents a mature, proven FPGA solution backed by AMD’s commitment to long-term support and supply chain stability. With extended lifecycle support guaranteed until 2030, this device provides a reliable foundation for long-term industrial and automotive projects requiring high performance and proven reliability.