Key Components
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Microcontroller: e.g., ARM Cortex-M4 or similar
- Controls all device functions
- Manages user interface
- Handles data processing and storage
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Power Management:
- Battery management IC (for portable use)
- AC-DC converter (for mains operation)
- Multiple voltage regulators for different subsystems
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Electrical Stimulation Module:
- Digital-to-Analog Converter (DAC)
- High-voltage amplifier circuit
- Current-limiting safety circuit
- Electrode connection interface
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Ultrasound Therapy Module:
- Ultrasound transducer driver circuit
- Impedance matching network
- Safety monitoring circuit
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Biofeedback Module:
- Analog-to-Digital Converter (ADC)
- Instrumentation amplifiers
- Filters for noise reduction
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User Interface:
- LCD or OLED display
- Touch panel or membrane keypad
- Status LEDs
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Connectivity:
- Bluetooth Low Energy (BLE) for wireless control and data transfer
- USB for data transfer and potential charging
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Storage:
- EEPROM or Flash memory for settings and treatment protocols
PCB Considerations
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Layer Stack: 6-layer PCB recommended
- Top layer: Components and signal routing
- Inner layer 1: Ground plane
- Inner layer 2: Power plane
- Inner layer 3: Signal routing
- Inner layer 4: Signal routing
- Bottom layer: Components and signal routing
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Component Placement:
- Separate high-voltage sections from low-voltage control circuitry
- Group analog and digital sections
- Place sensitive components (e.g., ADCs) away from noise sources
- Consider thermal management for power components
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Signal Integrity:
- Use controlled impedance for high-speed signals
- Implement proper grounding and shielding techniques
- Minimize crosstalk between different functional blocks
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Power Distribution:
- Implement star grounding technique
- Use separate analog and digital grounds, joined at a single point
- Consider split power planes for different voltage domains
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Safety Considerations:
- Implement isolation between mains-connected and patient-connected circuits
- Use redundant safety mechanisms for critical functions
- Design for fail-safe operation
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Mechanical Considerations:
- Plan for heat dissipation (especially for ultrasound module)
- Include mounting points for enclosure and modules
- Consider ergonomics and ease of assembly
Firmware Considerations
- Implement different therapy modes (TENS, EMS, ultrasound, biofeedback)
- Develop user-friendly interface for therapy selection and control
- Implement safety checks and limits for all therapies
- Data logging and analysis features
- Bluetooth connectivity for remote control and data transfer
- Calibration routines for accurate therapy delivery
Safety and Regulatory Considerations
- Comply with medical device standards (e.g., IEC 60601-1, IEC 60601-2-10 for electrical stimulation)
- Implement comprehensive electrical safety measures
- Consider biocompatibility of materials for patient-contacting parts
- Plan for EMC/EMI testing and certification
- Implement software validation processes
- Prepare risk management documentation
- Plan for regulatory submissions (FDA, CE marking, etc.)