Product Overview
The Panasonic Megtron 6 family represents the industry standard for ultra-low loss, highly heat resistant circuit board materials designed specifically for high-speed digital applications. This advanced laminate system is engineered for mobile, networking, and wireless applications requiring exceptional signal integrity and thermal performance.
Key Technical Specifications
Electrical Properties:
- Dielectric Constant (Dk): 2.3-2.8 at 10 GHz (Low Dk = 3.7 at 1GHz)
- Dissipation Factor (Df): ≤0.0015 at 10 GHz (0.002 at 1GHz)
- Ultra-low insertion loss – 40% reduction compared to standard FR-4 at 10 GHz
Thermal Properties:
- Decomposition Temperature (Td): 410°C (770°F)
- Glass Transition Temperature (Tg): 180°C
- Thermal Conductivity: 0.5 W/m·K
Mechanical Properties:
- Tensile Strength: 0.8 kN/m (IPC-TM-650 2.4.8)
- Compatible with H-VLP (Hyper Very Low Profile) copper foil with surface roughness ≤1.5 µm
Product Variants
Laminate Options:
- R-5775(N) – Low Dk Glass Cloth Laminate
- R-5775 – Standard E Glass Cloth Laminate
Prepreg Options:
- R-5670(N) – Low Dk Glass Cloth Prepreg
- R-5670 – Standard E Glass Cloth Prepreg
Primary Applications
High-Speed Networking:
- 5G infrastructure and base stations
- Routers and switching equipment
- Data center backplanes
Advanced Electronics:
- IC testers and measuring instruments
- High-frequency computer systems
- RF PCBs and radio frequency applications
Specialized Equipment:
- Mainframe computers
- Millimeter-wave applications in 5G antenna modules
Key Performance Benefits
Signal Integrity Excellence:
- Ultra-low signal loss enabling longer signal reach
- Prevents signal echoes at very high frequencies
- Stable dielectric properties across frequency ranges
High-Density Interconnect (HDI) Capabilities:
- Excellent HDI and thermal performance for miniaturized designs
- Supports finer traces (≤25 μm) and microvias
- Compatible with laser drilling and sequential lamination processes
Manufacturing Advantages:
- Compatible with standard PCB manufacturing workflows
- Environmentally friendly lead-free soldering compatibility
- Available in 18 different thicknesses with wide range of prepreg options
Industry Compliance
Megtron 6 meets IPC specifications 4101/102/91, ensuring compliance with industry standards for thermal stability, mechanical strength, and electrical consistency required for mission-critical applications.
Competitive Advantages
- Superior processability compared to PTFE laminate materials while maintaining similar performance
- 5x better through-hole reliability compared to conventional high Tg FR4 materials
- Compliance with 3GPP Release 16 specifications for 5G NR (New Radio)
- Future-proof design foundation for next-generation wireless technologies
The Panasonic Megtron 6 laminate family delivers the perfect balance of electrical performance, thermal stability, and manufacturing compatibility, making it the ideal choice for engineers developing cutting-edge high-speed digital systems that demand uncompromising signal integrity and reliability.
