720 W charger design featuring a power factor corrected (PFC) AC-DC converter using PI’s HiperPFS-3 device and an isolated LLC converter using the HiperLCS-2 chipset. The HiperLCS2-HB resonant half-bridge switcher IC uses the thermally efficient POWeDIP package, reducing enclosure volume and eliminating the need for air vents and fans
Manufacturing a 720W charger PCB board involves high-precision processes to handle high power and thermal management. The PCB is typically multi-layered, using high-quality FR4 or metal-core substrates for heat dissipation. Advanced etching and plating ensure robust copper traces for high-current paths. Surface mount technology (SMT) and through-hole assembly are used for components like MOSFETs, transformers, and capacitors. Automated optical inspection (AOI) and functional testing verify reliability. Thermal vias and heatsinks prevent overheating. Strict quality control ensures efficiency, safety, and compliance with standards like UL and CE. This assembly supports fast charging for high-power devices like laptops and electric vehicles.
