6-layer HDI PCB with microvias entails:
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Structure:
- 6 conductive layers
- Multiple lamination cycles
- Microvias (typically less than 150 microns in diameter)
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Microvia types:
- Blind vias (connecting an outer layer to an inner layer)
- Buried vias (connecting inner layers)
- Stacked vias (microvias stacked on top of each other)
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Benefits:
- Increased functionality in a smaller form factor
- Improved electrical performance
- Better signal integrity
- Reduced electromagnetic interference
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Common applications:
- Smartphones and tablets
- Wearable devices
- Aerospace and defense equipment
- High-performance computing
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Manufacturing challenges:
- Requires advanced manufacturing capabilities
- More complex design rules
- Higher cost compared to standard PCBs
Regarding manufacturing in Hungary:
Hungary has a strong electronics manufacturing sector, particularly around Budapest and other major cities. The country has been attracting significant investment in high-tech manufacturing, including PCB production.
Some points to consider for HDI PCB manufacturing in Hungary:
- Advanced capabilities: Ensure the manufacturer has experience with HDI and microvia technology.
- Equipment: Check if they have the necessary advanced equipment for laser drilling and lamination.
- Quality control: Look for certifications like ISO 9001, ISO 14001, and potentially industry-specific certifications.
- Design support: Some manufacturers offer design assistance, which can be crucial for complex HDI layouts.
- Prototyping services: For complex designs, the ability to produce prototypes quickly can be valuable.
To help visualize the structure of a 6-layer HDI PCB with microvias, I can create a simple diagram for you.
