4 Layer RO4003c Board Manufacturing
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4 Layer RO4003c Board Manufacturing

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RO4003C is a high-frequency laminate material widely used in the design and manufacture of printed circuit boards (PCBs) for radio frequency (RF) and microwave applications. This document will explore the design considerations and manufacturing process for a 4-layer PCB using RO4003C material.

Material Properties

RO4003C, produced by Rogers Corporation, offers several advantages for high-frequency applications:

  • Low dielectric constant (Dk) of 3.38 ± 0.05 at 10 GHz
  • Low loss tangent of 0.0027 at 10 GHz
  • Stable electrical properties across a wide range of frequencies
  • Good thermal stability
  • Compatible with standard FR-4 fabrication processes

These properties make RO4003C an excellent choice for applications requiring high-frequency performance and reliability.

Design Considerations

RO4000 Laminates RO4003C and RO4350B – Data Sheet

Stack-up

A typical 4-layer RO4003C board stack-up might consist of:

  1. Top layer (Signal)
  2. Inner layer 1 (Ground plane)
  3. Inner layer 2 (Power plane)
  4. Bottom layer (Signal)

The thickness of each layer and the overall board should be carefully considered based on the specific requirements of the design.

Impedance Control

Controlling impedance is crucial in high-frequency designs. For RO4003C boards:

  • Use appropriate trace widths and spacing to achieve the desired impedance (usually 50Ω for RF applications)
  • Employ impedance calculators or field solvers to determine the correct dimensions
  • Consider the effect of copper plating on final trace dimensions

Signal Integrity

To maintain signal integrity:

  • Keep high-frequency traces as short and straight as possible
  • Use ground vias near signal vias to provide a clear return path
  • Avoid right-angle bends in traces; use 45-degree or curved traces instead
  • Maintain consistent reference planes beneath signal traces

EMI/EMC Considerations

To minimize electromagnetic interference (EMI) and improve electromagnetic compatibility (EMC):

  • Use stitching vias to connect ground planes and reduce ground loop areas
  • Implement proper shielding techniques for sensitive circuits
  • Consider the use of guard traces for critical signals

Manufacturing Process

Material Preparation

  1. Begin with RO4003C core material and prepreg layers
  2. Carefully handle the material to avoid contamination or damage

Inner Layer Processing

  1. Clean the copper surfaces
  2. Apply photoresist to the copper layers
  3. Expose the photoresist using the inner layer artwork
  4. Develop the photoresist, revealing the circuit pattern
  5. Etch away unwanted copper
  6. Strip remaining photoresist
  7. Perform automated optical inspection (AOI)

Lamination

  1. Stack the inner layers with prepreg material between them
  2. Apply outer layer copper foils
  3. Place in a lamination press under heat and pressure to bond the layers

Drilling

  1. Drill through-holes and vias using precision CNC drilling machines
  2. Employ appropriate drill bits and speeds for RO4003C material

Plating and Outer Layer Processing

  1. Clean and prepare the board for plating
  2. Electroless copper plating to coat hole walls
  3. Apply dry film photoresist to outer layers
  4. Expose and develop the photoresist
  5. Electrolytic copper plating to build up copper thickness
  6. Strip the photoresist
  7. Etch to remove unwanted copper

Solder Mask and Silkscreen

  1. Apply solder mask to protect copper traces
  2. Expose and develop solder mask
  3. Apply silkscreen for component markings and board identification

Surface Finish

  1. Apply the chosen surface finish (e.g., ENIG, immersion tin, or HASL)

Final Inspection and Testing

  1. Perform final AOI
  2. Conduct electrical testing (e.g., flying probe or bed-of-nails)
  3. Check impedance control on critical traces

Conclusion

Designing and manufacturing a 4-layer RO4003C board requires careful consideration of material properties, design rules, and manufacturing processes. By following best practices in PCB design and leveraging the excellent high-frequency characteristics of RO4003C, engineers can create high-performance boards for demanding RF and microwave applications. The manufacturing process, while similar to standard FR-4 boards, requires extra care and precision to maintain the material’s superior electrical properties throughout fabrication.

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