RAYMING 4 Layer 1.2mm Rogers 3010 + FR4 Hybrid ENEPIG PCB

Original price was: $1,800.00.Current price is: $1,790.00.

Rogers 3010+FR4 hybrid PCB

Layer: 4 Layer PCB

Dielectric Constant:10.2

Board thickness: 1.2mm

Surface finsihed: ENEPIG

Solder Mask:none
Silkscreen: None.

Understanding the PCB Structure

Rogers 3010 Material

Rogers 3010 is a high-performance ceramic-filled PTFE composite material known for its excellent electrical properties, particularly at high frequencies. Some key characteristics include:

Property Value
Dielectric Constant (Dk) 10.2 ± 0.3
Dissipation Factor 0.0022
Thermal Conductivity 0.66 W/m/K
Coefficient of Thermal Expansion (CTE) 12 ppm/°C

FR4 Material

FR4 is a glass-reinforced epoxy laminate material widely used in PCB manufacturing. It offers a good balance between cost and performance for many applications. Key properties include:

Property Value
Dielectric Constant (Dk) 4.2-4.8
Dissipation Factor 0.017-0.019
Thermal Conductivity 0.25 W/m/K
Glass Transition Temperature (Tg) 130-140°C

Hybrid Stack-up

The hybrid stack-up combines the benefits of both Rogers 3010 and FR4 materials. A typical configuration might look like this:

  1. Top Layer: Rogers 3010
  2. Inner Layer 1: FR4
  3. Inner Layer 2: FR4
  4. Bottom Layer: Rogers 3010

This arrangement allows for high-frequency signal routing on the outer layers while maintaining cost-effectiveness with FR4 inner layers.

ENEPIG Surface Finish

What is ENEPIG?

ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold. It’s a high-performance surface finish that offers several advantages:

  1. Excellent solderability
  2. Long shelf life
  3. Flat surface for fine-pitch components
  4. Compatibility with both tin-lead and lead-free solders

ENEPIG Layer Structure

The ENEPIG finish consists of multiple layers:

Layer Typical Thickness
Copper (base) PCB copper
Electroless Nickel 3-6 µm
Electroless Palladium 0.05-0.15 µm
Immersion Gold 0.03-0.05 µm

Benefits of 4 Layer 1.2mm Rogers 3010 + FR4 Hybrid ENEPIG PCB

  1. Improved Signal Integrity: The low-loss Rogers 3010 material on outer layers enhances signal integrity for high-frequency applications.
  2. Cost-Effectiveness: The use of FR4 for inner layers helps reduce overall material costs compared to all-Rogers designs.
  3. Enhanced Thermal Management: The hybrid stack-up offers better thermal performance than pure FR4 boards.
  4. Excellent Surface Finish: ENEPIG provides superior solderability and pad flatness for fine-pitch components.
  5. Balanced Performance: Combines the strengths of high-frequency materials with standard FR4 capabilities.


This specialized PCB configuration finds use in various high-frequency and high-speed applications, including:

  • 5G and wireless communication equipment
  • Radar systems
  • Satellite communication devices
  • High-speed digital systems
  • Test and measurement equipment
  • Aerospace and defense electronics

Manufacturing Process

Step 1: Material Preparation

The process begins with the preparation of Rogers 3010 and FR4 materials, cutting them to the required size and cleaning them thoroughly.

Step 2: Inner Layer Processing

The FR4 inner layers are processed first, including:

  • Copper patterning
  • Oxide treatment
  • Optical inspection

Step 3: Layer Stack-up and Lamination

The layers are stacked in the following order:

  1. Rogers 3010 (top)
  2. FR4 (inner layer 1)
  3. FR4 (inner layer 2)
  4. Rogers 3010 (bottom)

The stack is then laminated under high pressure and temperature.

Step 4: Drilling and Plating

  • Holes are drilled according to the design specifications.
  • The board undergoes desmear and electroless copper plating.

Step 5: Outer Layer Processing

The Rogers 3010 outer layers are processed, including:

  • Copper patterning
  • Soldermask application
  • Silkscreen printing

Step 6: ENEPIG Plating

The ENEPIG surface finish is applied in the following sequence:

  1. Electroless nickel plating
  2. Electroless palladium plating
  3. Immersion gold plating

Step 7: Final Inspection and Testing

The completed PCBs undergo rigorous inspection and testing, including:

  • Automated optical inspection (AOI)
  • Electrical testing
  • Impedance testing
  • X-ray inspection for internal layers

Frequently Asked Questions (FAQ)

Q1: Why use a hybrid PCB with Rogers 3010 and FR4?

A1: The hybrid design combines the excellent high-frequency performance of Rogers 3010 on the outer layers with the cost-effectiveness of FR4 on the inner layers. This approach optimizes both performance and cost for applications requiring high-frequency capabilities.

Q2: What are the advantages of ENEPIG finish over other surface finishes?

A2: ENEPIG offers excellent solderability, long shelf life, compatibility with various soldering processes, and a flat surface ideal for fine-pitch components. It also provides better corrosion resistance compared to some other finishes.

Q3: Is this PCB suitable for all high-frequency applications?

A3: While this PCB configuration is excellent for many high-frequency applications, the suitability depends on specific requirements such as operating frequency, power levels, and environmental conditions. It’s best to consult with a PCB design expert for your particular application.

Q4: How does the 1.2mm thickness affect the PCB performance?

A4: The 1.2mm thickness is a balance between mechanical stability and electrical performance. It allows for good signal integrity while maintaining sufficient rigidity. However, the optimal thickness depends on the specific application and design constraints.

Q5: Can this PCB be modified for different layer counts or thicknesses?

A5: Yes, the basic concept of a Rogers 3010 + FR4 hybrid with ENEPIG finish can be adapted to different layer counts and thicknesses. However, any changes should be carefully considered in terms of electrical performance, mechanical properties, and manufacturing feasibility.