Whatever material you use for your PCB fabrication plays a huge role in determining its performance. Back then, the FR4 material was a well-known and common one. However, with high performance designs, it is very crucial to use the appropriate laminate. This is why it is now necessary to make use of a material that features great properties. This will not only ensure great performance, but it will also enhance functionality in applications
A material’s environmental stability is a very important factor to consider when choosing a material. For the purpose of this article, we will be focusing on the Panasonic HEPER R-1755M and what it offers. Stay on this page and you’ll surely learn a lot.
What is the Panasonic HEPER R-1755M Circuit Board Material?
The Panasonic HEPER R-1755M is a great material for multilayer circuit boards. This is because it has high reliability and heat resistance.
Furthermore, this material is great for environments of high usage with great CAF resistance, laminate processability, and through-hole reliability. In addition, this material is halogen-free. This means that there are no halogen components in this material. This is good because halogens like bromine and fluorine could be harmful.
This material due to its great properties and features is highly useful in automotive components. Let’s continue with this article by discussing the main properties of this material.
What are the Properties of the Panasonic HEPER R-1755M?
The following are the properties of the Panasonic HEPER R-1755M.
Glass Transition Temperature
Using the DSC test method, the Panasonic HEPER R-1755M has a glass transition temperature of 153 degrees Celsius. Glass transition temperature has to do with the temperature where the material turns amorphous when laminating under pressure and at a high temperature. This temperature isn’t the maximum at which this pcb material operates, but the maximum at which it can endure within a short period before deteriorating.
Using the TG/DTA test method, the thermal decomposition of the Panasonic HEPER R-1755M is 355 degrees Celsius. Thermal decomposition reveals that temperature whereby the Panasonic HEPER R-1755M chemically decomposes. Here, this material loses about 5% of its mass weight. Furthermore, thermal decomposition requires an endothermic reaction, because there is a need for heat in order to break the chemical bonds of the material.
Coefficient of Thermal Expansion
At the X and Y axis at α1, the Panasonic HEPER R-1755M has a CTE value of 11 – 13 ppm/℃ and 13 – 15 ppm/℃ respectively. Furthermore, at the Z-axis and α1, it has a CTE value of 40 ppm/℃, while at α2, its CTE is 240 degrees Celsius. The coefficient of thermal expansion indicates how much a material can expand when it is heated.
The Panasonic HEPER R-1755M has a dielectric constant of 4.6 at 1 GHz. This property measures a material’s ability to store some electrical energy in a given electric field.
The dissipation factor of the Panasonic HEPER R-1755M PCB material is 0.014 at 1 GHz. This value indicates the Panasonic HEPER R-1755M PCB material’s efficiency to act like an insulator. Furthermore, the Panasonic HEPER R-1755M PCB material has a low dissipation factor, which means that it is very efficient as an insulating material.
The water absorption of the Panasonic HEPER R-1755M is 0.11%. This value is great being that when a PCB material absorbs water and moisture, it can lead to different failure mechanisms. When used in printed circuit boards it means it has the ability to prevent water or moisture from finding its way in, thereby causing the device to stop working.
The flexural modulus of the Panasonic HEPER R-1755M is 22 GPa. Flexural modulus is a well-known physical property that denotes the ability for the Panasonic HEPER R-1755M to bend. Mechanically, we can explain further by saying it is the ratio of the stress to the strain when bending or flexural deformation is going on. This is equivalent to a material’s elastic modulus.
The peel strength of the Panasonic HEPER R-1755M is 1.5 kN/m. A material’s peel strength has to do with the material’s bond strength. To know the peel strength, a peel test is conducted. Here you pull the materials apart at a constant speed. Now, this average force necessary to pull this material apart is then used with the bond’s width measurement which determines the peel strength.
The Panasonic HEPER R-1755M has a delamination time of 18 minutes. This is the time whereby the copper and resin, or reinforcement and resin separates or delaminates.
What Benefits Does the Panasonic HEPER R-1755M Offer?
Before are the benefits of the Panasonic HEPER R-1755M.
Low loss material
One well known issue of high frequency PCB application is loss of signal. This is one good reason why it is very important to use materials like the Panasonic HEPER R-1755M having low transmission loss. Another great benefit here is that it ensures high data transmission. Also, the Panasonic HEPER R-1755M is ideal for use in the communication industry.
As mentioned earlier, halogen is a toxic material and it is very harmful to humans and the environment. The Panasonic HEPER R-1755M is free of halogen constituents. Therefore, it is environmentally safe.
Panasonic HEPER R-1755M material resists high heat. With this, you’ll achieve a reliable operation. Also, this multilayer PCB material ensures high reliability in environments of high temperature. The thermal properties of this material contribute to this feature.
This is another benefit of using the Panasonic HEPER R-1755M laminate for PCB fabrication. This material performs well both electrically and thermally. Also, this material is electrically stable over a wide frequency range.
The Panasonic HEPER R-1755M material is one with a lot of great properties. It is a great material for multilayer circuit boards. This is because it has high reliability and heat resistance. Furthermore, this material is great for environments of high usage with great CAF resistance, laminate processability, and through-hole reliability. If you have any questions, please ask us here.