Nelco N8000Q Cyanate Ester blend the convenience of a prepreg with the performance of a laminating resin. As a result, this product provides an economical answer to the material purity requirements of printed circuit boards and electronic assemblies. Nelco N8000Q Cyanate Ester Epoxy are essential for use with copper foil, copper-clad laminates, and electroless nickel-plated (ENEP) laminates.
Nelco’s Cyanate Ester resin system provides high-strength bonds when used with either a barrier film or a surface primer. As a result, it is ideal for plated copper products and when high thermal or electric power dissipation is a factor.
Rayming PCB & Assembly uses Nelco N8000Q Cyanate Ester Epoxy to manufacture printed circuit boards. This is because it has a low outgassing rate, exhibits excellent conformability, resists plating lift-off. Additionally, it provides good adhesion to copper foil and supports. Also, it has excellent electrical insulating properties up to 600 volts per mil (V/mil). Finally, it retains its strength at elevated temperatures.
Features of Nelco N8000Q Cyanate Ester Epoxy
Nelco N8000Q Cyanate Ester Epoxy are compatible with most barrier materials. Therefore, it provides a low-outgassing alternative to aliphatic, aromatic, and highly saturated resins.
1. High Thermal Performance:
The high electrical resistance and the absence of outgassing give the material excellent thermal stability. So, the Tg of Nelco N8000Q Cyanate Ester is -60°C to +250°C, approximately ten times that of standard epoxy resins. In addition, low Z-axis expansion allows for use at extremely high temperatures.
2. Superior Electrical Properties:
The Cyanate Ester resin retains its strength and insulating properties up to 600 V/mil at 250°C. In addition, surface conductivity is excellent and has excellent creep resistance.
3. Typical Cyanate Ester Processing:
Nelco N8000Q Cyanate Ester Epoxy are mixed by weight. Then, we apply it to the copper foil, copper-clad laminate, or ENEP laminate using a standard screen printing process. As a result, a heated cure of 180°C to 200°C for four hours (or at the minimum temperature needed to achieve full cure) gives maximum bond strength.
4. S-glass and Quartz options:
S-glass reinforcement combined with Nelco N8000Q Cyanate Laminate and Prepreg produces a laminate that retains its flexural strength at high temperatures. Also, Quartz fibers provide high thermal stability, dimensional stability, and excellent electrical properties.
5. Vacuum laminated:
Vacuum lamination of Nelco N8000Q Cyanate Ester Epoxy with S-glass-reinforced Nelco V5000E or CibaGeigy LCP-1020 laminates is an excellent method for assembling printed circuit boards. So, the combined thermal conductivity of the laminates provides excellent tracking resistance. Vacuum pressure pulls the epoxy resin into all voids and gives a smooth, flat surface.
6. N8000 achieves specifications of IPC-4101/70 (s-glass), UL 94V-0 and /71 (e-glass) specifications:
Nelco N8000Q Cyanate Ester comply with UL 94V-0 (S-glass) and IPC 4101/70 (S-glass) and /71 (e-glass), which are standards for ignition sources.
7. N8000Q attains the specifications of IPC-4101/61:
Nelco N8000Q Cyanate Ester Epoxy meet IPC-4101/61 requirements for epoxy and laminates. IPC-4101/61 classifies materials according to flammability, outgassing, solvent content, and general processing.
8. RoHS compliant:
The Cyanate Ester resin is compliant with the European Restriction of Hazardous Substances directive (RoHS). It is equivalent in the United States. This means that Nelco N8000Q Cyanate Ester meet the directive’s requirements in Europe and North America.
Density: NELCO N8000Q is a lightweight, stiff, and impact-resistant material. It amounts to 1.73g/cm3.
The peel strength of NELCO N8000Q resin is 1.75 kN/m. Therefore, it indicates a high value for peel strength. NPK curves of NELCO N8000Q below 0.6, indicating that it has a high Mooney Viscosity Index (MVI). The modulus of elasticity of NELCO N8000Q resin is 15.9 GPa.
The thermal conductivity at 25 °C~50 °C is 0.340 W/m·K, which is lower than other epoxy resins in the market. Furthermore, the specific heat capacity of NELCO N8000Q is 0.9991 J/(kg·K). Therefore, the CTE linear of NELCO N8000Q is 70.0 µm/m-°C at a Temperature of 50.0 – 250 °C, which is higher than other epoxy resins in the market.
Volume Resistivity: The volume resistivity at 23°C is 1.00e+13 ohm-cm, which is lower than other epoxy resins. Surface Resistance: The surface resistance of NELCO N8000Q is 1.00e+13 ohm at 23°C and increases as the temperature rises. Constant: The dielectric constant of NELCO N8000Q is 3.2. Arc Resistance: Additionally, the Arc resistance of NELCO N8000Q is 125 secs. The dielectric strength of NELCO N8000Q is 59.1kV/mm. Dielectric Breakdown of NELCO N8000Q resin is >= 50000 V. Dissipation factor of NELCO N8000Q is 0.006.
NELCO N8000Q Cyanate Ester are helpful as a component in most laminated electronic substrates and printed circuit boards. Additionally, it is beneficial in high-temperature applications. Examples include heaters, resistive heating elements, and ceramic capacitors for resistive circuitry. As a result, the Cyanate Ester resin also has a high thermal and excellent creep resistance.
NELCO N8000Q Cyanate Ester Epoxy can fill the void in high-end markets with Cyanate ester resin formulations. However, it did not replace mainstream Cyanate ester resins already on the market today.
1. Radomes and Secondary Aerospace Structures:
NELCO N8000Q is helpful in the radome and other critical applications. As a result, it is also used to replace high-temperature epoxy resin in various Space Shuttle components. In addition, we use them on many NASA satellites, and they work well during splashdown operations.
NELCO N8000Q Cyanate Ester Epoxy have been active over the years. But, it is not yet a mainstream commodity.
2. High-Speed Computing:
High performance and high power chips, such as microprocessors, memory chips, and embedded devices, require high speed and high power conductive adhesives. Unfortunately, cyanate Ester resins generally have poor thermal stability at high temperatures.
3. Vfireless Communications:
Vfireless communication is also known as fiber optic communication. However, it is not yet a mainstream technology. NELCO N8000Q Cyanate Ester Epoxy have low thermal shock resistance.
4. Underhood Automotive:
Electronics, such as airbag sensors and climate control systems, have found their way into modern automobiles. Therefore, the engine compartment components require NELCO N8000Q Cyanate Ester Epoxy.
5. Direct Chip Attach:
The performance required from optics in aerospace applications has advanced and continues to advance at a rapid pace. Therefore, electronics and optics have become interdependent. For example, direct chip attaches have become the mainstream technology for high-speed data communication, such as fiber optics. NELCO N8000Q Cyanate Ester are also helpful in this application.
NICWL is a term used to describe Nano-scale Integrated Circuit Wafer-Levels. NELCO N8000Q Cyanate Ester have excellent adhesion to glass, silicon, and difficult-to-be-bonded metals.
7. BGA Multilayers:
NELCO N8000Q Cyanate Ester Epoxy are essential in multilayers commonly found in the radio frequency industry.
They have phase-change properties that affect materials’ mechanical, electrical, and thermal properties. High-temperature environments require attention to this phase change, which drives engineers to explore new materials.
“Phase Change”: There are two-phase changes: adiabatic and isothermal.
8. Fine-Line Multilayers:
Multilayers consist of a barrier layer, a spacer layer, and an active (mechanical) layer. The thicknesses between the layers are very small. In many cases, it’s necessary to design interlayer electrical connections using the diffusion model. This means that the electrical properties of all three layers must be analyzed.
NELCO N8000Q Cyanate Ester have gained a reputation for their ability to operate in various applications. They range from high-temperature aerospace components to low-temperature, high-power devices. In addition, the Laminate and Prepreg also gain a reputation for being an effective replacement for mainstream Cyanate ester resin formulations.