How to Distinguish the First, Second and Third Orders of HDI PCB

HDI PCB Manufacturer

 

 

The fabrication process of first-order HDI PCB is relatively simple and well controlled.

 

While the second-order HDI PCB is complex due to the issue of alignment, punch and copper problem.

 

There are a variety of second-order HDI PCB designs.

 

One is the staggered position of the various stages which needs to connect the next-layer through the wire in the middle layer connectivity, the practice is equivalent to double first-order HDI PCB.

 

The second is to overlap two first-order holes, thus second-order PCB is achieved by the superposition method, and the processing is also similar to the double first-order, but there are many technical points to be particularly controlled.

 

The third is to punch directly from the outer layer to the third layer (or N-2 layer), the process is much different from the previous, and the drilling process is more difficult.

 

 

Second-order HDI PCB Design

 

 

For Example:

 

The first and second order of the 6-layer board needs laser drilling, that is the HDI board.

 

The 6-layer first-order HDI board refers to blind holes: 1-2, 2-5, 5-6. That is, 1-2, 5-6 require laser drilling.

 

The 6-layer second-order HDI board refers to blind holes: 1-2, 2-3, 3-4, 4-5, 5-6. It requires 2 times laser drilling.

 

First drill a buried hole of 3-4, then laminate 2-5,

 

Then drill the 2-3, 4-5 laser holes for the first time, followed by the second laminate 1-6.

 

Then drill the 1-2, 5-6 laser holes for the second time.

 

Finally drill the through hole.

 

It can be seen that the second-order HDI board has undergone two lamination and two laser drillings.

 

Board Lamination Times:

 

First-order PCB: one lamination is enough, just like the most common circuit board.

 

Second-order PCB: Lamination twice. Take the example of eight-layer circuit board with blind/buried vias, laminate layer 2-7 with well-made blind/buried vias first, and then laminate layer 1 and 8 with well-made through holes.

 

Third-order PCB: its process is much more complicated. Laminating layer 3-6 first, then layer 2 and 7, finally layer 1 and 8. It requires 3 lamination times, so most PCB manufacturers can not make it.

 

 

HDI Board Lamination Times