The manufacturing of PCBs makes them equipped with multiple layers, and they are thin in size. It is due to the usage of different methods that enhance the interconnect density.
The name of the technology is Every Layer Interconnect (ELIC), which helps to produce extremely thin and functional circuits.
Additional features rendered by these HDI boards include layers filled with copper and come with in-pad micro vias that allow smooth and flawless interconnections.
Designing an ELIC PCB Stackup
ELIC is also called any-layer HDI. It means that any layer in the stack has the ability to conduct signals based on high-density interconnects present between all the layers. The features of individual layers are copper-filled, laser-drilled micro vias.
ELIC relies on copper-filled micro vias, which is useful for producing functional connections among the layers. The benefits of this method include connections between any two layers in the PCBs after the layers are all stacked.
Another good advantage is that it is flexible, and the producer of PCBs can use it to magnify the interconnect density present on any layer.
ELIC PCB Manufacturing
The ELIC manufacturing process starts with two major things. These are ultra-thin cores with laser micro vias along with a solid copper base. The micro vias are filled with copper internally. The next step is to include a dielectric layer during the process of lamination.
Laser drilling is on the recent layer to complete the ELIC PCB stack. The process is conducted in a loop unless the desired PCB stack develops that contains copper-packed micro vias.
The benefit of using copper filling is the structural integrity of the board. Another reason to use this filling is to prevent dimpling/voiding in the interior micro vias.
Advantages and Characteristics of ELIC PCB
1. Smaller Size
HDI PCB can invite many circuit parts even if there is little space for installation. It helps to produce portable devices that contain the ability to consume less electricity.
Such a technique is useful in the manufacturing of smartwatches and other compact smart devices.
2. Options of Flexible Mounting
ELIC PCB is also malleable and reformable from the corners. During this action, it does not get damaged at all.
Its flexibility and no use of an external coating like conformal coatings (CC) make this whole process free of technical complications.
It works best with former versions of rigid PCB, which do not allow flexible bending and other reformations.
3. Faster Speed
ELIC HDI PCBs work faster in terms of functioning. These functions include processing and data transfer rates at a rapid speed for efficient execution.
Such a benefit is useful when there is a need for devices for processing huge datasets and large files transmission that typically happens in cellular communications. This strategy is useful in PGA chipsets or discrete components for ELIC PCBs.
4. Excellent Heat Dissipation Performance
It produces extremely impressive thermal conductivity, which helps in quick and effective heat dissipation during any kind of action. Such devices are useful to make industrial robots and semiconductors efficient in their performance.
5. Short Lead Time
It needs much lesser time for the entire manufacturing. The process of production is not extensive, which is why it takes little time the completion.
For instance, FR-4 boards and glass fiber boards are easier to produce when the production process is simpler and takes less time.
6. High Reliability
ELIC HDI PCBs feature anti-jamming capability, which makes them more reliable than former versions of the PCBs.
Applications of ELIC PCB
ELIC is a major component f the PCBs which are used in GPUs and memory cards. Today, the devices like smart phones, tablets, and wearable smart gear are also working with ELIC.
The attributes like high pin count and fine pitch are the plus points of these devices.
The layer count in these devices is limited to 10. This strategy helps the producers and designers with desired interconnect in boards with a small footprint.
ELIC PCBs are common in the domains of high IO density, such as in FPGAs when a machine needs more than one interface during the process. These can be helpful in those boards that need RF routing on PTFE materials.
In both situations, it is important to protect the device from impedance mismatch and resulting return loss that can create further complications. The routing from one layer to the other is seamless, and there is no need to leave the stubs like back-drilling.
Keep in mind that if the dielectric reduces in amount, the routing process prolongs as well. It impacts the trace length and impedes the organic performance.
· ELC HDI RIGID-FLEX
ELIC also has applications in many HDI rigid-flex PCBs. The size of packages is now much alleviated by using the ELIC-capable PCBs and folded rigid-flex boards in tandem for the boards that contain only one package. The condition is that any of the bend regions will resist any load on the micro via stacks during its performance.
The inner signal layers, which are high in speed and density, both comprise more than one power planes that protect the signals from coming in contact with each other to keep the crosstalk at bay.
It helps the EMC compliance to resist excessive radiation. One solution in the form of moderate layer count stack-ups helps with the maintenance of high density and EMC compliance. It automatically lowers the signal count and does not use any other ground, which impacts the crosstalk and EMI in a negative way.
That’s why it is important to keep such benefits in mind before producing any devices which contain ELIC PCBs.