The significance of PCB material in technology and engineering is necessary. This is because of its great use in consumer devices like smartphones, as well as infrastructure that ensures the functioning of these devices.
This is a very good reason why there is a need to choose the right PCB material for your needs. Have you been searching for one? Then, we have a good recommendation for you and that is the Doosan DS-8502LC PCB Material. If you wish to know more about this PCB material with high reliability, please continue reading.
What is the Doosan DS-8502LC PCB Material?
The Doosan DS-8502LC PCB Material is a reliable material for printed circuit boards due to its great features. These include its high temperature for glass transition, low dissipation factor, low dielectric constant and low coefficient of thermal expansion.
Furthermore, the Doosan DS-8502LC PCB Material is useful in different applications, which includes SLP for Smartphones and EFSSD. The reliability of this material cannot be questioned after all these great features it possesses.
What are the Properties of the Doosan DS-8502LC PCB Material?
The properties of the Doosan DS-8502LC are categorized into three. These include thermal properties, mechanical properties, and electrical properties. Also included here are other properties of this material. Please join me as we quickly consider them.
Thermal Properties
The Doosan DS-8502LC has a glass transition temperature (DMA) of 260 degrees Celsius. This is the temperature at which glass transition occurs and it is usually lower in contrast to the melting temperature of the material’s crystalline state. At this temperature, the material transforms from its ductile look to one that is brittle and hard.
Also, the decomposition temperature of this material is 430 degrees Celsius. This value indicates the temperature at which the material will decompose chemically. It involves an endothermic reaction. Furthermore, its T-288 value is greater than 120 minutes.
At the X.Y axis, it has a coefficient of thermal expansion (CTE) of 10/9 ppm/℃. Also, at the Z axis, the CTE is 20/120 ppm/℃. In addition, it has a thermal conductivity of 0.6 W/m·k. The coefficient of thermal expansion (CTE) is the rate at which a printed circuit board material expands while it heats. In addition, the maximum operating temperature is 130 degrees Celsius, while the Z expansion is 1.2%.
Mechanical Properties
The following are the mechanical properties of the Doosan DS-8502LC PCB Material. The Doosan DS-8502LC has a Young’s modulus value of 30 GPa. This value indicates how this material can easily deform and stretch.
Also, its Flexural strength is 30 Mpa, which signifies the ability of the material to resist changes or deformation anytime it is under load. Furthermore, its storage modulus is 29 GPa and lastly, it has a peel strength of 0.75 kgf/cm. Generally, this value helps in measuring the material’s bond strength, most likely an adhesive
Electrical Properties
The electrical properties of the Doosan DS-8502LC PCB Material include the following. It has a dielectric constant of 3.5 at 10GHz. Also, at 10GHz, it has a Df value of 0.007.
Both values (dielectric constant and dissipation value) are low, which makes them suitable and reliable in different applications. Dielectric constant has to do with a quantity that measures a material’s ability to store some electrical energy in a given electric field.
This value indicates the material’s inefficiency to act like an insulator. Furthermore, this material has a low dissipation factor; therefore, it is very efficient as an insulating material.
Other Properties
Other physical properties of the Doosan DS-8502LC PCB Material asides from the ones mentioned above. These include the water absorption and flammability. This PCB material has a flammability rating of V-0. This means that burning has to stop in 10 seconds. Also, its water absorption is at 0.15%. Water absorption is the quantity of water that the material absorbs.
Features of the Doosan DS-8502LC PCB Material
Below are the main features of the Doosan DS-8502LC PCB Material
Ultra High glass transition temperature (Tg)
The temperature for glass transition is that temperature at which a material such as the Doosan DS-8502LC PCB Material transforms from its initially ductile nature to something that is brittle and hard. Furthermore, the Doosan DS-8502LC PCB Material has a high Tg. This once again proves that this material has high reliability.
Low Coefficient of Thermal Expansion (CTE)
One great feature of the Doosan DS-8502LC PCB Material is its low coefficient of thermal expansion. This property (CTE) indicates the manner at which a material will expand for every 1 degree centigrade increase in temperature. This means that the shape of the material will not be affected much when there’s a change in temperature
Low Dissipation Factor (Df)
Dissipation factor helps in measuring the insulating material’s inefficiency. This property also reveals how much or how effective a material will be in different environments and applications. This also indicates a material’s inefficiency to act like an insulating material or hold energy. Doosan DS-8502LC PCB Material has a low dissipation factor. This means that its insulator system is more efficient.
Low Dielectric Constant (Dk)
A material’s dielectric constant is very necessary for impedance considerations and signal integrity. These factors are very important and critical for high electrical performance. The Doosan DS-8502LC PCB Material has a low dielectric constant, which makes it very useful for high power and frequency applications. This helps in reducing any loss of electric power.
Applications of the Doosan DS-8502LC PCB Material
The following are areas where you can apply the Doosan DS-8502LC PCB Material.
- SLP for Smartphones
- Solid device for server
Conclusion
We hope we have been able to explain what the Doosan DS-8502LC PCB Material is, its properties, as well as its applications. It is a reliable material for printed circuit boards due to its great features. These include its high temperature for glass transition, low dissipation factor, low dielectric constant and low coefficient of thermal expansion. If you have some questions after reading through this article, feel free to ask us.
