Doosan Corporation is known to produce copper clad laminates of high-quality. Copper clad laminates are known to serve as base materials for printed circuit boards. They make use of wood pulp paper or glass fiber as a reinforcing material. Also, this is a product that came to be through copper clad lamination on either the two sides or just one of the reinforcing material’s sides after it must have been soaked inside resin.
In this article, we will be focusing on the Doosan Low loss DS-7409DV. We will talk about its features, properties, and more. Therefore, if you wish to gain much knowledge on this topic, please get set, we will be taking you through different subheadings to help you out. Please continue reading as we explain further.
What is the Doosan Low loss DS-7409DV?
The Doosan Low loss DS-7409DV is a copper clad laminate produced by Doosan Corporation, which are very useful in printed circuit boards.
The Doosan Low loss DS-7409DV is great for through hole reliability. Also, it works fine for any soldering process that is lead free. Also, it has a low dissipation factor and dielectric constant, Low coefficient and thermal expansion, High glass transition temperature, and excellent thermal performance.
The applications of the Doosan Low loss DS-7409DV include base stations, high frequency measuring instruments and modules. Also, it is useful in high speed network and computing equipment.
Let’s continue as we elaborate more on the features of the Doosan Low loss DS-7409DV.
What are the Features of the Doosan Low loss DS-7409DV?
Below are the main features of the Doosan Low loss DS-7409DV.
Low Dissipation factor and dielectric constant
The Doosan Low loss DS-7409DV has a low dissipation factor and dielectric constant, which makes it very useful for high signal integrity and signal speed.
Low coefficient and thermal expansion
The Doosan Low loss DS-7409DV has a low coefficient of thermal expansion, which means that the material’s shape will not experience significant changes.
High glass transition temperature
The Doosan Low loss DS-7409DV also has a high glass transition temperature. This means that this material has the ability to transform from a material that is ductile, to something brittle and hard.
Excellent thermal performance
The Doosan Low loss DS-7409DV also has excellent thermal performance. This property relates to its heat conductivity. This also means that this material will exhibit the properties when you pass heat through it.
Other great features of the Doosan Low loss DS-7409DV includes its great through hole reliability. Also, it works fine for any soldering process that is lead free.
What are the Applications of the Doosan Low loss DS-7409DV?
Below are areas where the Doosan Low loss DS-7409DV is applicable.
Base stations serve as the main point of connection of any wireless device to aid communication. Also, it helps in connecting the device further to other devices or networks.
High speed network equipment and computing
The Doosan Low loss DS-7409DV is also very useful and plays a huge role in any high speed network equipment and computing.
High frequency measuring instruments and modules
You can also apply the Doosan Low loss DS-7409DV in measuring instruments and modules of high frequency.
What are the Properties of the Doosan Low loss DS-7409DV?
The properties of the Doosan Low loss DS-7409DV can be categorized as thermal properties, mechanical properties, and electrical properties.
The Doosan Low loss DS-7409DV has a glass transition temperature (DMA) of 225 degrees Celsius and a decomposition temperature of 400 degrees Celsius. Furthermore, its T-288 value is greater than 120 minutes.
Also, at the X, Y axis, it has a coefficient of thermal expansion (CTE) of 16/16 ppm/℃. Also, at the Z axis, the CTE is 45/270 ppm/℃. In addition, it has a thermal conductivity of 0.4 W/m·k. In addition, the Z expansion is 2.6%.
The following are the mechanical properties of the Doosan Low loss DS-7409DV. The Doosan Low loss DS-7409DV has a Young’s modulus value of 22 to 24 GPa, while its Flexural strength is 420 Mpa. Furthermore, its tensile strength is 220 MPa and lastly, it has a peel strength of 1.0 kgf/cm.
The electrical properties of the Doosan Low loss DS-7409DV include the following. It has a dielectric constant of 3.65, 3.51, 3.49, and 3.48 at 1GHz, 2GHz, 5GHz, and 10GHz respectively. Also, it has a dissipation factor of 0.0015, 0.0020, 0.0025, and 0.0030 at 1GHz, 2GHz, 5GHz, and 10GHz respectively. Both values (dielectric constant and dissipation value) are low, which makes them suitable and reliable in different applications.
Other physical properties of the Doosan Low loss DS-7409DV aside from the ones mentioned above. These include the water absorption and flammability. This PCB material has a flammability rating of V-0. This means that burning has to stop in 10 seconds. Also, its water absorption is at 0.13% at D-24/23, while its value is 0.2% at D-2/100. Water absorption is the quantity of water that the material absorbs.
What are the Benefits of Doosan Low Loss DS-7409DV?
Doosan Low loss DS-7409DV is an ideal PCB material that comes with a lot of benefits. Also, this PCB material provides a lasting solution to thermal problems in PCB fabrication.
Doosan Low loss DS-7409DV is a PCB material that is free of halogen components. Therefore, this material is a great choice for PCB manufacturing. Also, it is very safe for the environment.
This PCB material adheres to some standards in the PCB industry. For instance, Doosan Low loss DS-7409DV meets the specifications of UL94 V-0 flammability.
High thermal reliability
One of the benefits of Doosan Low loss DS-7409DV is its high thermal reliability. This material features properties that contribute to its thermal reliability.
We hope you have a good understanding of what the Doosan Low loss DS-7409DV is and what it offers. To remind you, it is an ideal choice for different applications. Therefore, this article has discussed important information about this material. Also, it explained how this material adds value to the PCB industry.