In the realm of electronics and semiconductor manufacturing, the choice of substrate material plays a pivotal role in determining the performance, reliability, and cost-effectiveness of the final product. Two prominent types of substrates used in various applications are organic core substrates and glass core substrates. Each type has its unique set of properties, advantages, and limitations, making them suitable for different applications. This article delves into a comprehensive comparison between organic core and glass core substrates based on the provided data, covering aspects such as core thickness, via drill size, thermal conductivity, dielectric constant, material composition, cost, applications, electrical properties, thickness uniformity, mechanical strength, and raw material suppliers.

Core Thickness

Organic Core Substrate:

• Range: ~30μm to 200μm
• Characteristics: Organic core substrates typically have a thinner core compared to glass core substrates. This thinness allows for greater flexibility and lighter weight, which is advantageous in applications where space and weight are critical factors.

Glass Core Substrate:

• Range: ~200μm to 1100μm
• Characteristics: Glass core substrates are generally thicker, providing better mechanical stability and rigidity. This makes them suitable for applications requiring high precision and durability, such as in IC packaging and high-frequency RF applications.

Via Drill Size

Organic Core Substrate:

• Minimum Size: ~50μm
• Via Type: TSV (Through-Silicon Via), Mechanical Drill
• Characteristics: The larger via drill size in organic core substrates facilitates easier manufacturing processes and is cost-effective. However, it may limit the density of interconnections, which can be a drawback in high-density applications.

Glass Core Substrate:

• Minimum Size: ~5μm to 15μm
• Via Type: TGV (Through-Glass Via), Laser Drilled
• Characteristics: The significantly smaller via drill size in glass core substrates allows for higher interconnection density, which is crucial for advanced packaging and high-frequency applications. The precision of laser drilling also ensures high-quality vias with minimal defects.

Thermal Conductivity

Organic Core Substrate:

• Range: ~0.8-1.4 W/m-K (Low)
• Characteristics: Organic materials generally have lower thermal conductivity, which can lead to heat buildup in high-power applications. This necessitates additional thermal management solutions, such as heat sinks or thermal vias.

Glass Core Substrate:

• Range: ~0.2-0.5 W/m-K (High)
• Characteristics: Glass core substrates exhibit higher thermal conductivity, making them more efficient at dissipating heat. This property is particularly beneficial in high-power and high-frequency applications where thermal management is critical.

Dielectric Constant

Organic Core Substrate:

• Value: ~3
• Characteristics: The dielectric constant of organic core substrates is relatively low, which is advantageous for high-speed signal transmission. Lower dielectric constants reduce signal loss and improve the overall performance of high-frequency circuits.

Glass Core Substrate:

• Value: ~2.5-3
• Characteristics: Glass core substrates also have a low dielectric constant, comparable to organic core substrates. This makes them suitable for high-frequency applications where signal integrity is paramount.

Material Composition

Organic Core Substrate:

• Materials: BT (Bismaleimide Triazine), epoxy resin, FR4
• Characteristics: Organic core substrates are composed of polymer-based materials, which are lightweight and flexible. These materials are cost-effective and widely available, making them a popular choice for traditional PCBs.

Glass Core Substrate:

• Materials: Borosilicate (SiO2)
• Characteristics: Glass core substrates are made from borosilicate glass, which offers excellent mechanical and thermal properties. However, the material is more expensive and less flexible compared to organic materials.

Cost

Organic Core Substrate:

• Cost: Low
• Characteristics: The use of polymer-based materials and simpler manufacturing processes contribute to the lower cost of organic core substrates. This makes them an economical choice for a wide range of applications, especially in consumer electronics.

Glass Core Substrate:

• Cost: High
• Characteristics: The higher cost of glass core substrates is attributed to the expensive raw materials and the complex manufacturing processes involved, such as laser drilling for vias. This makes them more suitable for high-end applications where performance is critical.

Applications

Organic Core Substrate:

• Applications: Traditional PCBs
• Characteristics: Organic core substrates are widely used in traditional printed circuit boards (PCBs) due to their cost-effectiveness and flexibility. They are suitable for a broad range of consumer electronics, including smartphones, laptops, and home appliances.

Glass Core Substrate:

• Applications: IC Packaging, High-Frequency RF Applications
• Characteristics: Glass core substrates are preferred in advanced packaging and high-frequency RF applications due to their superior thermal and electrical properties. They are commonly used in high-performance computing, telecommunications, and aerospace industries.

Electrical Properties

Organic Core Substrate:

• Properties: Excellent insulator
• Characteristics: Organic core substrates provide excellent electrical insulation, which is crucial for preventing short circuits and ensuring reliable performance in electronic devices.

Glass Core Substrate:

• Properties: Good insulator
• Characteristics: While glass core substrates also offer good electrical insulation, their primary advantage lies in their thermal and mechanical properties, which are more critical in high-performance applications.

Thickness Uniformity

Organic Core Substrate:

• Uniformity: Variation depending on the polymer type
• Characteristics: The thickness uniformity of organic core substrates can vary based on the type of polymer used. This variability can affect the consistency of the substrate’s performance, especially in high-precision applications.

Glass Core Substrate:

• Uniformity: High precision
• Characteristics: Glass core substrates exhibit high precision in thickness uniformity, which is essential for applications requiring consistent performance and reliability, such as in IC packaging.

Mechanical Strength

Organic Core Substrate:

• Strength: Flexible
• Characteristics: The flexibility of organic core substrates makes them suitable for applications where the substrate may be subjected to bending or flexing, such as in flexible electronics.

Glass Core Substrate:

• Strength: Fragile
• Characteristics: Glass core substrates are more rigid and fragile compared to organic core substrates. While this fragility can be a limitation in some applications, it provides the necessary mechanical stability for high-precision applications.

Raw Material Suppliers

Organic Core Substrate:

• Suppliers: ISOLA, Kyocera
• Characteristics: The raw materials for organic core substrates are supplied by a wide range of global players, ensuring a steady supply chain and competitive pricing.

Glass Core Substrate:

• Suppliers: COVIA, US SILICA, EVONIK
• Characteristics: The raw materials for glass core substrates are supplied by a limited number of specialized manufacturers, which can impact the availability and cost of these substrates.

Substrate Manufacturers

Organic Core Substrate:

• Manufacturers: TTM, Unimicron (Many global players)
• Characteristics: The manufacturing of organic core substrates is carried out by numerous global players, leading to a competitive market and a wide range of options for consumers.

Glass Core Substrate:

• Manufacturers: CORNING, AGC, NsG Group (Few only)
• Characteristics: The manufacturing of glass core substrates is dominated by a few specialized companies, which can limit the availability and increase the cost of these substrates.

Conclusion

In summary, the choice between organic core and glass core substrates depends on the specific requirements of the application. Organic core substrates offer cost-effectiveness, flexibility, and excellent electrical insulation, making them suitable for traditional PCBs and consumer electronics. On the other hand, glass core substrates provide superior thermal conductivity, high precision, and mechanical stability, making them ideal for advanced packaging and high-frequency RF applications. Understanding the distinct properties and advantages of each substrate type is crucial for selecting the appropriate material to meet the performance and reliability needs of the intended application.