Skip to content

What are the common problems with PCB and PCBA?


Printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) are at the heart of electronics, providing the platform to mount and interconnect components. However, many potential defects can occur with PCB fabrication and PCBA assembly if processes are not optimized and controlled.

This article examines the most frequent problems that arise with PCBs and PCBA production, including root causes and steps to detect and prevent issues from impacting quality and reliability. Understanding common failure modes enables proactive process improvements.

PCB Fabrication Defects

Best way to solve the PCBA process problems
Best way to solve the PCBA process problems

PCB fabrication involves many steps including design, materials processing, photolithography, plating, etching, lamination, drilling, routing, finishing, and testing. Errors can be introduced at any stage:

Design Errors

  • Netlist mismatches
  • Undefined pin-pairs
  • Incorrect stackup configuration
  • Excessive unrouted nets
  • Violating design rules

Thorough design rule checking and manufacturing reviews of the layout and documentation prevents converting flawed designs into PCBs.

Material Defects

  • Glass weave fuzz balls
  • Resin voids
  • Copper nodules
  • Contamination from fiberglass strands

Incoming materials inspection and statistical process control tracking can isolate problematic materials batches.

Registration Errors

  • Layer-to-layer misalignment
  • Soldermask to pad misregistration
  • Silkscreen legend shifting

Fiducial mark inspection and optical registration measurement validates alignment at each process stage.

Etching Defects

  • Undercut traces from over-etching
  • Copper thinning from over-exposure
  • Open circuits from splashes and pitting
  • Partial copper due to mask damage

Optical inspection and test coupon characterization provide etch process control.

Plating Flaws

  • Insufficient hole wall copper
  • Voids within plated layers
  • Unfilled internal plane connect holes
  • Nodules or dendrites in plating tanks

Coupon analysis and test panel examination give plating process feedback.

Drilling Issues

  • Hole tolerance deviations
  • Burrs, nicks, and rough walls
  • Smear shorting holes to pads
  • Drill breakage damaging layers

Automated optical inspection (AOI) and hole wall microscopy checks ensure drill quality.

Lamination Problems

Microsectioning and x-ray imaging validates lamination quality.

PCBA Assembly Defects

Soldering defects
Soldering defects

Populating a PCB involves soldering, adhesive application, cleaning, inspection, and testing steps. Many potential assembly process flaws can affect PCBA quality:

Soldering Defects

  • Insufficient or excess solder
  • Solder balls/spikes
  • Solder bridging
  • Cold/disturbed joints
  • Pad lifting or tombstoning
  • Component miss-orientation
  • Incorrect or missing parts

Automated optical inspection (AOI) of every board validates assembly integrity against the bill of materials (BOM) and component placement (XYR).

Adhesive Flaws

  • Insufficient adhesive
  • Overflow or icicles
  • Component tilt or slide
  • Voids under components
  • Cracked or brittle adhesive

Process monitoring and inspection verifies proper adhesive dispensing, coverage, and curing.

Cleaning Issues

  • Residual flux or splatter
  • Pad corrosion from cleaning solutions
  • Component damage from harsh chemicals
  • Moisture ingress without drying

Cleanliness testing by ionic contamination measurement ensures post-solder residues are sufficiently removed.

Board Damage

  • Pad lifting during depanelization
  • Flex cracks from handling
  • Scratched traces or solder mask
  • Broken components or leads

Proper depanelization fixture design and operator training protects board integrity through assembly steps.

Application Errors

  • Miscalibrated sensors
  • Software bugs
  • Incorrect component values
  • Faulty circuit designs

Thorough electrical testing under operational profiles and environmental stress screening verifies proper PCBA functionality.

Root Cause Analysis

pcb Failure Analysis

When defects occur, structured root cause analysis is key to identify corrective actions:

  • Review all process data for abnormalities around the failure timeframe.
  • Characterize the defect morphology and mechanism.
  • Correlate observations to process interactions that could induce the defect.
  • Identify potential capability gaps or variability risks.
  • Determine if process adjustments, training improvements, or other interventions could reduce the specific defect mode likelihood going forward.

Effective root cause analysis drives process maturity while optimizing quality and reliability.

Mitigation Strategies

Here are approaches to detect and minimize some of the most common PCB and PCBA defect types:

Design Validation

  • Formal design reviews against fabrication capabilities and assembly requirements.
  • Testability analysis for access and diagnostics.
  • Design rule checking automation.
  • Prototype test runs to validate performance.

Incoming Material Controls

  • Material certification requirements for suppliers
  • Sampling and testing procedures
  • Process monitoring for storage conditions
  • Statistical tracking of defect rates

Process Control Standards

  • Define process requirements and tolerances
  • Create control plans for critical parameters
  • Validate capabilities and stability
  • Employ mistake-proofing systems
  • Automate process data logging

Inspection and Testing

  • Optical automated inspection of PCBs and PCBA
  • Ionic contamination testing for cleanliness
  • Functional testing of every board
  • Burn-in stress testing on samples
  • Failure analysis when defects occur

Training and Documentation

  • Certification training for inspectors and operators
  • Visual work instructions for each process
  • Flowcharts and control plan documentation
  • Change management procedures

Continuous Improvement Culture

  • Root cause analysis for defects
  • Lean manufacturing principles
  • Idea solicitation system
  • Standardized corrective actions
  • Process audits

This framework of aligned quality practices minimizes common PCB and PCBA defects to maximize manufacturing yields.

Defect Prevention Guidelines

Soldering Defects

Here are some key guidelines for avoiding frequent PCB and PCBA problems:

  • Start with design validation – Don’t build in quality risks
  • Validate incoming materials – Avoid latent defects
  • Measure process capability and stability – Know your limits
  • Inspect end product quality – Detect issues early
  • Perform electrical testing – Ensure functionality
  • Monitor defect rates – Identify negative trends
  • Do root cause analysis – Address systemic gaps
  • Standardize processes – Reduce variability
  • Automate when possible – Take human error out
  • Implement controls and mistake-proofing – Make it foolproof
  • Certify and train everyone – Build in quality at each step

Building a culture focused on defect prevention brings tremendous quality and cost advantages.


Avoiding common PCB and PCBA defects requires knowledge of potential failure modes, rigorous process control standards, extensive inspection regimes, robust corrective systems, and a commitment to continuous defect reduction.

By leveraging quality management discipline along with statistical process monitoring, automated inspection, mistake-proofing devices, and other best practices, organizations can maximize yields. This reduces costs while ensuring customers receive reliable electronic hardware.

Understanding the most frequent problems, their root causes, and effective mitigation strategies empowers teams to avoid PCB and PCBA defects proactively. That knowledge helps electrical engineers work closely with fabrication and assembly partners to prevent quality issues and implement impactful process improvements.


What are some typical PCB fabrication defects and their causes?

Common PCB defects include opens/shorts from etch issues, registration errors like layer shifts, plating voids, material impurities, drill smearing, and others caused by process variability and capabilities.

What are common PCBA assembly defects?

Typical PCBA defects are soldering flaws like shorts, voids, bridging and tombstoning, improper component placement, board damage, adhesive issues, inadequate cleaning, and functional failures from design or component problems.

How can organizations avoid common PCB and PCBA defects?

Strategies include design validation, material qualification, process control standards, automated inspection, functional testing, continuous improvement culture, worker training, and root cause analysis to address systemic weaknesses.

What are some key process control and monitoring methods to reduce defects?

Critical process controls include defined requirements, stability monitoring, Statistical Process Control (SPC), capability validation, mistake-proofing, standardized work, inspection, corrective systems, audits, and a focus on continuous defect reduction.

Why is root cause analysis important for PCB and PCBA defects?

Root cause analysis identifies systemic process gaps or weaknesses so that permanent corrective actions can be implemented, reducing future defect likelihood and preventing wasted effort on temporary containment fixes.




                Get Fast Quote Now