Thermal conduct Al-Substrate CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdowm Voltage, reliability, Thermal Conductivity is about five~ ten times higher than the FR-4 , PCB produced by the substrate can transfer heat , which is electrionic components generate , throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Al-Substrate CCL is a sandwich structure, which includes layers of conductor ,insulator and metal base. In genaral, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification. Huazheng new material has a strong R&D strength, which continued to develop avariety of high Thermal Conductivity products. Thermal conductivity 1.0～3.0 W/ M·K，It can fit the demand of high end and mid-range products，with high cost performance. All products pass RoHS standard, have good property andmeet low-carbon environmental trend.
Excellent thermal conductivity
Excellent Breakdowm Voltage
Excellent solder heat endurance
Excellent mechanical properties
Excellent electromagnetic shielding
Can use external cooling device directly
High cost performance
Single Al-Substrate CCL offers various kinds ouf combination of base metal,copper foil,and dielectric layers to meet the general requirement of single layer thermal conductive printed circuit board
Double Al-Substrate CCL is good for general requirement ouf multilayer or thineer shape printed
circuit board. ACCL is a sandwich structure, which includes layers of copper foil, thermal conductive
dielectric layer, and lower copper foil
Circuit Layer – Electrolysis copper foil
Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance.
two types: Fiberglass support & non-fiberglass support.
Aluminum SubstrateIt –supports the entire structure and conducts the heat.
The material is aluminum alloy plate.
LED lighting、Public lighting、Backlight module、outdoor LED display
Automotive (Vehiche lighting、regulator、converters、Power module)
Industrial electronics （DC-DC converter、Power supplies、Solid-State Relays
The area needs high heat dissipation
General purpose. It is used widely in consumer lighting、outdoor LED display and backlight applications
Standard thermal conductivity. It is used in public lighting、Digital、PC、Audio、Automotive applications
High thermal conductivity. It is used in high power LED lighting、Automotive applications、Industrial
High thermal conductivity、Low thermal resistance. It is used in high power applications
*Note：Thermal resistance samples use Aluminum SubstrateIt with 1mm aluminium alloy
plate ,35um copper foil and 75um insulating layer, Using laser (E1461) test method and calculate the result.
According to CPCA4105-2010《 Printed Circuit Metal Base Copper-Clad Laminate 》, the Al-Substrate CCL thermal resistance and its insulating layer thermal conductivity have the relation .
- Dielectric Breakdown Voltage
HA50 product has excellent dielectric Breakdown Voltage even after solder dippling
Dielectric Breakdown Voltage test value refers to the value of Al-Substrate CCL， and not
Al-Substrate PCB test value. Because of design and the air facor, the Al-Substrate PCB test value will
be lower than the value of substrate.
- Peeling Strength
HA50 product has excellent Peeling Strength even after solder dippling
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