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A Beginner’s Guide to DSBGA (Die-Size Ball Grid Array)

It is just another name for wafer-level chip scale packaging. Now don’t let the name of this process fool you. It’s not that hard to learn about. After reading this post, you will have sufficient knowledge about DSBGA so that you can educate others about it as well. 

 So let’s get this straight. DSBGA is different from other forms of packaging because you do not separate it from the wafer at all. There is a fine layer of copper that combines the silicon connections and solder material. You keep the die of silicon smaller, which sets it apart from other types of packaging. 

To name one of its crucial applications, it will be using it when you do not have enough space. It is useful when you are considering miniaturization. It normally happens when you are producing mobile phones and smart wearables like health and fitness devices and trackers. 


So this flip chip method is not a new one. Instead, it has been involved in common applications for many years. Formerly, producers would use it for the process of miniaturization.

 The archaic producers would always rely on smaller dies and would also reduce the number of connections of the semiconductors. The process included bumps made from metal alloys that offered strong bonding with the substrate. 

The SMT just enhanced the results given out by this process. As time passed, industry leaders and decision-makers gathered to educate the semiconductor sector to keep up with the latest technologies and new trends.

 So that they could be able to invent new solutions that have the potential to solve the problems of semiconductor production, since this was the key focus area of the stakeholders, it gave birth to a new technique that was useable for every producer. 

The evolution in miniaturization ended in keeping the die size equal to the package itself. Consider DSBGA as an alignment of metal balls that are beneath the package. On the other hand, you place the die with the substrate. 

Now it will allow smooth redistribution of the connections of the die with the pads. It is what we need to focus on and make sure it happens as well. You can use a substrate of any shape since there is no thumb rule for it. 

Today, producers follow the standard of keeping the substrate and die sizes the same during the process. It is because it keeps the chances of failure and error near to none. Plus, it promises positive results for the final products at the same time. 

Applications of DSBGA (Die-Size Ball Grid Array)

BGA Reballing

The fields of telecommunication and media cannot survive without semiconductors, and we all know it. People now love portable devices that do not feel bulky in their hands. Such devices offer more dependability and are exceptional in their performance as well. 

Modern users are now expecting smaller variations of these devices. Since nobody likes to carry heavy and clumsy gadgets, this is something that producers need to scratch their heads for. 

Semiconductors have always proved to be beneficial in reducing the sizes of smart devices. Not only this, they maintain the quality and performance of portable devices as well. Thus, they support miniaturization and help you invent the most cherishable marvels of all time!

It seems like we are just praising the semiconductors here; let’s quickly hop on to the actual discussion – the applications of semiconductors that are too common. You might not have considered them before reading this post!

  • Highly important for producing portable MP3 players 
  • Different types of memory cards need DSBGA elements for proper working
  • Some common types of digital cameras use DSBGA as well
  • Man-portable video games and gaming consoles all use DSBGA 

You must be surprised to know that different producers are now considering miniaturization for wireless headsets and many other bulky devices to meet the expectations of consumers. They are devising solutions to make this possible. 

For this, DSBGA seems to be a multipurpose asset on all counts. Array packaging is another method that is interesting to know about. You do not need to worry about any type of lead frame for this packaging. 

Just use the same die for the flip-chip method, and you are good to go. It helps with more electrical density, which eventually boosts the electrical performance of the devices. Now you see how one small component can deliver you great results. 

It’s time that we discuss the do’s and don’ts of DSBGA in detail! So let’s not keep you waiting! 

Assembly Process of DSBGA (Die-Size Ball Grid Array)


Die size (DSBGA) array packaging is undoubtedly a fruitful method that supports the production of many devices. 

Besides, the flip-chip method has also been successful in transforming less efficient devices into something that consumers can avail of in the longer run. Remember the DSBGA uses uncovered dies? 

So when you are using this type of die, there is a sure impact on the process as well. It means you need to be extra careful and concerned when using uncased dies.

 In this section, we are going to crack this code for you so that you won’t mess up anything when working with such a die. Ready to dive in? Let’s start with it!

  • Never proceed with the process without encapsulating the uncased die because it can cause damage in the form of cracks.
  • Ignoring encapsulation can also disturb the silicon’s expansion ability along with laminations and solder connections, which can complicate the process, thus lowering the success rate as well.
  • If you go for miniaturizing the die in the first place, it can save you from the aforementioned risks to a large extent.
  • Or else, you can rely on a special type of wire bonding called face-down wire bonding that is useful for packing silicone.
  • The best part about face-down wire bonding is that it regulates the performance and keeps it improving from time to time. 
  • The method is viable for reducing the package size as much as possible.
  • One thing that you need to take care of is that a license is important when you are performing this method. 

The End Note

The world will witness extreme miniaturization of smart devices and futuristic machinery in the forthcoming years. Owing to this fact, the producers would need to come together to reduce the size of silicon semiconductors even more than before.

It will make a pathway for the producers to enhance the circuit densities and maintain the quality at the same time. Hopefully, you have learned the importance of miniaturization through DSBGA from this post! We will see you in the next one, till then don’t let your fascination with the latest technology trends rest at all! 




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