1. Product Specifications
Technical Specifications – XQVR300-3CB228Q
| Parameter | Specification |
|---|---|
| Part Number | XQVR300-3CB228Q |
| Manufacturer | Xilinx (now AMD) |
| Product Family | QPro Virtex 2.5V Radiation-Hardened FPGAs |
| Logic Capacity | 322,970 system gates |
| Logic Cells | 6,912 configurable logic cells |
| Process Technology | 0.22ฮผm CMOS, 5-layer metal |
| Core Voltage (VCCINT) | 2.5V ยฑ5% |
| I/O Voltage (VCCO) | 1.2V to 3.6V |
| Package Type | 228-Pin CQFP (Ceramic Quad Flat Pack) |
| Speed Grade | -3 (Commercial grade timing) |
| Operating Temperature | -55ยฐC to +125ยฐC (TC) |
| Storage Temperature | -65ยฐC to +150ยฐC |
| Qualification Level | QPro QML Class Q |
| Radiation Hardness | Enhanced TID and SEU tolerance |
Performance Characteristics
| Feature | Value |
|---|---|
| Maximum Operating Frequency | Up to 250 MHz (application dependent) |
| Input/Output Pins | Up to 196 user I/O pins |
| Block RAM | Dedicated memory blocks |
| Global Clock Networks | 4 global clock buffers |
| Power Consumption | Optimized for low-power operation |
| Configuration Memory | SRAM-based, reprogrammable |
Package Details
- Package Designation: CB228 (Ceramic Ball Grid Array compatible)
- Pin Count: 228 pins
- Lead Finish: Gold-plated for superior conductivity
- Moisture Sensitivity Level: MSL 1 (floor life unlimited)
- Package Dimensions: Standard CQFP footprint
- Thermal Characteristics: Enhanced thermal performance
2. Pricing Information
Market Pricing – XQVR300-3CB228Q
Current Market Analysis (July 2025)
| Quantity | Unit Price Range | Lead Time |
|---|---|---|
| 1-9 pieces | $2,800 – $3,200 | 12-16 weeks |
| 10-24 pieces | $2,600 – $2,900 | 10-14 weeks |
| 25-99 pieces | $2,400 – $2,700 | 8-12 weeks |
| 100+ pieces | Contact for pricing | 6-10 weeks |
Pricing Notes:
- Prices subject to change without notice
- Volume discounts available for quantities over 100 units
- Long-term supply agreements available
- Extended lead times due to specialized manufacturing requirements
- Price includes full military screening and qualification testing
Cost Factors:
- Military-grade qualification and testing
- Radiation-hardened design complexity
- Limited production volumes
- Specialized packaging requirements
- Quality assurance and traceability
3. Documents & Media
Technical Documentation
Primary Documents:
- Datasheet: QPro Virtex 2.5V QML High-Reliability FPGAs (DS002)
- User Guide: Virtex 2.5V Field Programmable Gate Arrays
- Application Notes: Radiation Effects and Mitigation Techniques
- Package Information: 228-Pin CQFP Package Specifications
Design Resources:
- Pinout Diagrams: Complete pin assignment tables
- Reference Designs: Example implementations and best practices
- IBIS Models: Signal integrity simulation models
- Timing Reports: Speed grade characterization data
Software Tools:
- Vivado Design Suite: Latest design software compatibility
- ISE Design Suite: Legacy tool support
- ChipScope Pro: Embedded logic analyzer
- FPGA Editor: Low-level design editing capabilities
Quality Documentation:
- Certificate of Compliance: QML qualification documentation
- Test Reports: Electrical and environmental test results
- Screening Reports: Military-standard screening procedures
- Reliability Data: MTBF and failure rate analysis
Media Resources
Visual Assets:
- High-resolution product images
- Package outline drawings
- Pin configuration diagrams
- Application block diagrams
Video Content:
- Product overview presentations
- Design methodology tutorials
- Application-specific demonstrations
- Quality and reliability presentations
4. Related Resources
Development Ecosystem
Development Boards:
- QPro Virtex evaluation platforms
- Custom prototyping boards
- Reference design implementations
- Third-party development solutions
IP Cores and Libraries:
- Certified IP core catalog
- Signal processing libraries
- Communication protocol stacks
- Security and encryption modules
Design Services:
- Application engineering support
- Custom design services
- Design review and optimization
- Training and technical workshops
Application Areas
Aerospace Applications:
- Satellite communication systems
- Navigation and guidance systems
- Payload data processing
- Spacecraft control systems
Defense Applications:
- Radar signal processing
- Electronic warfare systems
- Secure communications
- Command and control systems
High-Reliability Applications:
- Nuclear power plant instrumentation
- Medical imaging systems
- Industrial process control
- Transportation safety systems
Competitive Alternatives
Similar Products:
- XQVR300-4CB228Q (Speed grade -4 variant)
- XQVR600-3CB228Q (Higher gate count option)
- XQVR300-3BG432Q (BGA package alternative)
Cross-Reference Options:
- Microsemi RT ProASIC3 family
- Lattice RadiationTolerant FPGAs
- Actel RTAX family devices
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- RoHS 2011/65/EU compliant
- Lead-free package options available
- Halogen-free variants upon request
- Environmental product declarations available
REACH Regulation:
- Substance of Very High Concern (SVHC) monitoring
- Material composition documentation
- Supply chain transparency
- Compliance with European chemical regulations
Conflict Minerals:
- DRC conflict minerals compliance
- Responsible sourcing verification
- Annual conflict minerals report
- Supply chain due diligence
Export Control Classifications
Export Administration Regulations (EAR):
- ECCN: 3A001.a.2.c (Electronics – Integrated Circuits)
- Classification: Dual-use technology
- License Requirements: May require export license depending on destination
- Export Control: Subject to U.S. export control regulations
International Traffic in Arms Regulations (ITAR):
- Potential ITAR applicability for defense applications
- End-use and end-user restrictions apply
- Technical data transfer limitations
- Re-export control requirements
Import/Export Documentation:
- Certificate of Origin provided
- Harmonized Tariff Schedule (HTS) classification
- Commercial Invoice requirements
- Shipping documentation compliance
Quality and Reliability Standards
Military Standards Compliance:
- MIL-PRF-38535: Microcircuits, General Specification
- MIL-STD-883: Test Methods for Semiconductor Devices
- MIL-STD-1547: Electronic Parts, Materials, and Processes
- AS/EN/JISQ 9100: Aerospace Quality Management
Reliability Testing:
- High-Temperature Operating Life (HTOL)
- Temperature Cycling Test (TCT)
- Mechanical Shock and Vibration
- Electrostatic Discharge (ESD) testing
Traceability:
- Full lot traceability maintained
- Serialization and marking requirements
- Chain of custody documentation
- Configuration control procedures
Packaging and Shipping
Anti-Static Packaging:
- ESD-safe packaging materials
- Moisture barrier bags with desiccant
- Anti-static foam inserts
- Proper ESD warning labels
Environmental Packaging:
- Temperature and humidity monitoring
- Shock and vibration protection
- International shipping compliance
- Customs documentation support
Contact Information
For technical support, pricing inquiries, or application assistance regarding the XQVR300-3CB228Q, please contact:
- Technical Support: Available through authorized distributors
- Sales Inquiries: Request quote through official channels
- Application Engineering: Design consultation services available
- Documentation: Additional resources available upon request
The XQVR300-3CB228Q represents the pinnacle of radiation-hardened FPGA technology, delivering uncompromising performance and reliability for the most demanding applications in aerospace, defense, and high-reliability industries.
