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XQVR600-1CB228M: Radiation-Hardened FPGA for Space Applications

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • System Gates: Approximately 600,000 system gates
  • Logic Cells: High-density programmable logic resources
  • Process Technology: 0.22 ยตm 5-layer epitaxial CMOS process
  • Operating Voltage: 2.5V core voltage
  • Package Type: 228-pin Ceramic Quad Flat Pack (CQFP)
  • Temperature Range: Military grade (-55ยฐC to +125ยฐC)

Radiation Hardening Features

  • Total Ionizing Dose (TID): Guaranteed to 100K Rad(Si)
  • Single Event Latch-up (SEL): Immune to LET = 125 MeVยทcmยฒ/mg
  • Single Event Upset (SEU): Immunity achievable with recommended redundancy implementation
  • QML Certified: Qualified Manufacturers List compliant for space applications

Performance Characteristics

  • System Performance: Up to 200 MHz operation
  • Architecture: Flexible design balancing speed and density
  • Arithmetic Support: Dedicated carry logic for high-speed arithmetic operations
  • Multiplier Support: Dedicated multiplier resources
  • Memory Features: Internal distributed RAM and block RAM
  • I/O Standards: Multiple SelectIOโ„ข standards support

Design Features

  • Configurable Logic Blocks (CLBs) with versatile functionality
  • Cascade chains for wide-input functions
  • Abundant registers/latches with clock enable
  • Dual synchronous/asynchronous set and reset capabilities
  • Internal 3-state bussing
  • IEEE 1149.1 boundary-scan logic support
  • Die-temperature sensing device

2. Price

Pricing Information:

  • Contact authorized distributors for current pricing
  • Pricing varies based on order quantity and delivery requirements
  • Historical reference pricing: Premium space-grade component with pricing typically in thousands of dollars per unit
  • Bulk order discounts available for qualified customers

Note: Pricing is subject to change and requires direct quote from authorized Xilinx/AMD distributors or sales representatives.

3. Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and mechanical specifications
  • User Guide: Programming and implementation guidelines
  • Application Notes: Design methodologies and best practices
  • Radiation Test Reports: Comprehensive radiation characterization data
  • Package Information: Mechanical drawings and thermal specifications

Design Support Files

  • Pinout Information: Complete pin assignment and functionality
  • Package Models: IBIS models for signal integrity analysis
  • Thermal Models: Package thermal characteristics
  • FPGA Configuration Files: Programming bitstream examples

Software Tools

  • Xilinx ISE Design Suite: Legacy development environment support
  • Vivado Design Suite: Modern design tools compatibility
  • FPGA Foundation Series: Basic design tools

4. Related Resources

Development Support

  • Application Engineering: Xilinx field application engineers
  • Design Services: Third-party design service partners
  • Training Programs: FPGA design methodology courses
  • Technical Forums: Community support and knowledge sharing

Complementary Products

  • Configuration Devices: XCF series PROM devices
  • Development Boards: Evaluation and prototyping platforms
  • IP Cores: Pre-verified intellectual property blocks
  • Reference Designs: Proven design examples and templates

Industry Partners

  • EDA Tool Vendors: Third-party design tool compatibility
  • IP Providers: Specialized IP core suppliers
  • System Integrators: Complete solution providers
  • Test Equipment: Radiation testing and validation services

Standards Compliance

  • QML-V (Qualified Manufacturers List): Space-grade qualification
  • MIL-STD-883: Military standard testing methods
  • ESCC (European Space Components Coordination): European space standards
  • NASA Guidelines: Space flight hardware requirements

5. Environmental & Export Classifications

Environmental Specifications

  • Operating Temperature: -55ยฐC to +125ยฐC (military grade)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: MIL-STD-202 Method 103 compliant
  • Vibration: MIL-STD-202 Method 204 compliant
  • Shock: MIL-STD-202 Method 213 compliant
  • Thermal Cycling: MIL-STD-202 Method 107 compliant

Radiation Environment

  • Total Ionizing Dose: 100 Krad(Si) guaranteed
  • Single Event Effects: Comprehensive characterization available
  • Neutron Displacement Damage: Test data available
  • Heavy Ion Testing: LET threshold data documented

Export Control Classifications

  • ECCN (Export Control Classification Number): Contact manufacturer for current classification
  • ITAR (International Traffic in Arms Regulations): May be subject to ITAR restrictions
  • EAR (Export Administration Regulations): Subject to US export control regulations
  • Country of Origin: United States

Quality Standards

  • QML-V Qualification: Fully qualified for space flight applications
  • Class V Screening: Enhanced screening and testing procedures
  • Traceability: Complete manufacturing and test traceability
  • Lot Acceptance: Statistical quality control methods

Packaging & Handling

  • ESD Sensitivity: Class 1 (per JEDEC JS-001)
  • Moisture Sensitivity: Level 1 (per JEDEC J-STD-020)
  • Lead-Free: RoHS compliant packaging available
  • Marking: Permanent laser marking for traceability

The XQVR600-1CB228M represents proven space heritage technology with extensive flight history. This radiation-hardened FPGA provides the reliability and performance required for mission-critical space applications while offering the flexibility of reconfigurable logic for evolving mission requirements.