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XCR22LV10-10VO24C – 3V Zero Power TotalCMOS Universal PLD Device

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Features

The XCR22LV10-10VO24C incorporates advanced specifications that make it ideal for power-sensitive applications:

Logic Architecture:

  • 220 Gates total capacity
  • 10 Macro Cells for flexible logic implementation
  • 10 Registers for sequential logic functions
  • 22 User I/Os for maximum connectivity
  • 3.3V Supply Voltage for low-power operation
  • Speed Grade 10 for high-performance applications

Package Details:

  • 24-pin SOIC (Small Outline Integrated Circuit)
  • Compact form factor utilizing 93% less board space compared to 28-pin PLCC
  • Surface mount technology for automated assembly

Technical Specifications:

  • EECMOS Process Technology for enhanced reliability
  • AND/OR Logic Array Structure for direct sum-of-products implementation
  • Programmable polarity eliminating need for external inverters
  • Pin-to-pin delay: 7.5ns typical
  • Static current: <75ยตA
  • 1000+ Program/Erase cycles guaranteed
  • 100% testable architecture

Advanced Features

The XCR22LV10-10VO24C utilizes Xilinx’s proprietary Fast Zero Power (FZP) design technique, replacing conventional sense amplifier methods with cascaded pure CMOS gates. This innovation delivers the industry’s first true zero-power SPLD without requiring power-down schemes or turbo bits.

2. Price

Competitive Pricing for XCR22LV10-10VO24C:

The XCR22LV10-10VO24C offers exceptional value for programmable logic applications. Pricing varies based on:

  • Quantity ordered (volume discounts available)
  • Lead time requirements
  • Distributor selection
  • Market conditions

For current XCR22LV10-10VO24C pricing and availability:

  • Request quotes from authorized distributors
  • Check real-time inventory systems
  • Compare prices across multiple suppliers
  • Consider long-term supply agreements for volume orders

Note: The XCR22LV10-10VO24C price fluctuates based on market demand and component availability. Contact suppliers directly for most current pricing.

3. Documents & Media

Essential Documentation for XCR22LV10-10VO24C:

Technical Resources:

  • XCR22LV10-10VO24C Datasheet (PDF format)
  • Product Specification Sheet with detailed electrical characteristics
  • Application Notes for design implementation
  • Programming Guidelines for device configuration
  • Pin Configuration Diagrams and package drawings

Design Tools:

  • Xilinx ISE Design Suite compatibility
  • ABEL-HDL programming language support
  • PALASM design entry tools
  • CUPL (Compiler Universal for Programmable Logic)

Reference Materials:

  • XCR22LV10-10VO24C pinout diagrams
  • Timing specifications and AC characteristics
  • PCB layout recommendations
  • Soldering profiles for manufacturing

Software Downloads:

  • Device programmers and software
  • Simulation models for SPICE
  • Symbol libraries for CAD tools

4. Related Resources

Compatible Products and Alternatives:

XCR22 Family Variants:

  • XCR22LV10-10SO24I (Industrial temperature range)
  • XCR22LV10-10SO24C (Commercial temperature, SOIC package)
  • XCR22LV10-10PC28C (28-pin PLCC package option)
  • XCR22LV10-15VO24C (Speed grade 15 variant)

Development Tools:

  • Universal PLD Programmer for device programming
  • Evaluation boards for prototyping
  • Socket adapters for testing
  • Programming cables and interfaces

Application Areas for XCR22LV10-10VO24C:

  • Address decoding in memory systems
  • State machines for control logic
  • Glue logic replacement
  • Interface logic for system integration
  • Combinatorial and sequential logic implementation

Technical Support:

  • Application engineers for design assistance
  • Online forums and community support
  • Training materials and webinars
  • Design examples and reference designs

5. Environmental & Export Classifications

Compliance and Classifications for XCR22LV10-10VO24C:

Environmental Standards:

  • RoHS Compliant (Restriction of Hazardous Substances)
  • WEEE Directive compliance for electronic waste
  • Lead-free manufacturing process
  • Halogen-free materials where applicable

Operating Conditions:

  • Commercial temperature range: 0ยฐC to +70ยฐC
  • Storage temperature: -65ยฐC to +150ยฐC
  • Relative humidity: 10% to 85% non-condensing
  • ESD rating: Class 1 (>1000V HBM)

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.2
  • Schedule B Number: 8542.31.0001
  • Country of Origin: Varies by manufacturing location
  • REACH Regulation compliance (EU)

Quality Standards:

  • ISO 9001 certified manufacturing
  • Automotive qualification available for select variants
  • Military specifications (MIL-STD) compliance options
  • Industrial grade reliability testing

Safety Certifications:

  • UL recognition for safety standards
  • CE marking for European market
  • FCC compliance for electromagnetic compatibility
  • CSA certification for Canadian market

Packaging and Shipping:

  • Moisture sensitivity level: MSL 1
  • Anti-static packaging for ESD protection
  • Tape and reel availability for automated assembly
  • Standard pack quantities optimized for manufacturing

The XCR22LV10-10VO24C combines Xilinx’s proven TotalCMOS technology with innovative Fast Zero Power design, making it the ideal choice for applications requiring high performance, low power consumption, and reliable operation in a compact 24-pin SOIC package.